Patents by Inventor Michael B. Brown

Michael B. Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRELESS LOCKSET WITH INTEGRATED ANTENNA, TOUCH ACTIVATION, AND LIGHT COMMUNICATION METHOD
    Publication number: 20240151067
    Abstract: A wireless electromechanical lock with one or more of an internal antenna, touch activation, and/or a light communication device that acts as a user interface. In some embodiments, the lock utilizes an antenna near the exterior face of the lockset, designed inside the metal body of the lockset itself. A light communication device is provided in some embodiments to communicate information, visually, to the user via animations and dynamic displays of light. In some embodiments, the lockset includes a touch activation capability, which can be used to lock/unlock the lock and/or otherwise provide input.
    Type: Application
    Filed: January 19, 2024
    Publication date: May 9, 2024
    Inventors: Alan Uyeda, Michael Maridakis, Jerome F. Czerwinski, JR., Elliott B. Scheider, Troy M. Brown, David KJ Kim
  • Wireless lockset with touch activation
    Patent number: 11913252
    Abstract: A wireless electromechanical lock with one or more of an internal antenna, touch activation, and/or a light communication device that acts as a user interface. In some embodiments, the lock utilizes an antenna near the exterior face of the lockset, designed inside the metal body of the lockset itself. A light communication device is provided in some embodiments to communicate information, visually, to the user via animations and dynamic displays of light. In some embodiments, the lockset includes a touch activation capability, which can be used to lock/unlock the lock and/or otherwise provide input.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: February 27, 2024
    Assignee: ASSA ABLOY Americas Residential Inc.
    Inventors: Alan Uyeda, Michael Maridakis, Jerome F. Czerwinski, Jr., Elliott B. Scheider, Troy M. Brown, David K J Kim
  • Electronic package with integrated distributed decoupling capacitors
    Patent number: 4945399
    Abstract: A semiconductor chip carrier includes a plurality of distributed high frequency decoupling capacitors as an integral part of the carrier. The distributed capacitors are formed as a part of the first and second layers of metallurgy and separated by a layer of thin film dielectric material built up on a substrate. The distributed capacitors are positioned to extend from a ground pin of one of the layers of metallurgy to a plurality of mounting pads which are intergral parts of the other of the layers of metallurgy. A semiconductor chip is mounted to the mounting pads and receives electrical power and signals therethrough. The distributed capacitors decrease electrical noise associated with simultaneous switching of relatively large numbers of off-chip drivers which are electrically connected to the semiconductor chip.
    Type: Grant
    Filed: January 19, 1989
    Date of Patent: July 31, 1990
    Assignee: International Business Machines Corporation
    Inventors: Michael B. Brown, William S. Ebert, Leonard T. Olson, Richard R. Sloma