Patents by Inventor Michael C. Ayukawa

Michael C. Ayukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Routing under bond pad for the replacement of an interconnect layer
    Patent number: 8319343
    Abstract: The present invention provides a solder bump structure. In one aspect, the solder bump structure is utilized in a semiconductor device, such as an integrated circuit. The semiconductor device comprises active devices located over a semiconductor substrate, interconnect layers comprising copper formed over the active devices, and an outermost metallization layer positioned over the interconnect layers. The outermost metallization layer comprises aluminum and includes at least one bond pad and at least one interconnect runner each electrically connected to an interconnect layer. An under bump metallization layer (UBM) is located over the bond pad, and a solder bump is located over the UBM.
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: November 27, 2012
    Assignee: Agere Systems LLC
    Inventors: Vance D. Archer, III, Michael C. Ayukawa, Mark A. Bachman, Daniel P. Chesire, Seung H. Kang, Taeho Kook, Sailesh M. Merchant, Kurt G. Steiner
  • Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures
    Patent number: 7566964
    Abstract: An integrated circuit device structure and a process for fabricating the structure wherein the power bus interconnect structure is formed in the aluminum pad or contact layer. An interconnect structure for interconnecting underlying levels of interconnect can also be formed in the aluminum pad layer.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: July 28, 2009
    Assignee: Agere Systems Inc.
    Inventors: Seung H. Kang, Roland P. Krebs, Kurt George Steiner, Michael C. Ayukawa, Sailesh Mansinh Merchant
  • Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures
    Publication number: 20040201101
    Abstract: An integrated circuit device structure and a process for fabricating the structure wherein the power bus interconnect structure is formed in the aluminum pad or contact layer. An interconnect structure for interconnecting underlying levels of interconnect can also be formed in the aluminum pad layer.
    Type: Application
    Filed: September 30, 2003
    Publication date: October 14, 2004
    Inventors: Seung H. Kang, Roland P. Krebs, Kurt George Steiner, Michael C. Ayukawa, Sailesh Mansinh Merchant