Abstract: Provided is a method and computer program product for ranking and selecting triggers. The method includes displaying a user interface to a marketer user, determining a predicted effectiveness for each trigger of a set of triggers associated with at least one offer based at least partially on a likelihood of a plurality of users performing transactions satisfying conditions associated with each trigger of the set of triggers, generating a ranked set of triggers by ranking each trigger of the set of triggers according to the predicted effectiveness of each respective trigger of the set of triggers, displaying the ranked set of triggers for the selection of at least one trigger, and in response to the selection of the at least one trigger by the marketer user from the user interface, generating at least one trigger record from the at least one trigger.

Abstract: Semiconductor devices and methods for their assembly are described in which inductor elements and additional passive or active circuit components may be combined in novel configurations. An electronic device and associated methods provide an inductor element encapsulated within a dielectric package, the inductor package having a plurality of electrical contacts on at least one surface. One or more circuit components are affixed to the package surface and operably coupled to the electrical contacts. The circuit components have a total area not larger than the inductor package surface, providing a device with overall dimensions bounded by the area of the inductor package. A preferred method embodying the invention includes a step of selecting an inductor element configuration based on performance requirements. The inductor element is packaged in a dielectric package having electrical contacts disposed on one or more surface.

Abstract: A power regulator has an output for regulated power that is connected to supply power to a load. The load can have various electrical characteristics, including requiring a rapid transient response. The transient response amplitude for the power regulator is decreased by adding capacitance at the output, but that slows the response time of the power regulator by lowering the crossover frequency and the phase margin at the crossover frequency. An adjustable gain element imbedded in the feedback network provides an input to permit a builder or user of the power regulator to vary the effective value of impedance elements in the feedback network. The builder or user selectively connects an impedance to the input of the adjustable gain element to thereby adjust the frequency characteristics of the feedback network to thereby adjust output characteristics of the power regulator to compensate for the effects of capacitance added to the power regulator output.

Abstract: The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends between parallel auxiliary and main circuit boards. A finned heat dissipating member is at one side of the planar portion. Mounting pins in channels mount the heat sink to the main circuit board. The second embodiment is u-shaped and stands on edge to mount the auxiliary circuit board perpendicular to the main circuit boards. Mounting pins in channels of the second embodiment likewise mount the heat sink to the main circuit board.

Abstract: The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends between parallel auxiliary and main circuit boards. A finned heat dissipating member is at one side of the planar portion. Mounting pins in channels mount the heat sink to the main circuit board. The second embodiment is u-shaped and stands on edge to mount the auxiliary circuit board perpendicular to the main circuit boards. Mounting pins in channels of the second embodiment likewise mount the heat sink to the main circuit board.

Abstract: The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends between parallel auxiliary and main circuit boards. A finned heat dissipating member is at one side of the planar portion. Mounting pins in channels mount the heat sink to the main circuit board. The second embodiment is unshaped and stands on edge to mount the auxiliary circuit board perpendicular to the main circuit boards. Mounting pins in channels of the second embodiment likewise mount the heat sink to the main circuit board.