Abstract: A coupler assembly has first and second conductors with first and second dielectric supports extending along a coupling section and supporting the first and second conductors at a support section.

Abstract: A microwave spectroscopy probe has a center conductor between a first ground plane and a second ground plane. A dielectric member has fluid channel between the center conductor and the first ground plane.

Abstract: A microcircuit has a node thereon. A center conductor is electrically connected to the node and the center conductor has a length to minimum radius ratio of at least 50. A method of for providing electrical interconnections in a microcircuit, comprises the steps of depositing conductive bumps on the microcircuit; and aligning and bonding a center conductor to the conductive bumps, the center conductor having a first end and a second end, and the center conductor having a length to minimum radius ratio of at least 50.

Abstract: An interconnection includes a microcircuit package having a slot, and a receiving feature. A bead ring is fitted into the receiving feature. A center conductor extends through a dielectric support disposed in the bead ring and through the slot. The center conductor forms a coaxial transmission structure in cooperation with the bead ring and the dielectric support, and forms a slab line transmission structure in cooperation with the slot.

Abstract: An interface to a microcircuit formed on a substrate supporting a ground plane. The substrate supports a dielectric structure having gold coated sloped sidewalls electrically connected to the ground plane. A transmission line, connected to the microcircuit, is supported by the dielectric structure. A coaxial cable is connected to the transmission line. The coaxial cable having an end stripped at an angle substantially the same as the sloped side walls of the dielectric structure, wherein the exposed length of the center conductor is bonded to the transmission line, and the outer conductor of the coax cable is bonded to the gold plating on the dielectric structure such that the angled portion of the coax cable mates with the bevel of the thick film dielectric.

Abstract: A movable support for a coaxial structure, such as a coaxial feed-through, connector, or cable, allows adjusting the height of a center pin of the coaxial structure relative to the surface of a high-frequency planar microcircuit mounted on a base. The height of the center pin is optimized to provide a high-frequency transition between the coaxial transmission structure and a planar transmission structure, such as a stripline structure, on the planar microcircuit. An interference fit between the movable support and base at the operating height provides a high-quality ground contact underneath the center pin.

Abstract: An interface to a microcircuit formed on a substrate supporting a ground plane. The substrate supports a dielectric structure having gold coated sloped sidewalls electrically connected to the ground plane. A transmission line, connected to the microcircuit, is supported by the dielectric structure. A coaxial cable is connected to the transmission line. The coaxial cable having an end stripped at an angle substantially the same as the sloped side walls of the dielectric structure, wherein the exposed length of the center conductor is bonded to the transmission line, and the outer conductor of the coax cable is bonded to the gold plating on the dielectric structure such that the angled portion of the coax cable mates with the bevel of the thick film dielectric.

Abstract: A movable support for a coaxial structure, such as a coaxial feed-through, connector, or cable, allows adjusting the height of a center pin of the coaxial structure relative to the surface of a high-frequency planar microcircuit mounted on a base. The height of the center pin is optimized to provide a high-frequency transition between the coaxial transmission structure and a planar transmission structure, such as a stripline structure, on the planar microcircuit. An interference fit between the movable support and base at the operating height provides a high-quality ground contact underneath the center pin.