Patents by Inventor Michael Camillo Weller

Michael Camillo Weller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for micro BGA removal and reattach
    Patent number: 6425515
    Abstract: A method for attaching an electronic device to and removing an electronic device from a substrate includes verifying a position of a pick-up and vacuum head relative to the electronic device prior to contacting the electronic device with the pick-up and vacuum head; contacting the electronic device with a device for conductively applying heat to the electronic device and picking up the electronic device; and heating solder for attaching the electronic device to the substrate to a reflow temperature of the solder by applying heat to the device for conductively applying heat.
    Type: Grant
    Filed: February 1, 2001
    Date of Patent: July 30, 2002
    Assignee: International Business Machines Corporation
    Inventors: Allen Thomas Mays, Kris Allan Slesinger, Michael Camillo Weller
  • Micro grid array solder interconnection structure with solder columns for second level packaging joining a module and printed circuit board
    Patent number: 6380494
    Abstract: A solder interconnection between a module and printed circuit board or card is provided by a plurality of solder connections arranged in a micro grid array joining solder wettable pads on a major surface of the module to a corresponding set of solder wettable pads of the printed circuit board or card. The solder connections are column shaped with the height of each connection being at least about 1.4 times the diameter of the connection.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: April 30, 2002
    Assignee: International Business Machines Corporation
    Inventors: Allen Thomas Mays, Kris Allan Slesinger, Michael Camillo Weller
  • MICRO GRID ARRAY SOLDER INTERCONNECTION STRUCTURE WITH SOLDER COLUMNS FOR SECOND LEVEL PACKAGING JOINING A MODULE AND PRINTED CIRCUIT BOARD
    Publication number: 20020029901
    Abstract: A solder interconnection between a module and printed circuit board or card is provided by a plurality of solder connections arranged in a micro grid array joining solder wettable pads on a major surface of the module to a corresponding set of solder wettable pads of the printed circuit board or card. The solder connections are column shaped with the height of each connection being at least about 1.4 times the diameter of the connection.
    Type: Application
    Filed: April 27, 2000
    Publication date: March 14, 2002
    Inventors: Allen Thomas Mays, Kris Allan Slesinger, Michael Camillo Weller
  • Micro grid array solder interconnection structure for second level packaging joining a module and a printed circuit board
    Patent number: 6340111
    Abstract: A solder interconnection between a module and printed circuit board or card is provided by a plurality of solder connections arranged in a micro grid array joining solder wettable pads on a major surface of the module to a corresponding set of solder wettable pads of the printed circuit board or card. The solder connections are column shaped with the height of each connection being at least about 1.4 times the diameter of the connection.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: January 22, 2002
    Assignee: International Business Machines Corporation
    Inventors: Allen Thomas Mays, Kris Allan Slesinger, Michael Camillo Weller
  • Method and apparatus for muBGA removal and reattach
    Publication number: 20010017313
    Abstract: An apparatus for attaching an electronic device to and removing an electronic device from a substrate. An electronic device pick-up and vacuum head applies a vacuum source to the electronic device for engaging, picking up and retaining the electronic device. The heat is transmitted by conduction through the structure of the device pick-up and vacuum head to the electronic device and solder for securing the electronic device on the substrate to heat the solder to its reflow temperature. The pick-up and vacuum head includes an electronic device engaging portion, a vacuum port, and a heat source engaging portion.
    Type: Application
    Filed: February 1, 2001
    Publication date: August 30, 2001
    Applicant: International Business Machines Corporation
    Inventors: Allen Thomas Mays, Kris Allan Slesinger, Michael Camillo Weller
  • Method and apparatus for &mgr;BGA removal and reattach
    Patent number: 6196439
    Abstract: An apparatus for attaching an electronic device to and removing an electronic device from a substrate. An electronic device pick-up and vacuum head applies a vacuum source to the electronic device for engaging, picking up and retaining the electronic device. The heat is transmitted by conduction through the structure of the device pick-up and vacuum head to the electronic device and solder for securing the electronic device on the substrate to heat the solder to its reflow temperature. The pick-up and vacuum head includes an electronic device engaging portion, a vacuum port, and a heat source engaging portion.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: March 6, 2001
    Assignee: International Business Machines Corporation
    Inventors: Allen Thomas Mays, Kris Allan Slesinger, Michael Camillo Weller
  • Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board
    Patent number: 6059173
    Abstract: A solder interconnection between a module and printed circuit board or card is provided by a plurality of solder connections arranged in a micro grid array joining solder wettable pads on a major surface of the module to a corresponding set of solder wettable pads of the printed circuit board or card. The solder connections are column shaped with the height of each connection being at least about 1.4 times the diameter of the connection.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: May 9, 2000
    Assignee: International Business Machines Corporation
    Inventors: Allen Thomas Mays, Kris Allan Slesinger, Michael Camillo Weller