Abstract: An arrangement for testing substrate material intended for use in surface acoustic wave devices such as delay lines; the arrangement includes a plurality of electrical and physical evaluations of the material in quantities suitable for a manufacturing environment. In one evaluation acoustic wave energy developed in a tooling jig mounted transducer is mechanically coupled to successive material samples and the resulting output waveforms compared to expected results while in other evaluations the polarized light indicia and chemical reagent determined properties of the material samples are considered.

Abstract: Wafer probing apparatus especially adapted to probing surface acoustic wave (SAW) device die such as delay lines is disclosed; the apparatus includes a probe card especially suited to the radio frequency and multiple output nature of a SAW delay line together with a computer-aided electronic system for exciting the delay line and evaluating its output.

Abstract: A thick film device conductor arrangement suitable for making connections between a resiliently mounted element such as a surface acoustic delay line and adjacent thick film conductors and then with the device connecting pins. The thick film conductors include a double layer structure of differing noble metals each selected for desirable properties in designated areas of the device.