Abstract: An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. The EMI shielding material is made up of, but not limited to a broadband biopolymer or polymer dissolved in organic solvents and shielding guest material. The specific makeup of the shielding material and fabrication procedure of the shielding material is also included herein.

Abstract: A thin multi-passage cooler that produces an isothermal heating surface, high heat transfer coefficients, without producing an excessive pressure drop across the coolant passages. The cooler having a plurality of first passages in fluid communication with a plurality of second passages. A coolant flows through the second passages and then through first passages which are in close proximity to a heating source. The first and second passages are oriented and connected such that the direction of coolant flow in the first passages is opposite to the direction of flow in the second passages. To promote high heat transfer coefficients the passages are constructed to have large length to width ratios and small hydraulic diameters.

Abstract: An enhanced capillary assisted evaporative surface for use in heat transfer devices; such as, 2-phase mounting plates, heat pipes and collectors. Rectangular grooves are cut in a conductive substrate and then plated by vapor deposition. The process produces a necked-down opening in the groove and a dendritic surface improving both capillary pumping and heat transfer coefficients.

Abstract: A wick-fin heat pipe for increasing the performance of heat pipe evaporators and condensers having extended areas with high thermal conductivity material which increase the heat transfer and decrease the temperature drop. The wick-fin heat pipe provides transporting large amounts of heat with small temperature drop and is capable of accommodating large heat fluxes.