Abstract: An apparatus to improve upon the problem of mismatched CTEs in electrical circuits comprises a small heat sink (206), a substrate (202), and an aperture existing within the substrate (202). The heat sink (206) is located on one side of the substrate (202) in a location substantially overlapping the aperture (204). The transistor (106) is coupled to the heat sink (206) and extends through the aperture (204). The apparatus reduces manufacturing costs since no exotic bonding agents are needed to accommodate for the mismatch in CTEs. Additionally, the apparatus reduces the number of substrates required during the manufacturing process, and allows for the heat sink (206) to be soldered in an automated fashion to the bottom of the substrate (202) in much the same way component parts are reflowed onto the top of a printed circuit board.

Abstract: A mounting assembly for attachment to a housing comprising a bracket (10) having two side supports (14) separated by a horizontal bottom support (11) and at least one set of spacers (16, 18) having self-retaining means for connecting the spacers to one of the side supports (14) of the bracket (10). A ribbed extension (44) is disposed on an outside of one of the spacers (18) for slideably attaching to the housing (10). The spacers (16, 18) include means for incrementally rotating one of the spacers (18) with respect to the bracket (10) thus incrementally rotating the housing (10) when the housing (10) is attached to the spacers (16, 18).

Abstract: A switch assembly comprises a substrate (10) having conductive traces providing contacts (23) on the substrate (10) and a connector (21) positioned over the substrate (10). The connector (10) includes an actuator area (33) and a selectively conductive area (22) located perpendicular to the actuator area (33). The selectively conductive area (22) is located over the contacts (23) and is made electrically conductive with the contacts (23), when the connector (21) is shorted with an actuator, the actuator area being at a fight angle to the conductive traces.

Abstract: A surface mountable, high current resistor (20) is formed generally in the shape of an inverted "U". The top portion (22) of the inverted "U" is flat and contains one or more openings (26, 27) that serve to alter the resistivity of the resistor. The openings are formed so as to be inverted mirror images of each other, thereby cancelling inductive effects introduced by the openings. The ends of the "U" are formed into two or more legs (24) that serve to provide stability and a mounting area for soldering the resistor to a printed circuit board. A flat, unbroken portion (28) in the center of the resistor serves as a convenient area to handle the resistor with a vacuum tool during printed circuit assembly.

Abstract: An EMI/RFI shield (10) comprises a box like structure formed of a metal integral member having a plurality of apertures (16) formed therethrough. The apertures (16) are of a size appropriate to substantially pass infrared energy (22) and to substantially block EMI/RFI energy (26). When placed on a substrate (18), infrared energy (22) can be utilized to reflow solder a device (19) encapsulated by the shield (10) to the substrate (18).