Abstract: Portable computer battery structures are provided. The portable computer battery structures may include a battery with a metal enclosure and a battery cable with a floating end. The battery may have six cells. Three pairs of parallel-connected cells may be connected together in series. The six cells may be substantially planar in shape. The battery may have a connector with at least five conductive pins and six recesses. The battery cable may have a cable with at least five conductive pins that mate with the five pins of the battery's connector and with six support pins that slide into the six recesses of the battery's connector. The batter connector may be formed on a printed circuit board substrate that folds over on itself.

Abstract: The various embodiment provide fastening devices, systems and methods that utilize two or more maxels in respective correlated magnetic structures provided in a first structure and at least one second structure to fasten or repulse the first structure to or from, as the case may be, the at least one second structure. In at least one embodiment, each maxel is programmable and may vary either or both the polarity and magnetic strength of the given maxel. The variance of the polarity and/or magnetic strength of the given maxel may be programmable and may be varied to attract or repulse a second magnetic structure which desirably also contains one or maxels forming a correlated magnetic structure.

Abstract: A plug or connector including a coded magnet and an electrical contact. As the plug approaches a corresponding port, the coded magnet interacts with a magnet within the port. The interaction between the plug coded magnet and the port coded magnet provides a force to connect and/or align the plug with the port. Once the plug is received within the port, if a process is completed, the coded magnets polarities are altered to eject the plug from the port.

Abstract: A display system with a distributed LED backlight includes: providing a plurality of tile LED light sources, each tile LED light source having a tile and a plurality of similar LED light sources on each tile connected for emitting light therefrom; orienting the plurality of tile LED light sources for illuminating a display from the back of the display; and integrating the plurality of tile LED light sources into a thermally and mechanically structurally integrated distributed LED tile matrix backlight light source.

Abstract: Security devices and methods of securely coupling electronic devices and peripherals are provided. In one embodiment, a peripheral has a first coded magnet on a first surface of a first device. The first coded magnet has at least two different polarity regions on the first surface. A second coded magnet on a second surface of a second device is also provided. The first coded magnet is configured to securely provide data to a device associated with the second coded magnet, if the first and second coded magnets' patterns are keyed to one another.

Abstract: Connectors and methods of coupling electronic devices and cables are provided. In one embodiment, a connector has a first coded magnet on a first surface of a first device. The first coded magnet has at least two different polarity regions on the first surface. A second coded magnet on a second surface of a second device is also provided. The second coded magnet is configured to provide identifying information regarding the device on which it is located.

Abstract: The disclosed embodiments relate to the design of a portable and cost-effective fuel cell system for a portable computing device. This fuel cell system includes a fuel cell stack which converts fuel into electrical power. It also includes a fuel source for the fuel cell stack and a controller which controls operation of the fuel cell system. The fuel system also includes an interface to the portable computing device, wherein the interface comprises a power link that provides power to the portable computing device, and a bidirectional communication link that provides bidirectional communication between the portable computing device and the controller for the fuel cell system.

Abstract: The disclosure identified as methods of mounting integrated circuits, including solar cells, to a substrate wherein the circuits are mounted prior to being singulated into discrete die. Once the semiconductor die sites or other circuits are formed on a wafer, the wafer will be attached, either whole, or divided into one or more multi-die site wafer segments, to a substrate. This attachment may be by conventional surface mount technology, for example. After such mounting, the individual die sites on the wafer segments will be singulated to form discrete die already mounted to the supporting substrate. The singulation may be preferably performed by laser dicing of the wafer segments.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: A portable computing device having an outer housing, and internal hard disk drive and a shock damping mounting assembly is disclosed. Multiple outer dimensions of the portable computing device can be less than the width of the hard drive due to a diagonal arrangement of the hard drive within the overall device. The hard drive can comply with a standardized form factor, such as a 3.5 inch form factor. A mounting assembly located within the outer housing and coupled to the hard drive can include one or more components adapted to damp a mechanical shock to the hard drive, which components can be mounted to corners and/or edges of the hard drive. Mounting assembly components can includes a first stage spring comprising a finger geometry that provides initial damping of the mechanical shock and a second stage spring comprising an elastic block that provides final damping of the mechanical shock.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: The present invention is a computer controlled display device. In one embodiment, the display device includes a flat panel display having an input for receiving display data. Additionally, a moveable assembly may be coupled to the display. The moveable assembly may provide at least three degrees of freedom of movement for the flat panel display device. Additionally, the moveable assembly may have a cross-sectional area, which is substantially less than a cross-sectional area of a display structure of the flat panel display.

Abstract: Portable computer battery structures are provided. The portable computer battery structures may include a battery with a metal enclosure and a battery cable with a floating end. The battery may have six cells. Three pairs of parallel-connected cells may be connected together in series. The six cells may be substantially planar in shape. The battery may have a connector with at least five conductive pins and six recesses. The battery cable may have a cable with at least five conductive pins that mate with the five pins of the battery's connector and with six support pins that slide into the six recesses of the battery's connector. The batter connector may be formed on a printed circuit board substrate that folds over on itself.

Abstract: The disclosure identified as methods of mounting integrated circuits, including solar cells, to a substrate wherein the circuits are mounted prior to being singulated into discrete die. Once the semiconductor die sites or other circuits are formed on a wafer, the wafer will be attached, either whole, or divided into one or more multi-die site wafer segments, to a substrate. This attachment may be by conventional surface mount technology, for example. After such mounting, the individual die sites on the wafer segments will be singulated to form discrete die already mounted to the supporting substrate. The singulation may be preferably performed by laser dicing of the wafer segments.

Abstract: Embodiments of an apparatus are described. This apparatus includes a semiconductor-die layer mechanically coupled to a semiconductor die, and a heat-removal-device layer mechanically coupled to a heat-removal device. Moreover, a thermal-interface material is included between the semiconductor die and the heat-removal device, where the thermal-interface material is mechanically coupled to a region of the semiconductor-die layer and to a region of the heat-removal-device layer. Additionally, a boundary material is mechanically coupled to the semiconductor-die layer and the heat-removal-device layer, where the thermal-interface material is contained in a cavity defined, at least in part, by the semiconductor-die layer, the boundary material, and the heat-removal-device layer.

Abstract: Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.

Abstract: Embodiments of an apparatus that functions as a storage system for components are described. This apparatus includes a containment vessel enclosing a desiccant and a device. This device includes a layer mechanically coupled to a component, where the component can be one of a semiconductor die and a heat-removal device. Moreover, a thermal-interface material is coupled to a region of the layer, and a boundary material is mechanically coupled to the layer, where a perimeter defined by the boundary-material surrounds the region.

Abstract: A display system with a distributed LED backlight includes: providing a plurality of tile LED light sources, each tile LED light source having a tile and a plurality of similar LED light sources on each tile connected for emitting light therefrom; orienting the plurality of tile LED light sources for illuminating a display from the back of the display; and integrating the plurality of tile LED light sources into a thermally and mechanically structurally integrated distributed LED tile matrix backlight light source.