Abstract: A manufacturing method of a package substrate is disclosed. The method for manufacturing a package substrate is by forming a bump on a bump pad in a core board, where a first circuit pattern including the bump pad is formed on one surface, a second circuit pattern electrically connected with the first circuit pattern is formed on the other surface, and a dielectric layer is selectively coated on the one surface such that the bump pad is exposed. The method includes layering a conductive layer on the other surface of the core board, coating a plating resist on the conductive layer, forming the bump by supplying electricity to the conductive layer to electroplate the bump pad, and removing the plating resist and the conductive layer.