Abstract: The present application provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside, and has excellent spreadability, is applicable to thin organic electronic devices and has excellent hardness of the cured product after curing, without causing an inter-circuit interference problem.

Abstract: The present invention relates to a method producing dimer of chimeric recombinant binding domain-heterogeneous functional group fusion([B-F fusion]2) by using covalent disulfide-bond-bridge connecting the two monomers of chimeric recombinant binding domain-heterogeneous functional group fusion(B-F fusion). The dimer of chimeric recombinant binding domain(B)-heterogeneous functional group(F) fusion was the first to be formed by using covalent disulfide-bond-bridge to connect monomers to have double binding valency of the monomer. It has higher functional efficiency to its targets and the production yield is high by containing said extension peptide chain.

Abstract: The present invention relates to a method producing dimer of chimeric recombinant binding domain-heterogeneous functional group fusion([B-F fusion]2) by using covalent disulfide-bond-bridge connecting the two monomers of chimeric recombinant binding domain-heterogeneous functional group fusion(B-F fusion). The dimer of chimeric recombinant binding domain(B)-heterogeneous functional group(F) fusion was the first to be formed by using covalent disulfide-bond-bridge to connect monomers to have double binding valency of the monomer. It has higher functional efficiency to its targets and the production yield is high by containing said extension peptide chain.