Abstract: A method of forming a conductive trace that includes steps of A) selecting a substrate, B) providing a jet dispenser, C) selecting a conductive ink, D) measuring the ink's viscosity (Vm), E) using Vm to select one of criteria (i)-(iv), F) applying the selected criteria to the dispenser, and G) applying the ink onto the substrate; and drying, curing, or annealing the ink to form the conductive trace having ?4B adhesion. The criteria (i)-(iv) include: (i) (Vm) >2.0 Pa-s, then (1) add a fluid—repeat D)-E) or (2) repeat C)-E); (ii) 2.0 Pa-s?Vm>0.35 Pa-s, use needle diameter ?3.0 mm & nozzle diameter (d) ?0.15 mm with ratio of nozzle length (L) to nozzle diameter (d) ?30; (iii) Vm<0.25 Pa-s, use a needle diameter ?1.0 mm and <3.0 mm & nozzle diameter ?0.15 mm with L/d ?30; or (iv) 0.25 Pa-s?Vm?0.35 Pa-s, use criteria (ii) or (iii).

Abstract: A method of forming a conductive trace that includes selecting a substrate, jet dispenser, and conductive ink; measuring the ink's viscosity (Vm); using Vm to select one of criteria (i)-(iv): applying the selected criteria to the dispenser; applying the ink onto the substrate; and drying, curing, or annealing the ink to form the conductive trace having ?4B adhesion. The criteria (i)-(iv) including: (i) (Vm)>2.0 Pa-s, then (1) add a fluid—repeat D)-E) or (2) repeat C)-E); (ii) 2.0 Pa-s?Vm>0.35 Pa-s, use needle diameter ?3.0 mm & nozzle diameter (d)?0.15 mm with ratio of nozzle length (L) to nozzle diameter (d)?30; (iii) Vm<0.25 Pa-s, use a needle diameter ?1.0 mm and <3.0 mm & nozzle diameter ?0.15 mm with L/d?30; or (iv) 0.25 Pa-s?Vm?0.35 Pa-s, use criteria (ii) or (iii).

Abstract: An inductor that includes an electrically conductive construct, wherein the electrically conductive construct includes a first layer having a predetermined geometry, wherein the first layer includes at least one conductive material such as a metal; and a second layer oriented parallel to the first layer, wherein the second layer includes at least one soft ferrite, and wherein the second layer is configured in a co-planar arrangement with the first layer.

Abstract: A method of forming a conductive trace that includes selecting a substrate, jet dispenser, and conductive ink; measuring the ink's viscosity (Vm); using Vm to select one of criteria (i)-(iv): applying the selected criteria to the dispenser; applying the ink onto the substrate; and drying, curing, or annealing the ink to form the conductive trace having ?4B adhesion. The criteria (i)-(iv) including: (i) (Vm)>2.0 Pa-s, then (1) add a fluid—repeat D)-E) or (2) repeat C)-E); (ii) 2.0 Pa-s?Vm>0.35 Pa-s, use needle diameter?3.0 mm & nozzle diameter (d)?0.15 mm with ratio of nozzle length (L) to nozzle diameter (d)?30; (iii) Vm<0.25 Pa-s, use a needle diameter?1.0 mm and <3.0 mm & nozzle diameter?0.15 mm with L/d?30; or (iv) 0.25 Pa-s?Vm?0.35 Pa-s, use criteria (ii) or (iii).

Abstract: Methods, compositions, apparatuses, and systems are provided for a hybrid thermoplastic gel or sealant. The methods comprise providing (a) a base polymer having at least one functional group capable of crosslinking, (b) a functionalized extender, and (c) heat, and reacting the base polymer and functionalized extender in the presence of the heat to form the hybrid thermoplastic gel. The gel composition may comprise 5-40 wt % of a base polymer, 60-95 wt % of a functionalized extender, and 0-10 wt % of a crosslinker. A closure or interconnect system may comprise a housing, a cable, and a hybrid thermoplastic gel or sealant. A telecommunications apparatus may comprise a telecommunications component and a sealant that forms a seal with the telecommunications component. The sealant may comprise a sealant material having a first range of elongation followed by a second range of elongation.

Abstract: An ultrasonic transmitter and ultrasonic receiver include a piezoelectric layer and at least one conductive layer comprising metal nanoparticles. The metal nanoparticles may be a silver nanoparticle, copper nanoparticle, gold nanoparticle, palladium nanoparticle, nickel nanoparticle, and the mixture thereof. Use of metal nanoparticles as a conductive layer provides for ultrasonic transmitters or receivers with smooth, dense, and highly conductive electrodes, thus resulting in reduced ultrasonic energy loss and improved image quality.

Abstract: Electronic articles, antennae, and processes of producing electronic articles are disclosed. The electronic article includes a rigid substrate having a non-planar region and a sintered conductive ink positioned on the non-planar region. The antenna is a specific type of electronic article covered by the disclosure. Additionally or alternatively, the antenna has a light transmission of at least 85%. The process includes positioning a substrate having a non-planar region, applying a conductive ink to the non-planar region, and sintering the conductive ink on the non-planar region thereby producing the sintered conductive ink on the electronic article and/or producing an antenna having a light transmission of at least 80%.

Abstract: A method of connecting a wire to a conductive trace formed on a substrate having a predetermined softening point and the functional layered composite formed therefrom. The method comprises applying a conductive ink onto the substrate; curing, drying, or sintering the conductive ink to form the conductive trace with at least one connection pad; applying an activated rosin-type flux and solder to the connection pad and to one end of a metallic wire; placing the end of the wire in contact with the connection pad; applying a source of heat to the wire; melting the solder material to form an interconnection between the wire and the connection pad; removing the source of heat; and allowing the interconnection to cool before moving the wire. The melting point of the solder is either below the softening point of the substrate or above the softening point by about 20° C. or less.

Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.

Abstract: Methods, compositions, apparatuses, and systems are provided for a hybrid thermoplastic gel or sealant. The methods comprise providing (a) a base polymer having at least one functional group capable of crosslinking, (b) a functionalized extender, and (c) heat, and reacting the base polymer and functionalized extender in the presence of the heat to form the hybrid thermoplastic gel. The gel composition may comprise 5-40 wt % of a base polymer, 60-95 wt % of a functionalized extender, and 0-10 wt % of a crosslinker. A closure or interconnect system may comprise a housing, a cable, and a hybrid thermoplastic gel or sealant. A telecommunications apparatus may comprise a telecommunications component and a sealant that forms a seal with the telecommunications component. The sealant may comprise a sealant material having a first range of elongation followed by a second range of elongation.

Abstract: A primer layer comprising a polyvinyl butyral resin enhances adhesion of silver nanoparticle inks onto plastic substrates. The primer layer comprises a polyvinyl butyral (PVB) resin having a polyvinyl alcohol content between about 18 wt. % to about 21 wt. %. The PVB resin may also have a glass transition temperature greater than about 70° C. Optionally, the PVB primer layer may further be enhanced by cross-linking using a melamine-formaldehyde resin. Conductive traces formed on plastic substrates having the PVB primer layer exhibit an acceptable cross-hatch adhesion rating with little to no degradation of adhesion being observed after exposure to 4-days salt mist aging or 1-day high humidity aging.

Abstract: An alkoxysilane comprising a functional group is used as an additive in the silver nanoparticle ink, and as an adhesion promoter (or primer layer) on the surface of the substrate in order to enhance the adhesion of silver nanoparticle inks on temperature-sensitive plastic substrates. The combination of the functionalized alkoxysilane both in the ink and on the substrate's surface provides enhanced adhesion after annealing the ink at a low temperature. The adhesion of the annealed films improves from a 0B-3B level to 4B-5B when tested according to ASTM D3359. No degradation of adhesion and no change of color are observed after aging the annealed films in a humidity chamber.

Abstract: A method of fabricating highly conductive (low resistive) features with silver nanoparticle inks at low processing temperature including room temperature is provided, The method includes 1) printing a silver nanoparticle ink to form a conductive feature on a substrate; 2) drying/annealing the printed feature at a temperature compatible with the substrate; 3) treating the annealed feature in a humidity environment; and 4) optionally drying the treated conductive feature. The silver nanoparticle conductive features exhibit a decrease in resistivity from about a factor of 2 up to about a few orders of magnitude after exposure to the humidity treatment.

Abstract: Methods, compositions, apparatuses, and systems are provided for a hybrid thermoplastic gel or sealant. The methods comprise providing (a) a base polymer having at least one functional group capable of crosslinking, (b) a functionalized extender, and (c) heat, and reacting the base polymer and functionalized extender in the presence of the heat to form the hybrid thermoplastic gel. The gel composition may comprise 5-40 wt % of a base polymer, 60-95 wt % of a functionalized extender, and 0-10 wt % of a crosslinker. A closure or interconnect system may comprise a housing, a cable, and a hybrid thermoplastic gel or sealant. A telecommunications apparatus may comprise a telecommunications component and a sealant that forms a seal with the telecommunications component. The sealant may comprise a sealant material having a first range of elongation followed by a second range of elongation.

Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.

Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate, a first layer on the substrate, a rapidly solidified layer on the first layer and a conductive layer positioned on the rapidly solidified layer. The rapidly solidified layer includes a metastable phase.

Abstract: Electronic components and processes of producing electronic components are disclosed. A process of producing a component includes positioning a substrate having a non-planar surface, applying a metalizing material on the surface, and energetically beam-melting the metalizing material to produce a metalized electrical contact on the component. A component includes a substrate having a non-planar surface, and a printed and energetically beam-melted metalized electrical contact positioned on the non-planar surface. Additionally or alternatively, a component includes a substrate having a surface, and a rotationally-applied and energetically beam-melted metalized electrical contact positioned on the substrate.

Abstract: Methods and systems are provided for a dry silicone gel. The dry silicone gel comprises a base polymer having a vinyl-silicone group, a crosslinker, and a chain extender. The dry silicone gel may be made by reacting (a) a first set of components comprising a base polymer having a vinyl-silicone group and an addition cure catalyst with (b) a second set of components comprising a crosslinker, a chain extender, and additional base polymer. In certain circumstances, the base polymer and additional base polymer are vinyl-terminated polydimethylsiloxane.

Abstract: Methods and systems are provided for a dry silicone gel. The dry silicone gel comprises a base polymer having a vinyl-silicone group, a crosslinker, and a chain extender. The dry silicone gel may be made by reacting (a) a first set of components comprising a base polymer having a vinyl-silicone group and an addition cure catalyst with (b) a second set of components comprising a crosslinker, a chain extender, and additional base polymer. In certain circumstances, the base polymer and additional base polymer are vinyl-terminated polydimethylsiloxane.

Abstract: Methods and systems are provided for a dry silicone gel. The dry silicone gel comprises a base polymer having a vinylsilicone group, a crosslinker, and a chain extender. The dry silicone gel may be made by reacting (a) a first set of components comprising a base polymer having a vinylsilicone group and an addition cure catalyst with (b) a second set of components comprising a crosslinker, a chain extender, and additional base polymer. In certain circumstances, the base polymer and additional base polymer are vinyl-terminated polydimethylsiloxane.