Abstract: Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.

Abstract: An apparatus comprises one or more substrates and one or more coils. At least one of the coils is configured to produce a first magnetic field that induces eddy currents in a conductive target, which generates a reflected magnetic field. One or more magnetic field sensing elements supported by the one or more substrates detect the reflected magnetic field. A conductive support structure supports the one or more substrates. The support structure includes a gap in an area adjacent to the one or more coils so that the support structure does not generate a reflected magnetic field in response to the first magnetic field.

Abstract: A pressure sensor includes a chamber comprising a conductive portion and a deformable portion coupled to the conductive portion and susceptible to deformation in response to a pressure differential between an interior of the chamber and an exterior of the chamber; at least one coil responsive to an AC coil drive signal; at least one magnetic field sensing element disposed proximate to the at least one coil and to the conductive portion of the chamber and configured to generate a magnetic field signal in response to a reflected magnetic field generated by the at least one coil and reflected by the conductive portion; and a circuit coupled to the at least one magnetic field sensing element to generate an output signal of the pressure sensor indicative of the pressure differential between the interior of the chamber and the exterior of the chamber in response to the magnetic field signal.

Abstract: A magnetic field sensor includes a lead frame, a semiconductor die supporting a magnetic field sensing element, a non-conductive mold material enclosing the die and a portion of the lead frame, a ferromagnetic mold material secured to the non-conductive mold material and a securing mechanism to securely engage the mold materials. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet. The ferromagnetic mold material may be tapered and includes a non-contiguous central region, as may be an aperture or may contain the non-conductive mold material or an overmold material. Further embodiments include die up, lead on chip, and flip-chip arrangements, wafer level techniques to form the concentrator or bias magnet, integrated components, such as capacitors, on the lead frame, and a bias magnet with one or more channels to facilitate overmolding.

Abstract: Methods and apparatus for a signal isolator having a dielectric interposer supporting first and second die each having a magnetic field sensing element. A first signal path extends from the first die to the second die and a second signal path extends from the second die to the first die. In embodiments, the first signal path is located in the interposer and includes a first coil to generate a magnetic field and the second signal path is located in the interposer and includes a second coil to generate a magnetic filed. The first coil is located in relation to the second magnetic field sensing element of the second die and the second coil is located in relation to the first magnetic field sensing element of the first die.

Abstract: A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.

Abstract: In one aspect, an integrated circuit (IC) includes a magnetic field sensor to detect speed and direction of angular rotation of a rotating magnetic structure. The magnetic field sensor includes at least two magnetic field sensing elements configured to sense changes in a magnetic field caused by rotation of the magnetic structure. The IC also includes an output port configured to provide an output signal of the magnetic field sensor. A duty cycle percentage of the output signal indicates the speed and the direction or indicates a fault.

Abstract: In one aspect, an integrated circuit (IC) includes a magnetic field sensor to detect speed and direction of angular rotation of a rotating magnetic structure. The magnetic field sensor includes at least two magnetic field sensing elements configured to sense changes in a magnetic field caused by rotation of the magnetic structure. The IC also includes an output port configured to provide an output signal of the magnetic field sensor. The frequency of the output signal indicates the speed and the direction or indicates a fault.

Abstract: A pressure sensor includes a chamber comprising a conductive portion and a deformable portion coupled to the conductive portion and susceptible to deformation in response to a pressure differential between an interior of the chamber and an exterior of the chamber; at least one coil responsive to an AC coil drive signal; at least one magnetic field sensing element disposed proximate to the at least one coil and to the conductive portion of the chamber and configured to generate a magnetic field signal in response to a reflected magnetic field generated by the at least one coil and reflected by the conductive portion; and a circuit coupled to the at least one magnetic field sensing element to generate an output signal of the pressure sensor indicative of the pressure differential between the interior of the chamber and the exterior of the chamber in response to the magnetic field signal.

Abstract: An apparatus comprises one or more substrates and one or more coils. At least one of the coils is configured to produce a first magnetic field that induces eddy currents in a conductive target, which generates a reflected magnetic field. One or more magnetic field sensing elements supported by the one or more substrates detect the reflected magnetic field. A conductive support structure supports the one or more substrates. The support structure includes a gap in an area adjacent to the one or more coils so that the support structure does not generate a reflected magnetic field in response to the first magnetic field.

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element having differential first and second outputs and an input, the input to receive current and first and second switches coupled to a respective one of the differential first and second outputs. A first voltage source is coupled between the first and second switches, the first and second switches having a first state in which the first voltage source is coupled across the differential first and second outputs, and an IC output can output a voltage corresponding to the first voltage source when the first and second switches are in the first state for monitoring operation of a signal path from the magnetic sensing element to the IC output.

Abstract: An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element and fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition. In illustrative embodiments, a fault pin indicates the fault condition.

Abstract: An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.

Abstract: Described embodiments provide a device configured to be coupled to a shared bus. The device includes a magnetic field sensing element to sense a magnetic field. Upon receiving a configuration command over the shared bus, the device determines whether a parameter of the sensed magnetic field meets a predetermined criteria. If the parameter of the sensed magnetic field meets the predetermined criteria, the device responds to the configuration command by applying one or more configuration settings. Otherwise, if the parameter of the sensed magnetic field does not meet the predetermined criteria, the device ignores the configuration command.

Abstract: A network slave device includes a transceiver for communicating over a communication bus in accordance with a point-to-point network protocol. The network slave device may include an address to identify the network slave device on the network. It may also include a communication circuit configured to process a command received by the transceiver and generate a reply for transmission over the communication bus if an address included in the command matches the address of the slave device. A master device communicating on the network may send commands including the address of the slave device in accordance with the point-to-point network protocol. In an embodiment, the point-to-point protocol is the SENT protocol.

Abstract: A system includes a magnetic target and a magnetic field sensor. The magnetic field sensor comprises an output node; a circuit to detect a magnetic field produced by the magnetic target; and a processor. The processor may be configured to transmit a signal onto the output node representing the detected magnetic field; detect whether the transmitted signal is interrupted by an external source; and, if the signal is interrupted, initiate a self-test of the apparatus. Corresponding methods and apparatuses are also disclosed.

Abstract: Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.

Abstract: Described embodiments provide a device configured to be coupled to a shared bus. The device includes a magnetic field sensing element to sense a magnetic field. Upon receiving a configuration command over the shared bus, the device determines whether a parameter of the sensed magnetic field meets a predetermined criteria. If the parameter of the sensed magnetic field meets the predetermined criteria, the device responds to the configuration command by applying one or more configuration settings. Otherwise, if the parameter of the sensed magnetic field does not meet the predetermined criteria, the device ignores the configuration command.