Patents by Inventor Michael F. Lafaro

Michael F. Lafaro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120083125
    Abstract: Planarization methods include depositing a mask material on top of an overburden layer on a semiconductor wafer. The mask material is planarized to remove the mask material from up areas of the overburden layer to expose the overburden layer without removing the mask material from down areas. The exposed overburden layer is wet etched and leaves a thickness remaining over an underlying layer. Remaining portions of the mask layer and the exposed portions of the overburden layer are planarized to expose the underlying layer.
    Type: Application
    Filed: January 25, 2011
    Publication date: April 5, 2012
    Applicants: JSR CORPORATION, INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Leslie Charns, John M. Cotte, Jason E. Cummings, Lukasz J. Hupka, Dinesh R. Koli, Tomohisa Konno, Mahadevaiyer Krishnan, Michael F. Lafaro, Jakub W. Nalaskowski, Masahiro Noda, Dinesh K. Penigalapati, Tatsuya Yamanaka