Patents by Inventor Michael Baker

Michael Baker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11812811
    Abstract: An energy diverting football helmet is disclosed. The helmet contains the shell having an inside and an outside, padding positioned against the inside of the shell. There is also a face mask attached to the front of the football helmet, and a chin strap. On the outside of the shell there is a plurality of flexible energy divergent baffles (FEDB) attached to the outside of said shell. The flexible energy divergent baffle comprises a base, a flat top, and an offset baffle connecting the flat top with the base. On top of the base is a wafer, upon which resides an energy transferring bumper.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: November 14, 2023
    Inventors: Michael Baker, Leonard Samuel Baker
  • Patent number: 11804103
    Abstract: Described is a method of detecting the use of automation to place wagers on a play by play wagering platform by a user's account by identifying correlations within the user's historical wager data exceeding a threshold indicating that automation is being used to place wagers using the user's account an invalidating wagers placed by the user's account.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: October 31, 2023
    Assignee: AdrenalineIP
    Inventors: Casey Alexander Huke, John Cronin, Joseph W. Beyers, Michael D'Andrea, Michael Baker
  • Patent number: 11790733
    Abstract: A system for modifying video of a live sporting event to include details of a micro market wager. A wagering platform that offers wagers on micro markets inside of a sporting event can produce personalized content for each user around highlights of their wagering experience. The modified video can be shared with the user's contacts and the user can receive shared modified videos from their contacts.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: October 17, 2023
    Assignee: AdrenalineIP
    Inventors: Casey Alexander Huke, John Cronin, Joseph W. Beyers, Michael D'Andrea, Harrison Grant, Michael Baker
  • Patent number: 11781256
    Abstract: Various examples are provided related to transporting and sewing material in, e.g., automation of sewing robots. Multiple pieces of layered materials can be transported on a flat planar surface while maintaining the material layer's position and orientation relative to one another during a sewing procedure of these materials along any arbitrary seam shape. In one example, among others, a method includes positioning a second piece of material on a first piece of material located on a sewing plane, positioning a material holding apparatus over the pieces of material to secure position and orientation between the pieces of material, locating the pieces of material with respect to an automated sewing machine by repositioning the material holding apparatus, and sewing the second piece of material to the first piece of material. The methods can eliminate the need of custom-made templates for sewing arbitrarily shaped seams with an automated sewing machine.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: October 10, 2023
    Assignee: SOFTWEAR AUTOMATION INC.
    Inventors: Michael Baker, Wael Saab
  • Publication number: 20230317660
    Abstract: Microelectronic die package structures formed according to some embodiments may include a substrate having one or more solder structures. A first set of solder structures is located in a peripheral region of the substrate and a second set of solder structures is located in a central region of the substrate. A height of individual ones of the second set of solder structures is greater than a height of individual ones of the first set of solder structures. A die having a first side and a second side includes one or more conductive die pads on the first side, where individual ones of the conductive die pads are on individual ones of the first set solder structures and on individual ones of the second set solder structures. A die backside layer is on the second side of the die.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Applicant: Intel Corporation
    Inventors: Zhaozhi Li, Feras Eid, Michael Baker, Wenhao Li, Pilin Liu, Johanna Swan
  • Publication number: 20230317630
    Abstract: Microelectronic die package structures formed according to some embodiments may include a substrate comprising one or more conductive interconnect structures on a surface of the substrate. One or more support features are on one or more peripheral regions of the surface of the substrate. A first side of a die is coupled to the one or more conductive interconnect structures and is over the one or more support features. A die backside layer is on the second side of the die.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Applicant: Intel Corporation
    Inventors: Wenhao Li, Feras Eid, Michael Baker, Pilin Liu, Zhaozhi Li
  • Publication number: 20230317675
    Abstract: Microelectronic die package structures formed according to some embodiments may include a thermal compression bonding (TCB) tool including a pedestal having a convex surface to receive a package substrate, a bond head to compress a die against the package substrate, and a heat source thermally coupled to at least one of the pedestal or the bond head.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 5, 2023
    Applicant: Intel Corporation
    Inventors: Michael Baker, Zhaozhi Li, Feras Eid, Pilin Liu, Wenhao Li
  • Publication number: 20230317676
    Abstract: Microelectronic die package structures formed according to some embodiments may include a thermal compression bonding (TCB) assembly including a bond head with a first thermal zone separated from a second thermal zone by a thermal separator, the thermal separator extending through a thickness of the bond head. A bond head nozzle is coupled to a first side of the bond head, where the bond head nozzle includes one or more nozzle channels extending through a thickness of the bond head nozzle.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 5, 2023
    Applicant: Intel Corporation
    Inventors: Michael Baker, Feras Eid, Wenhao Li, Zhaozhi Li, Pilin Liu
  • Publication number: 20230317545
    Abstract: Microelectronic die package structures formed according to some embodiments may include a substrate and a die having a first side and a second side. The first side of the die is coupled to the substrate, and a die backside layer is on the second side of the die. The die backside layer includes a plurality of unfilled grooves in the die backside layer. Each of the unfilled grooves has an opening at a surface of the die backside layer, opposite the second side of the die, and extends at least partially through the die backside layer.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Applicant: Intel Corporation
    Inventors: Pilin Liu, Feras Eid, Michael Baker, Wenhao Li, Zhaozhi Li
  • Publication number: 20230290109
    Abstract: Various embodiments set forth systems and techniques for evaluating media content items. The techniques include receiving visual feedback associated with one or more audience members viewing a first media content item; analyzing the visual feedback to generate one or more emotion signals based on the visual feedback; and generating a set of features associated with the one or more audience members viewing the first media content item based on the one or more emotion signals.
    Type: Application
    Filed: March 14, 2022
    Publication date: September 14, 2023
    Inventors: Aaron Michael BAKER, Mary Nell BORST, Dennis LI, Jacek Krzysztof NARUNIEC, Dustin TUCKER, Romann Matthew WEBER
  • Patent number: 11748381
    Abstract: In some implementations, a device may identify respective sets of unique values for multiple dimensions of a multidimensional data structure. The device may identify a plurality of subsets of permutations of a set of permutations of the unique values. The plurality of subsets of permutations are to be processed in parallel. The device may obtain, based on processing the plurality of subsets of permutations in parallel, respective data associated with each permutation of the plurality of subsets of permutations. The data for a permutation, of the plurality of subsets of permutations, is obtained based on respective unique values for the permutation that are determined independently of another permutation of the plurality of subsets of permutations.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: September 5, 2023
    Assignee: Capital One Services, LLC
    Inventors: Anil Kumar Vallapureddy, Richard Everson, Seshikanth Bandlapalli, Michael Baker
  • Publication number: 20230255604
    Abstract: A container assembly including a collection container and a container lid couplable to the collection container. An elongate receptacle extends from the container lid into the collection container when the container lid is coupled to the collection container. The elongate receptacle has an open end portion defined within the container lid and is configured to receive a specimen collection tube therein. A finger grip luer adapter is removably coupled to the container lid within the elongate receptacle, the finger grip luer adapter having a needle extending therefrom. An elongate cap is removably coupled to the finger grip luer adapter and is configured to extend over at least the needle of the finger grip luer adapter, wherein an upper portion of the elongate cap extends above at least a portion of the open end portion of the elongate receptacle when coupled to the finger grip luer adapter.
    Type: Application
    Filed: June 30, 2021
    Publication date: August 17, 2023
    Inventors: Michael Baker, Daniel Feltyberger, Elizabeth Stayduhar, David Colie Wight
  • Patent number: 11718937
    Abstract: Various examples are provided related to transporting and sewing material in, e.g., automation of sewing robots. Multiple pieces of layered materials can be transported on a flat planar surface while maintaining the material layer's position and orientation relative to one another during a sewing procedure of these materials along any arbitrary seam shape. In one example, among others, a system includes a sewing machine including a sewing needle, a material holding assembly and a translation system. The material holding assembly can include mechanical fingers that can contact material on a sewing plane adjacent to the sewing needle and a structural grounding system supporting the mechanical fingers. The translation system can reposition the material on the sewing plane via the mechanical fingers. Clearance around the sewing needle can be provided by repositioning individual mechanical fingers around the sewing needle.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: August 8, 2023
    Assignee: SOFTWEAR AUTOMATION INC.
    Inventors: Michael Baker, Wael Saab
  • Publication number: 20230240669
    Abstract: A container assembly including a collection container and a container lid couplable to the collection container. A specimen collection tube holder having an elongated receptacle formed therein is provided, the elongated receptacle being configured to receive a specimen collection tube. The specimen collection tube holder is removably couplable to a central portion of the container lid such that at least a portion of the elongated receptacle extends into the chamber of the collection container when the container lid is coupled to the collection container and the specimen collection tube holder is coupled to the container lid.
    Type: Application
    Filed: June 30, 2021
    Publication date: August 3, 2023
    Inventors: David Colie Wight, Michael Baker, Daniel Feltyberger, Elizabeth Stayduhar
  • Patent number: 11716381
    Abstract: In some implementations, a device, using a browser extension of a browser application, may obtain the data from an application using a private endpoint of the application. The private endpoint of the application may be accessible via a private network in which the browser application is implemented and may not be accessible via a public network. The device, using the browser extension of the browser application, may transmit, to the cloud-based service, the data to cause the cloud-based service to populate a document with the data.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: August 1, 2023
    Assignee: Capital One Services, LLC
    Inventors: Anil Kumar Vallapureddy, Michael Baker, Brian Lin, Caroline Paul, Tyler Yandrofski, Anikeit Chanda, Alexander McQuilkin
  • Patent number: 11714392
    Abstract: Methods and systems for controlling a building. An illustrative method includes receiving sensor data from one or more sensors of the building, using the received sensor data to control one or more building management components to control one or more environmental conditions within the building, normalizing the sensor data and storing the normalized sensor data, comparing the normalized sensor data with normalized sensor data from one or more other buildings to identify one or more anomalies associated the building, and providing a recommended action to improve at least one of the one or more identified anomalies of the building.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: August 1, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Himanshu Khurana, John Cronin, Michael Baker, Jared P. Faber
  • Publication number: 20230234087
    Abstract: A repeatable manufacturing process uses a printer to deposits liquid for each product carried by a substrate to form respective thin films. The liquid is dried, cured or otherwise processed to form from the liquid a permanent layer of each respective product. To perform printing, each newly-introduced substrate is roughly mechanically aligned, with an optical system detecting sub-millimeter misalignment, and with software correcting for misalignment. Rendering of adjusted data is performed such that nozzles are variously assigned dependent on misalignment to deposit droplets in a regulated manner, to ensure precise deposition of liquid for each given area of the substrate. For example, applied to the manufacture of flat panel displays, software ensures that exactly the right amount of liquid is deposited for each “pixel” of the display, to minimize likelihood of visible discrepancies in the resultant display.
    Type: Application
    Filed: March 24, 2023
    Publication date: July 27, 2023
    Applicant: Kateeva, Inc.
    Inventors: Michael Baker, Nahid Harjee, Douglas Bacon
  • Publication number: 20230213421
    Abstract: A system and method for applying force to at least one device at least one force actuator including a processor accessing at least one description of the at least one device, the processor creating command information based at least on the at least one description, and a controller accessing the command information, the controller creating at least one motion command based on the command information, the controller issuing the at least one motion command, the motion command enabling the testing of the at least one device by controlling the at least one force actuator based on the at least one motion command.
    Type: Application
    Filed: January 2, 2023
    Publication date: July 6, 2023
    Inventors: Christopher C. LANGENFELD, Dirk A. VAN DER MERWE, Grant A. PERET, John C. ANASTASIOU, Jonathan PARKER, Michael A. BAKER
  • Publication number: 20230199250
    Abstract: Techniques are disclosed for characterizing audience engagement with one or more characters in a media content item. In some embodiments, an audience engagement characterization application processes sensor data, such as video data capturing the faces of one or more audience members consuming a media content item, to generate an audience emotion signal. The characterization application also processes the media content item to generate a character emotion signal associated with one or more characters in the media content item. Then, the characterization application determines an audience engagement score based on an amount of alignment and/or misalignment between the audience emotion signal and the character emotion signal.
    Type: Application
    Filed: March 22, 2022
    Publication date: June 22, 2023
    Inventors: Romann Matthew WEBER, Graziana MIGNONE, Jacek Krzysztof NARUNIEC, Aaron Michael BAKER, Farnood SALEHI, Dennis LI
  • Patent number: 11673155
    Abstract: A repeatable manufacturing process uses a printer to deposits liquid for each product carried by a substrate to form respective thin films. The liquid is dried, cured or otherwise processed to form from the liquid a permanent layer of each respective product. To perform printing, each newly-introduced substrate is roughly mechanically aligned, with an optical system detecting sub-millimeter misalignment, and with software correcting for misalignment. Rendering of adjusted data is performed such that nozzles are variously assigned dependent on misalignment to deposit droplets in a regulated manner, to ensure precise deposition of liquid for each given area of the substrate. For example, applied to the manufacture of flat panel displays, software ensures that exactly the right amount of liquid is deposited for each “pixel” of the display, to minimize likelihood of visible discrepancies in the resultant display.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: June 13, 2023
    Assignee: Kateeva, Inc.
    Inventors: Michael Baker, Nahid Harjee, Douglas Bacon