Abstract: Various embodiments of a voltage detection device and of related safety systems are provided. In various embodiments, the voltage detection device is configured to couple to safety headwear, such as via the one or more housing(s) of the voltage detection device coupling directly to the safety headwear or the voltage detection device coupling to an adaptor mounted to the hard hat.

Abstract: A cold press and a method for the production of green compacts for diamond-containing tool segments includes a tool matrix, a top ram and a bottom ram assigned to a matrix adapter from opposite directions for the purpose of compressing sinterable metal powder and diamond granules after both of these materials have been fed to the matrix adapter. Step-by-step build-up of the green compact is carried out in such a manner that after one layer of metal powder and one layer of diamond granulate have been charged, these layers are together compressed.

Abstract: The invention relates to a cylinder head (1) of an internal combustion engine, comprising at least one hollow camshaft (2) which forms an exhaust for blow-by gases containing oil mist from the crank housing and is also embodied as an oil mist pre fractionator for the preliminary separation of the oil part from these gases. Furthermore, an oil mist post-fractionator (5) is axially arranged on the end of the camshaft (2), in order to carry out an especially effective separation of oil dissolved in the blow-by gases.

Abstract: A positive crankcase ventilation oil mist separator system has a first separator unit, wherein the first separator unit includes at least one filter body arranged in a blow-by gas path such that blow by gas flows through the filter body; a second separator unit, wherein the second separator is an impactor separator arranged in a bypass path that bypasses the first separator unit; and a bypass valve, which opens the bypass path as soon as a differential pressure at the first separator unit exceeds a predefined value, wherein the second separator unit comprises an impact wall formed by a section of the filter body of the first separator unit, and a flow directing element which directs the blow-by gas flow against the impact wall when the blow-by gas path is open.

Abstract: A device has a first terminal, second terminal and at least four lateral faces provided with contact areas, of which two respective ones each are mutually opposite. The contact areas of the mutually opposite lateral faces are connected to different ones of the first and second terminals.

Abstract: The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible.

Abstract: A cold press and a method for the production of green compacts for diamond-containing tool segments, comprising a tool matrix and a top ram and a bottom ram assigned to a matrix adapter from opposite directions for the purpose of compressing sinterable metal powder and diamond granules after both of these materials have been fed to the matrix adapter is known. In the present invention, step-by-step build-up of the green compact is carried out in such a manner that after one layer of metal powder and one layer of diamond granulate have been charged, these layers are together compressed. The use thereof for producing diamond-containing cutting segments of saw blades for building machinery.

Abstract: The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible.

Abstract: A positive crankcase ventilation oil mist separator system has a first separator unit, wherein the first separator unit includes at least one filter body arranged in a blow-by gas path such that blow by gas flows through the filter body; a second separator unit, wherein the second separator is an impactor separator arranged in a bypass path that bypasses the first separator unit; and a bypass valve, which opens the bypass path as soon as a differential pressure at the first separator unit exceeds a predefined value, wherein the second separator unit comprises an impact wall formed by a section of the filter body of the first separator unit, and a flow directing element which directs the blow-by gas flow against the impact wall when the blow-by gas path is open.

Abstract: The invention relates to a cylinder head (1) of an internal combustion engine, comprising at least one hollow camshaft (2) which forms an exhaust for blow-by gases containing oil mist from the crank housing and is also embodied as an oil mist pre fractionator for the preliminary separation of the oil part from these gases. Furthermore, an oil mist post-fractionator (5) is axially arranged on the end of the camshaft (2), in order to carry out an especially effective separation of oil dissolved in the blow-by gases.

Abstract: A device has a first terminal, second terminal and at least four lateral faces provided with contact areas, of which two respective ones each are mutually opposite. The contact areas of the mutually opposite lateral faces are connected to different ones of the first and second terminals.

Abstract: The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible.

Abstract: In a method of connecting a chip and a substrate, an adhesive having conductive particles is initially provided. The chip and the substrate each include at least one pad on one appropriate side. The adhesive is applied onto one side of the substrate or onto one side of the chip, and the chip and the substrate are connected, the pads being aligned one below the other. Subsequently, this arrangement is pressurized such that in the region between the pads of the chip and the substrate, local compaction of the adhesive results, and the conductive particles adhere to the pads. Finally, the adhesive is hardened.

Abstract: The focal surface for an opto-electronic imaging system includes an arrangement of detectors for image recording and a detector carrier or a FPA carrier for holding the detectors. The detectors are each made of at least one solid state element that is bonded to a flexible carrier substrate. The focal surface, or the detectors, respectively, exhibits a curvature, such that a curved field of view can be recorded. In a method for manufacturing a focal surface for opto-electronic imaging systems, at least one solid state element is bonded to a flexible carrier substrate to form flexible detectors, whereby a detector carrier provides a curvature and the flexible detectors are adapted to the curvature of the detector carrier. To manufacture a detector according to the present invention, a solid state element is thinned and bonded to a flexible carrier substrate, such that it is formed in a flexible manner and can be adapted to a curvature of a field of view.

Abstract: In a method of dicing a wafer, which comprises a plurality of individual circuit structures, a trench is first defined between at least two circuit structures on one face of the wafer. Subsequently, the trench is deepened down to a defined depth. Following this, one face of the wafer has fixed thereto a re-detachable intermediate support composed of a fixed intermediate support substrate and an adhesive medium which is applied to said intermediate support substrate and which can specifically be modified in terms of its adhesive strength, whereupon the wafer is dry-etched from the opposite face so that circuit chips are obtained which are connected to one another only via the intermediate support. Subsequently, the circuit chips are removed from the intermediate support.

Abstract: In a method for vertically integrating active circuit planes, a first substrate having at least one integrated circuit in a first main surface thereof and further having connecting areas for the integrated circuit as well as outer connecting areas on the first main surface is provided in a first step. A second substrate having at least one integrated circuit in a first main surface thereof and further having connecting areas for the integrated circuit as well as open or openable areas on the first main surface is provided. The first main surfaces of the first and second substrates are joined in such a way that the connecting areas of the first substrate are connected to those of the second substrate in an electrically conductive manner in such a way that the outer connecting areas of the first substrate are in alignment with the open or openable areas of the second substrate. Subsequently, the second substrate is thinned and the outer connecting areas are exposed through the open or openable areas.

Abstract: In a method for contacting a circuit chip containing an integrated circuit of a thickness less than 50 &mgr;m, which has at least two pads on a first main surface, the circuit chip is first of all placed onto a main surface of a support substrate with a second main surface which faces this first main surface, in such a way that the entire thickness of the circuit chip protrudes from the surface of the support substrate. A structured metallic coating is then applied to the first main surface of the circuit chip and the surface of the support substrate by means of screen printing or stamping, in order to connect the pads of the circuit chip to a conductor structure located on the main surface of the support substrate.

Abstract: The focal surface for an opto-electronic imaging system includes an arrangement of detectors for image recording and a detector carrier or a FPA carrier for holding the detectors. The detectors are each made of at least one solid state element that is bonded to a flexible carrier substrate. The focal surface, or the detectors, respectively, exhibits a curvature, such that a curved field of view can be recorded. In a method for manufacturing a focal surface for opto-electronic imaging systems, at least one solid state element is bonded to a flexible carrier substrate to form flexible detectors, whereby a detector carrier provides a curvature and the flexible detectors are adapted to the curvature of the detector carrier. To manufacture a detector according to the present invention, a solid state element is thinned and bonded to a flexible carrier substrate, such that it is formed in a flexible manner and can be adapted to a curvature of a field of view.