Abstract: A routing integrated circuit element is disclosed. The routing integrated circuit element is connected between a first and a second electronic module and includes a body, a first, and a second buffer element. A first side of the body is connected to the first electronic module. A second side is connected to the second electronic module and located on a different side from the first side. The distance between the second side and the second electronic module is shorter than the distance between the second side and the first electronic module. The first buffer element transmits an electronic signal from the first side to the second side. The second buffer element transmits the electronic signal from the second side to the first side, wherein the transmission directions of the electronic signals transmitted by the first buffer element and the second buffer element are opposite.

Abstract: A GENZ port structure includes a body, a plurality of high-speed input pins, a plurality of high-speed output pins, a plurality of ground pins, a power supply pin, a plurality of differential clock pins, and a plurality of parameter setting pins. The main body includes a first side and a second side. The plurality of high-speed input pins are arranged on the first side. The plurality of high-speed output pins are arranged on the second side. The plurality of ground pins are interspersed between the plurality of high-speed input pins and the plurality of output pins. The power supply pins, the plurality of differential clock pins and the plurality of parameter setting pins are respectively arranged on one of the first side or the second side. The plurality of parameter setting pins are used to adjust an internal parameter setting of the GENZ port structure.

Abstract: A GENZ port structure includes a body, a plurality of high-speed input pins, a plurality of high-speed output pins, a plurality of ground pins, a power supply pin, a plurality of differential clock pins, and a plurality of parameter setting pins. The main body includes a first side and a second side. The plurality of high-speed input pins are arranged on the first side. The plurality of high-speed output pins are arranged on the second side. The plurality of ground pins are interspersed between the plurality of high-speed input pins and the plurality of output pins. The power supply pins, the plurality of differential clock pins and the plurality of parameter setting pins are respectively arranged on one of the first side or the second side. The plurality of parameter setting pins are used to adjust an internal parameter setting of the GENZ port structure.

Abstract: A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins, and ground pins. The main circuit unit is arranged in the center of the body. The power pins supply power signal to the main circuit unit. The input pins and the output pins are arranged on a first and a second side of the body separately for electrically connecting to the main circuit unit. The control pins are arranged on the second side of the body and electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins, and the control pins.

Abstract: A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins and ground pins. The main circuit unit is arranged in the center of the body. The power pins are arranged in the center of the body. The input pins are arranged at a first side of the body and are electrically connected to the main circuit unit. The output pins are arranged at a side of the body opposite to the first side and are electrically connected to the main circuit unit. The control pins are arranged at a second side of the body and are electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins and the control pins.

Abstract: A signal feedback gain circuit is disclosed. The signal feedback gain circuit includes a signal input terminal, a summing point, a gain module, a signal output terminal and a plurality of feedback paths. The signal input terminal is for inputting a transmission signal. The summing point is connected to the signal input terminal. The gain module is connected to the summing point to input and adjust the gain of the transmission signal. The signal output terminal is for receiving the transmission signal and outputting it to an electronic module. The plurality of feedback paths are connected in parallel to the signal output terminals so as to input the transmission signal and are further connected in parallel to the summing point so as to feedback the transmission signal to the summing point. Accordingly, the plurality of feedback paths can adjust a gain curve of the transmission signal.

Abstract: A signal transmission circuit element, a multiplexer circuit element and a demultiplexer circuit element are disclosed. The signal transmission circuit element is connected among multiple electronic modules so as to transmit an electrical signal. The signal transmission circuit element includes an input terminal, an input equalizer, an output driver and an output terminal. The input terminal is for inputting an electrical signal to the input equalizer. The output driver is electrically connected to the input equalizer. The output terminal is electrically connected to the output driver so as to output the electrical signal. Accordingly, after the input terminal receives the electrical signal, the input equalizer can perform gain compensation on the electrical signal, and then an output capacitance of the electrical signal is driven by the output driver and outputted through the output terminal.

Abstract: A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins and ground pins. The main circuit unit is arranged in the center of the body. The power pins are arranged in the center of the body. The input pins are arranged at a first side of the body and are electrically connected to the main circuit unit. The output pins are arranged at a side of the body opposite to the first side and are electrically connected to the main circuit unit. The control pins are arranged at a second side of the body and are electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins and the control pins.

Abstract: A routing integrated circuit element is disclosed. The routing integrated circuit element is connected between a first and a second electronic module and includes a body, a first, and a second buffer element. A first side of the body is connected to the first electronic module. A second side is connected to the second electronic module and located on a different side from the first side. The distance between the second side and the second electronic module is shorter than the distance between the second side and the first electronic module. The first buffer element transmits an electronic signal from the first side to the second side. The second buffer element transmits the electronic signal from the second side to the first side, wherein the transmission directions of the electronic signals transmitted by the first buffer element and the second buffer element are opposite.

Abstract: A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins, and ground pins. The main circuit unit is arranged in the center of the body. The power pins supply power signal to the main circuit unit. The input pins and the output pins are arranged on a first and a second side of the body separately for electrically connecting to the main circuit unit. The control pins are arranged on the second side of the body and electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins, and the control pins.

Abstract: A USB-C connection line and a USB-C connection line signal judgement method thereof are disclosed. The USB-C connection line can be connected between a first electronic device and a second electronic device. The USB-C connection line includes a receiver detector, a first signal detector, a second signal detector, and a controller. The receiver detector is used to detect whether a receiver signal is received; the receiver signal means that the first electronic device or the second electronic device is connected to a first port or a second port. The first signal detector and the second signal detector are used to detect whether an input signal is transmitted from the first electronic device or the second electronic device. The controller is used to determine whether any one of the input signal or the receiver signal is received so as to execute a startup procedure.

Abstract: A bi-directional signal transmission connection cable is disclosed. The bi-directional signal transmission connection cable can be connected between a first and a second electronic device. The bi-directional signal transmission connection cable includes a first connection port, a second connection port, a first repeater chip, a second repeater chip and a plurality of transmission wires. The first and the second repeater chips are symmetrically disposed in the first and the second connection ports. The first repeater chip has a first set of adjustment parameters, and the second repeater chip has a second set of adjustment parameters. Thus, when a signal is transmitted between the first and the second electronic devices via the first connection port, the second connection port, and the plurality of transmission wires, the signal is adjusted by the first set of adjustment parameters and the second set of adjustment parameters.

Abstract: A bi-directional signal transmission connection cable is disclosed. The bi-directional signal transmission connection cable can be connected between a first and a second electronic device. The bi-directional signal transmission connection cable includes a first connection port, a second connection port, a first repeater chip, a second repeater chip and a plurality of transmission wires. The first and the second repeater chips are symmetrically disposed in the first and the second connection ports. The first repeater chip has a first set of adjustment parameters, and the second repeater chip has a second set of adjustment parameters. Thus, when a signal is transmitted between the first and the second electronic devices via the first connection port, the second connection port, and the plurality of transmission wires, the signal is adjusted by the first set of adjustment parameters and the second set of adjustment parameters.

Abstract: A USB-C connection line and a USB-C connection line signal judgement method thereof are disclosed. The USB-C connection line can be connected between a first electronic device and a second electronic device. The USB-C connection line includes a receiver detector, a first signal detector, a second signal detector, and a controller. The receiver detector is used to detect whether a receiver signal is received; the receiver signal means that the first electronic device or the second electronic device is connected to a first port or a second port. The first signal detector and the second signal detector are used to detect whether an input signal is transmitted from the first electronic device or the second electronic device. The controller is used to determine whether any one of the input signal or the receiver signal is received so as to execute a startup procedure.

Abstract: Techniques and mechanisms for providing signal communication with a configurable transceiver circuit. In an embodiment, an integrated circuit comprises transceiver circuitry including an output stage and current mirror circuitry. The output stage is coupled to receive a differential signal pair and to provide at least one output signal based on the differential signal pair. In another embodiment, configuration logic is operable to select between a first mode and a second mode of the transceiver circuit. The first mode includes the current mirror circuitry being disabled from providing a current signal to the output stage, and a first circuit path being closed to provide voltage to the output stage. The second mode includes the first circuit path being open and the current mirror circuitry being enabled to provide a current signal to the output stage.

Abstract: Techniques and mechanisms for providing signal communication with a configurable transceiver circuit. In an embodiment, an integrated circuit comprises transceiver circuitry including an output stage and current mirror circuitry. The output stage is coupled to receive a differential signal pair and to provide at least one output signal based on the differential signal pair. In another embodiment, configuration logic is operable to select between a first mode and a second mode of the transceiver circuit. The first mode includes the current mirror circuitry being disabled from providing a current signal to the output stage, and a first circuit path being closed to provide voltage to the output stage. The second mode includes the first circuit path being open and the current mirror circuitry being enabled to provide a current signal to the output stage.

Abstract: Embodiments of the present disclosure provide optical link handshake techniques and configurations. In one embodiment, an optical module includes a laser driver corresponding with a channel of the optical module, a signal detector corresponding with the channel, and a link handshake state machine configured to control the laser driver to generate a connect pulse of a link handshake process to test an optical link between the channel and a corresponding channel of another optical module and monitor the signal detector to detect a connect pulse from the another optical module. Other embodiments may be described and/or claimed.

Abstract: A system includes two optical modules that perform auto-setting of the optical links between the optical modules. One optical module sends an optical signal with a test pattern to the other optical module. If the receiving module determines that the test pattern is successfully received, it sends a pass indication to the transmitting module, and the transmitting module can configure its driver path in accordance with a transmit current setting used to transmit the test pattern. If the test pattern is not successfully received, the receiving module sends a fail indication, and the transmitting module can increase the transmit current setting and resend the test pattern. When the system includes multiple optical channels, one channel can be tested while feedback is provided on another channel. The system can iterate through all optical channels until they are all configured.

Abstract: Embodiments of the present disclosure provide laser safety techniques and configurations. In one embodiment, an optical module includes a first die including a laser configured to transmit optical signals, a first node electrically coupled with the laser, and a second node electrically coupled with the laser, and a second die including a power supply line configured to provide power to the laser, a third node electrically coupled with the power supply line and electrically coupled with the first node to provide the power to the laser, a fourth node electrically coupled with the second node of the first die, and a switch configured to prevent the power of the power supply line from reaching the laser through the third node based on a voltage of the fourth node when a laser fault event occurs. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure provide laser safety techniques and configurations. In one embodiment, an optical module includes a first die including a laser configured to transmit optical signals, a first node electrically coupled with the laser, and a second node electrically coupled with the laser, and a second die including a power supply line configured to provide power to the laser, a third node electrically coupled with the power supply line and electrically coupled with the first node to provide the power to the laser, a fourth node electrically coupled with the second node of the first die, and a switch configured to prevent the power of the power supply line from reaching the laser through the third node based on a voltage of the fourth node when a laser fault event occurs. Other embodiments may be described and/or claimed.