Abstract: A method for encapsulating a microelectronic device, arranged on a support substrate, with an encapsulation cover includes, inter alia, the following sequence of steps: a) providing a support substrate on which a microelectronic device is arranged, b) depositing a bonding layer on the first face of the substrate, around the microelectronic device, c) positioning an encapsulation cover on the bonding layer in such a way as to encapsulate the microelectronic device, d) thinning the second main face of the support substrate and the second main face of the encapsulation cover by chemical etching.

Abstract: Method for producing a positive electrode for a solid-state lithium microbattery comprising the following successive steps: supplying of a substrate made of ceramic, glass or silicon, locally covered with a metal layer, depositing of a cathodic layer made of a positive electrode material, for example made of mixed lithium oxide, the cathodic layer having a thickness greater than 1 ?m, a first portion of the cathodic layer covering the substrate and a second portion of the cathodic layer covering the metal layer, intended to form the positive electrode, carrying out of a heat treatment at a temperature greater than or equal to 400° C., on the cathodic layer, in such a way as to crystallise the second portion of the cathodic layer in order to form a positive electrode, and in such a way as to delaminate the first portion of the cathodic layer.

Abstract: A method for encapsulating a microelectronic device, arranged on a support substrate, with an encapsulation cover includes, inter alia, the following sequence of steps: a) providing a support substrate on which a microelectronic device is arranged, b) depositing a bonding layer on the first face of the substrate, around the microelectronic device, c) positioning an encapsulation cover on the bonding layer in such a way as to encapsulate the microelectronic device, d) thinning the second main face of the support substrate and the second main face of the encapsulation cover by chemical etching.

Abstract: Method of thinning and encapsulating a microelectronic component, including the following steps: supply of an elementary structure comprising a substrate with a thickness of more than 200 ?m, a microelectronic component and an adhesive layer; the adhesive layer being covered by a detachable protection layer, fix the detachable protection layer onto a manipulation structure 100, protection of the lateral face of the substrate, thinning of the substrate up to a thickness of less than 100 ?m, separation of the elementary structure from the manipulation structure, for example by separating the detachable protection layer from the adhesive layer. The method may comprise a later step during which an element comprising one or several other elementary structures is fixed onto the adhesive layer of the elementary structure, so as to form a vertical stack.

Abstract: A reusable assembly mould, to manufacture a three-dimensional device comprising several microelectronic components vertically stacked, comprising a main cavity, formed by a bottom and a side wall, and configured to receive at least two stacked elementary structures, each elementary structure comprising a brittle substrate covered with a microelectronic component and with electrical contacts, disposed on the edge of the substrate, the assembly mould being of a deformable material able to undergo a non-permanent deformation from 10 to 1000% relative to its initial shape, preferentially from 50 to 200% relative to its initial shape, the assembly mould further comprising a clearance positioned along the side wall of the main cavity to facilitate handling of the first elementary structure and/or of the second elementary structure and/or to inject an element along the main cavity.

Abstract: Process for encapsulation of a microelectronic device comprising the following steps in sequence: supply a support substrate comprising a first principal face on which a microelectronic device is placed, a second principal face, and a lateral face, deposit a bonding layer on the first principal face of the substrate, position an encapsulation cover comprising a first principal face, a second principal face, and a lateral face, on the bonding layer, deposit a lateral protection layer on: the lateral face and the periphery of the second principal face of the support substrate, the lateral face and the periphery of the second principal face of the encapsulation cover, the lateral protection layer delimiting a protected zone, thinning of the second principal face of the support substrate and/or the second principal face of the encapsulation cover outside the protected zone.

Abstract: Sealing cell for encapsulating a microelectronic component arranged on a substrate, with a cap, said sealing cell including: a bottom including a receiving zone for the substrate and a peripheral zone surrounding the receiving zone, a side wall formed of an internal face, an external face and an upper face, the upper face being configured to support the cap facing the receiving zone, an opening, arranged in the bottom of the cell, in the side wall, or in the cap, the opening being configured to be connected to a pumping system, in such a way as to be able to place under controlled atmosphere a cavity delimited by the side wall, the bottom and the cap.

Abstract: Encapsulated microbattery comprising a microbattery supported by a substrate, an encapsulation cover which comprises a first face in contact with the microbattery and the substrate, said first face comprising a central zone and a peripheral zone surrounding the central zone, the central zone being in contact with the microbattery and the peripheral zone being in contact with at least the substrate. The encapsulation cover comprises cavities in fluid communication with the central zone of the first face, the cavities being configured to collect at least one gaseous element generated by the microbattery during its operation.

Abstract: The invention relates to an electronic system comprising at least one device comprising a substrate (110) carrying at least one electronic component provided with at least one electrical connector (121, 122), with the system further comprising a support of said device, characterised in that the device comprises at least one passage (361, 362) according to a dimension in thickness of the device, said passage passing through the electrical connector (121, 122), and in that it comprises at least one electrically conductive pillar (471, 472) protruding on a first face of the support, with the electrically conductive pillar (471, 472) passing through the passage (361, 362) by being configured to be in electrical continuity with the electrical connector (121, 122) passed through by said passage.

Abstract: Method for producing a positive electrode for a solid-state lithium microbattery comprising the following successive steps: supplying of a substrate made of ceramic, glass or silicon, locally covered with a metal layer, depositing of a cathodic layer made of a positive electrode material, for example made of mixed lithium oxide, the cathodic layer having a thickness greater than 1 ?m, a first portion of the cathodic layer covering the substrate and a second portion of the cathodic layer covering the metal layer, intended to form the positive electrode, carrying out of a heat treatment at a temperature greater than or equal to 400° C., on the cathodic layer, in such a way as to crystallise the second portion of the cathodic layer in order to form a positive electrode, and in such a way as to delaminate the first portion of the cathodic layer.

Abstract: Process for encapsulation of a microelectronic device comprising the following steps in sequence: supply a support substrate comprising a first principal face on which a microelectronic device is placed, a second principal face, and a lateral face, deposit a bonding layer on the first principal face of the substrate, position an encapsulation cover comprising a first principal face, a second principal face, and a lateral face, on the bonding layer, deposit a lateral protection layer on: the lateral face and the periphery of the second principal face of the support substrate, the lateral face and the periphery of the second principal face of the encapsulation cover, the lateral protection layer delimiting a protected zone, thinning of the second principal face of the support substrate and/or the second principal face of the encapsulation cover outside the protected zone.

Abstract: A method for manufacturing an electronic device including a substrate, including assembling the substrate, by a joining zone of a first face of the substrate, with a joining zone of a first face of a carrier, and disjoining the substrate relatively to the carrier. After the step of assembling, the method includes formation of a film on the substrate, the film being configured to adhere to an adhesion zone of a second face of the substrate opposite the first face of the substrate, the adhesive force between the film and the adhesion zone of the second face of the substrate being chosen greater than the joining force between the joining zone of the carrier and the joining zone of the first face of the substrate. A traction on the film has a force of traction configured to overcome the joining force without overcoming the adhesive force.

Abstract: Method for reversible bonding between a first element and a second element, comprising the implementation of the following steps: a) producing at least one oxide layer on at least one first face of the first element or of the second element; b) joining the first face of the first element with the first face of the second element such that the oxide layer forms a bonding interface between the first element and the second element; c) disjoining the second element with regard to the first element by the application of a heat treatment under controlled humid atmosphere physically and/or chemically degrading the oxide layer.

Abstract: A method of vertically assembling encapsulated single microbatteries, wherein the vertical assembly contains, between the microbatteries, an electrical insulation and/or sealing layer and a metal layer, successively including: a step of stacking and attaching at least two single microbatteries, previously encapsulated, stacked on each other; and forming a metal layer, capable of ensuring the electrical coupling of each of the metal layers of each of the encapsulated single microbatteries.

Abstract: An electrochemical device, such as a microbattery or an electrochromic system, including at least one stack of active layers containing lithium, said stack being arranged on a substrate and being covered by an encapsulation layer. The encapsulation layer includes at least: a barrier film presenting at least one electrically insulating surface and including at least one layer hermetic to oxidising species, said adhesive film including a juxtaposition of electrically conducting adhesive strips and of electrically insulating adhesive strips, and an adhesive film, provided with a first surface and a second surface, the first surface being in contact with the electrically insulating surface of the barrier film and the second surface covering the stack of active layers and a part of the substrate.

Abstract: Sealing cell for encapsulating a microelectronic component arranged on a substrate, with a cap, said sealing cell including: a bottom including a receiving zone for the substrate and a peripheral zone surrounding the receiving zone, a side wall formed of an internal face, an external face and an upper face, the upper face being configured to support the cap facing the receiving zone, an opening, arranged in the bottom of the cell, in the side wall, or in the cap, the opening being configured to be connected to a pumping system, in such a way as to be able to place under controlled atmosphere a cavity delimited by the side wall, the bottom and the cap.

Abstract: Method for reversible bonding between a first element and a second element, comprising the implementation of the following steps: a) producing at least one oxide layer on at least one first face of the first element or of the second element; b) joining the first face of the first element with the first face of the second element such that the oxide layer forms a bonding interface between the first element and the second element; c) disjoining the second element with regard to the first element by the application of a heat treatment under controlled humid atmosphere physically and/or chemically degrading the oxide layer.

Abstract: This invention relates to a method for producing an electrical system comprising a support (1) bearing on a first face at least one device; with the device comprising at least one electronic component (2) provided with at least one electrical connector (21, 22), with the method comprising: a step of setting in place of a cover (6) positioned above the component; said cover (6) comprising at least one passage (61, 62) according to a dimension in thickness of the cover (6) in such a way as to form an access space to the at least one electrical connector (21, 22), a step of forming a sealing seam (71) in such a way that the component is encapsulated in a sealed cavity (9) delimited by the first face of the support (1), the first face of the cover (6) and the sealing seam (7).

Abstract: A method for the production of a battery includes at least production, against a substrate made of a material able to form an electrode, of at least one solid electrolyte layer, production of a first electrode in contact with the electrolyte, and thinning the substrate such that at least a remaining proportion of the substrate, in contact with the solid electrolyte layer, forms a second electrode.

Abstract: This invention relates to a method for producing an electrical system comprising a support (1) bearing on a first face at least one device: with the device comprising at least one electronic component (2) provided with at least one electrical connector (21, 22), with the method comprising: a step of setting in place of a cover (6) positioned above the component; said cover (6) comprising at least one passage (61, 62) according to a dimension in thickness of the cover (6) in such a way as to form an access space to the at least one electrical connector (21, 22), a step of forming a sealing seam (71) in such a way that the component is encapsulated in a sealed cavity (9) delimited by the first face of the support (1), the first face of the cover (6) and the sealing seam (7), The method comprises a step of filling with a conductive material of is at least one passage (61, 62) of the cover (6) in such a way as to establish an electrical continuity between the conductive material and the at least one electrical co