Patents by Inventor Michael A. Stadt

Michael A. Stadt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES
    Publication number: 20060223345
    Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
    Type: Application
    Filed: June 13, 2006
    Publication date: October 5, 2006
    Inventors: Thomas Dozier, Benjamin Eldridge, Gary Grube, Igor Khandros, Gaetan Mathieu, David Pedersen, Michael Stadt
  • Sockets for “springed” semiconductor devices
    Patent number: 7059047
    Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: June 13, 2006
    Assignee: FormFactor, Inc.
    Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt
  • Sockets for "springed" semiconductor device
    Publication number: 20040064941
    Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
    Type: Application
    Filed: September 29, 2003
    Publication date: April 8, 2004
    Applicant: FormFactor, Inc.
    Inventors: Thomas H. Dozier, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt
  • Sockets for “springed” semiconductor devices
    Patent number: 6642625
    Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
    Type: Grant
    Filed: November 19, 2002
    Date of Patent: November 4, 2003
    Assignee: FormFactor, Inc.
    Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pederson, Michael A. Stadt
  • Sockets for "springed" semiconductor devices
    Publication number: 20030067080
    Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
    Type: Application
    Filed: November 19, 2002
    Publication date: April 10, 2003
    Applicant: FormFactor, Inc.
    Inventors: Thomas H. Dozier, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt
  • Sockets for “springed” semiconductor devices
    Patent number: 6534856
    Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: March 18, 2003
    Assignee: FormFactor, Inc.
    Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt
  • Sockets for “springed” semiconductor devices
    Patent number: 6232149
    Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
    Type: Grant
    Filed: March 7, 2000
    Date of Patent: May 15, 2001
    Assignee: FormFactor, Inc.
    Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt
  • Sockets for "springed" semiconductor devices
    Patent number: 6033935
    Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
    Type: Grant
    Filed: June 30, 1998
    Date of Patent: March 7, 2000
    Assignee: FormFactor, Inc.
    Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt