Patents by Inventor Michael Ahr

Michael Ahr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package and methods for producing same
    Patent number: 8994161
    Abstract: Some embodiments have a semiconductor chip supported above a substrate, a filler layer encapsulating the semiconductor chip, a heat sink; and through contacts extending upwardly from the substrate nearly to an upper surface of the filler layer. In some embodiments of electronic packages, the through contacts separated from the heat sink by a trench cut into the upper surface of the filler layer, the through contacts intersecting one wall of the trench and the heat sink intersecting the other wall of the trench an electronic semiconductor package. A method of forming the package and a lead frame are also disclosed.
    Type: Grant
    Filed: January 2, 2007
    Date of Patent: March 31, 2015
    Assignee: Infineon Technologies AG
    Inventors: Michael Ahr, Bakuri Lanchava
  • SEMICONDUCTOR DEVICE PACKAGE WITH HEAT SINK LEADFRAME AND METHOD FOR PRODUCING IT
    Publication number: 20070181997
    Abstract: Some embodiments have a semiconductor chip supported above a substrate, a filler layer encapsulating the semiconductor chip, a heat sink; and through contacts extending upwardly from the substrate nearly to an upper surface of the filler layer. In some embodiments of electronic packages, the through contacts separated from the heat sink by a trench cut into the upper surface of the filler layer, the through contacts intersecting one wall of the trench and the heat sink intersecting the other wall of the trench an electronic semiconductor package. A method of forming the package and a lead frame are also disclosed.
    Type: Application
    Filed: January 2, 2007
    Publication date: August 9, 2007
    Applicant: INFINEON TECHNOLOGIES AS
    Inventors: Michael Ahr, Bakuri Lanchava