Patents by Inventor Michael F. B. Bellersen

Michael F. B. Bellersen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having a semiconductor body embedded in an envelope made of synthetic material
    Patent number: 5117278
    Abstract: Semiconductor device with a wiring pattern 3, 6 is provided with an insulating layer 4 embedded in an envelope 5 made of synthetic material. To prevent hair cracks in the insulating layer 4, the thickness of the insulating layer 4 is so chosen that the lowest point of top 8 of the insulating layer 4 is at a higher leverl than the highest point of the wiring pattern 3, 6.
    Type: Grant
    Filed: June 6, 1991
    Date of Patent: May 26, 1992
    Assignee: U.S. Philips Corporation
    Inventors: Michael F. B. Bellersen, Wilhelmus F. M. Gootzen
  • Method of manufacturing a semiconductor device by forming insulating side walls with voids below overhangs
    Patent number: 5001079
    Abstract: Spaced-apart regions (2) each having top (2a) and side walls (2b) meeting at an edge (20) are defined on a surface (1a) of a substructure (1) forming part of the device. A layer (3) of insulating material is provided over the surface (1a) and regions (2), so that the insulating material is provided preferentially at the edges (20) of the regions (2) to form adjacent the edges (20) portions (31) of the insulating material which overhang the underlying insulating material (32) provided on the surface (1a) and define a void therein. The insulating material layer (3) is then etched anisotropically to expose the top walls (2a).
    Type: Grant
    Filed: June 20, 1989
    Date of Patent: March 19, 1991
    Inventors: Josephus M. F. G. Van Laarhoven, Wilhelmus F. M. Gootzen, Michael F. B. Bellersen, Trung T. Doan