Abstract: A DC/DC converter circuit to be used in the field of MPPT for solar inverters, for step-up DC/DC conversion for high output voltages, and for chargers in electrical vehicles. The circuit comprises a first DC terminal and a second DC terminal, a first DC voltage being defined there between. It further comprises a positive split DC terminal and a midpoint terminal, a positive split DC voltage being defined there between. A negative split DC terminal is provided, a negative split DC voltage being defined between said negative split DC terminal and said midpoint terminal. A first switch and a second switch are provided, and a converter inductance is storing electric energy therein. A first diode is connected between a first terminal of said first switch and said positive split DC terminal, and a second diode is coupled between an internal midpoint and said midpoint terminal.

Abstract: The present invention generally relates to power electronic switching circuits and in particular to inverter modules employing two or more controlled switches that can be used with reactive loads. An inverter circuit is provided which comprises first and second input terminals for being connected to a DC power source; first and second output terminals for outputting an AC voltage; at least one metal oxide semiconductor field effect transistor, MOSFET, having a parasitic body diode. The inverter circuit further comprises at least one disabling element for disabling said body diode. This may result in an improved efficiency of the inverter circuit in combination with a reactive power capability. Further, a semiconductor switching device is disclosed, comprising at least one metal oxide semiconductor field effect transistor, MOSFET, and at least one insulated gate bipolar transistor, IGBT, wherein said MOSFET and said IGBT are connected in parallel.

Abstract: The present invention relates to power modules for controlling an input current to provide an output current, in particular, to such a power module (100) comprising at least one semiconductor switch for controlling the input current and a circuit substrate. The circuit substrate (108, 110) has at least one input terminal for being connected to an input voltage and at least one output terminal for outputting the output voltage. The input terminal and the output terminal are connected to each other via a main current path (104) that is controlled by the semiconductor switch. Said power module further comprises at least one transient current path (102) with extremely low inductivity for carrying a transient current during a switching operation of the semiconductor switch. The main path for the continuous current has a low ohmic resistance, but does not have to be designed to have a specifically low inductance.

Abstract: The present invention relates to a power unit comprising at least one power electronics module, a circuit carrier, which is connected to said power electronics module, and at least one heat sink, which is connected to said power electronics module, in order to dissipate heat. The invention also relates to an associated heat sink and a corresponding assembly method. In order to provide a power unit and an associated assembly method which allows improved dissipation of air heat, as well as adequate electrical insulation of the power modules and simplified implementation, the circuit carrier comprises at least one through hole. At least one contact extension located on the heat sink, which is at least partially received by the through hole. The contact extension of the heat sink is thermally contacted with the power electronics module by means of a heat-conductive material.

Abstract: A method for manufacturing a ring (i.e. class, championship, or affiliation) begins by receiving order data specifying a series of personalization elements, such as the addition of text and icon designs. A geometric model for each personalization item is constructed. To assemble text panels, the operating system provides font geometry for a desired TrueType font. Then a set of splines are created from the font geometry and are then tessellated to generate polyline sets of data, which are then spaced and mapped between two boundary curves. The personalization elements are then projected onto one of the model's 3D surfaces. A set of machining instructions for a milling machine is generated by obtaining a set of machining pattern strategies, generating a set of curves, projecting the toolpath onto the surface of the ring to calculate the 3D toolpath, and rotating it to a desired angle.

Abstract: A rectifier circuit having a power factor correction and providing a DC output is disclosed. AC power having an AC oscillation is supplied at two or more AC inputs. The rectifier circuit includes at least two power factor correction stages which are directly coupled to one or more of the AC inputs, wherein each of the power factor correction stages controls a flow of current through the one or more coupled AC inputs so that the power factor is optimized. The power factor correction stages are designed to operate during different half waves of the AC oscillation with respect to one or more of the AC inputs.

Abstract: The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage module is thermally connected to the cooling body in order to temporarily store the heat generated by the integrated circuit and to convey it to the cooling body. The integrated circuit has at least one semiconductor component which is assembled on a substrate and the substrate is in direct thermal contact with the latent heat storage module.

Abstract: An electronic module has a semiconductor arranged on a substrate. The semiconductor has an electrically conductive contact face on a side remote from the substrate. A contacting unit is configured to be at least partially elastically yielding. A support element is configured to press the contacting unit toward the substrate to make electrical contact. The contacting unit contacts the substrate and/or the contact face.

Abstract: The present invention relates to a power unit comprising at least one power electronics module, a circuit carrier, which is connected to said power electronics module, and at least one heat sink, which is connected to said power electronics module, in order to dissipate heat. The invention also relates to an associated heat sink and a corresponding assembly method. In order to provide a power unit and an associated assembly method which allows improved dissipation of air heat, as well as adequate electrical insulation of the power modules and simplified implementation, the circuit carrier comprises at least one through hole. At least one contact extension located on the heat sink, which is at least partially received by the through hole. The contact extension of the heat sink is thermally contacted with the power electronics module by means of a heat-conductive material.

Abstract: The power part and the logic part of the module are arranged on different substrates. The circuit board (5) of the logic part has a recess (6) in which the power substrate (2) is located and electrically connected to the logic part by wire bonding techniques (7).

Abstract: The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage module is thermally connected to the cooling body in order to temporarily store the heat generated by the integrated circuit and to convey it to the cooling body. The integrated circuit has at least one semiconductor component which is assembled on a substrate and the substrate is in direct thermal contact with the latent heat storage module.

Abstract: An electronic module has a semiconductor arranged on a substrate. The semiconductor has an electrically conductive contact face on a side remote from the substrate. A contacting unit is configured to be at least partially elastically yielding. A support element is configured to press the contacting unit toward the substrate to make electrical contact. The contacting unit contacts the substrate and/or the contact face.

Abstract: The power substrate is inserted in a housing (1) as base plate and together with the same forms a standardized power part from whose top side (11) there are projecting terminal pins (5) which are soldered by through-soldering to via holes of the board (4). The circuit board (4), in a strip portion (6) thereof that remains free, has contact pads (7) as control and power terminals by means of which the module can be soldered directly into the slot-like opening of a system circuit board (8).