Abstract: Memory devices and systems with post-packaging master die selection, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plurality of memory dies. Each memory die of the plurality includes a command/address decoder. The command/address decoders are configured to receive command and address signals from external contacts of the memory device. The command/address decoders are also configured, when enabled, to decode the command and address signals and transmit the decoded command and address signals to every other memory die of the plurality. Each memory die further includes circuitry configured to enable, or disable, or both individual command/address decoders of the plurality of memory dies. In some embodiments, the circuitry can enable a command/address decoder of a memory die of the plurality after the plurality of memory dies are packaged into a memory device.

Abstract: The present invention relates to a bilayer mouthguard fabricated from a high impact thermoplastic polymer blend having the ability to absorb, attenuate, and dissipate shock forces and a method of fabricating a mouthguard. The present invention utilizes a polymer blend comprising ethylene vinyl acetate and a thermoplastic urethane. The bilayer mouthguard has a U-shape base and is defined by inner lingual and outer labial walls, a channel for receiving the upper jaw and teeth, cushion pads laying within the U-shape base, and in certain designs a transition support portion extending forward from the posterior cushion pads connecting with an anterior impact brace that extends into the outer labial wall.