Patents by Inventor Michael Akermann

Michael Akermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible substrate deposition system
    Patent number: 11499221
    Abstract: A deposition system is provided for guiding a flexible substrate along a deposition path. The deposition system includes a payout hub for unwinding the flexible substrate; a pickup hub for winding the flexible substrate; one or more evaporation sources (300); one or more electrodes (510) spaced apart from the one or more evaporation sources in a first direction; one or more measurement devices (550); and a controller (601) configured to adjust one or more voltages provided to the one more electrodes.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: November 15, 2022
    Assignee: FLISOM AG
    Inventors: Bernhard Schlaeppi, Michael Akermann
  • FLEXIBLE SUBSTRATE DEPOSITION SYSTEM
    Publication number: 20190203348
    Abstract: A deposition system is provided for guiding a flexible substrate along a deposition path. The deposition system includes a payout hub for unwinding the flexible substrate; a pickup hub for winding the flexible substrate; one or more evaporation sources (300); one or more electrodes (510) spaced apart from the one or more evaporation sources in a first direction; one or more measurement devices (550); and a controller (601) configured to adjust one or more voltages provided to the one more electrodes.
    Type: Application
    Filed: August 9, 2017
    Publication date: July 4, 2019
    Inventors: Bernhard SCHLAEPPI, Michael AKERMANN
  • Method for producing a plastic container having a two-dimensionally extending electronic element, plastic container produced according to said method and injection mold for carrying out the method
    Patent number: 9908271
    Abstract: In order to produce a plastic container (1,2) having a planar electronic element (15), a planar electronic element (15) is introduced into a recess (29) of an inner face of a mold. The mold comprises an outer mold part (10) and a mold core (11), which form a mold cavity (12). Molten plastic material is injected into the mold cavity (12). After the subsequent cooling of the plastic material, mold removal is carried out. The recess (29) is arranged on an inner face (26) of the outer mold part (10). The molten plastic material is injected into the mold cavity in such a way that the molten plastic material flows substantially parallel along a surface (25) of the planar electronic element (15) facing the mold cavity (12). The planar electronic element (15) is an RFID inlay, for example. The planar electronic element does not require a protective casing and can be sprayed directly.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: March 6, 2018
    Assignee: Weidman Medical Technology AG
    Inventors: Kurt Eggmann, Karl Mazenauer, Michael Akermann
  • METHOD FOR PRODUCING A PLASTIC CONTAINER HAVING A TWO-DIMENSIONALLY EXTENDING ELECTRONIC ELEMENT, PLASTIC CONTAINER PRODUCED ACCORDING TO SAID METHOD AND INJECTION MOLD FOR CARRYING OUT THE METHOD
    Publication number: 20160121527
    Abstract: In order to produce a plastic container (1,2) having a planar electronic element (15), a planar electronic element (15) is introduced into a recess (29) of an inner face of a mold. The mold comprises an outer mold part (10) and a mold core (11), which form a mold cavity (12). Molten plastic material is injected into the mold cavity (12). After the subsequent cooling of the plastic material, mold removal is carried out. The recess (29) is arranged on an inner face (26) of the outer mold part (10). The molten plastic material is injected into the mold cavity in such a way that the molten plastic material flows substantially parallel along a surface (25) of the planar electronic element (15) facing the mold cavity (12). The planar electronic element (15) is an RFID inlay, for example. The planar electronic element does not require a protective casing and can be sprayed directly.
    Type: Application
    Filed: November 4, 2015
    Publication date: May 5, 2016
    Applicant: WEIDMANN PLASTICS TECHNOLOGY AG
    Inventors: Kurt EGGMANN, Karl MAZENAUER, Michael AKERMANN
  • Method for producing a plastic container having a planar electronic element, plastic container produced according to said method, and injection mold for carrying out the method
    Patent number: 9211665
    Abstract: In order to produce a plastic container (1, 2) having a planar electronic element (15), a planar electronic element (15) is introduced into a recess (29) of an inner face of a mold. The mold comprises an outer mold part (10) and a mold core (11), which form a mold cavity (12). Molten plastic material is injected into the mold cavity (12). After the subsequent cooling of the plastic material, mold removal is carried out. The recess (29) is arranged on an inner face (26) of the outer mold part (10). The molten plastic material is injected into the mold cavity in such a way that the molten plastic material flows substantially parallel along a surface (25) of the planar electronic element (15) facing the mold cavity (12). The planar electronic element (15) is an RFID inlay, for example. The planar electronic element does not require a protective casing and can be sprayed directly.
    Type: Grant
    Filed: May 4, 2011
    Date of Patent: December 15, 2015
    Assignee: Weidmann Medical Technology AG
    Inventors: Kurt Eggmann, Karl Mazenauer, Michael Akermann
  • METHOD FOR PRODUCING A PLASTIC CONTAINER HAVING A PLANAR ELECTRONIC ELEMENT, PLASTIC CONTAINER PRODUCED ACCORDING TO SAID METHOD, AND INJECTION MOLD FOR CARRYING OUT THE METHOD
    Publication number: 20130048651
    Abstract: In order to produce a plastic container (1, 2) having a planar electronic element (15), a planar electronic element (15) is introduced into a recess (29) of an inner face of a mold. The mold comprises an outer mold part (10) and a mold core (11), which form a mold cavity (12). Molten plastic material is injected into the mold cavity (12). After the subsequent cooling of the plastic material, mold removal is carried out. The recess (29) is arranged on an inner face (26) of the outer mold part (10). The molten plastic material is injected into the mold cavity in such a way that the molten plastic material flows substantially parallel along a surface (25) of the planar electronic element (15) facing the mold cavity (12). The planar electronic element (15) is an RFID inlay, for example. The planar electronic element does not require a protective casing and can be sprayed directly.
    Type: Application
    Filed: May 4, 2011
    Publication date: February 28, 2013
    Applicant: WEIDMANN PLASTICS TECHNOLOGY AG
    Inventors: Kurt Eggmann, Karl Mazenauer, Michael Akermann