Abstract: Fabricate a panel (5) by building a sacrificial relief (10) by an additive process of multilayer deposition, applying a facade layer (20,30) over the sacrificial relief so as to conform to the contour of the sacrificial relief, depositing a foamable composition (40, 50, 60) over the facade layer.

Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

Abstract: The present invention is premised upon a connector device and method that can more easily electrically connect a plurality of PV devices or photovoltaic system components and/or locate these devices/components upon a building structure. It also may optionally provide some additional sub-components (e.g. at least one bypass diode and/or an indicator means) and may enhance the serviceability of the device.

Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

Abstract: The present invention is premised upon a connector device and method that can more easily electrically connect a plurality of PV devices or photovoltaic system components and/or locate these devices/components upon a building structure. It also may optionally provide some additional sub-components (e.g. at least one bypass diode and/or an indicator means) and may enhance the serviceability of the device.

Abstract: The present invention is premised upon a connector device and method that can more easily electrically connect a plurality of PV devices or photovoltaic system components and/or locate these devices/components upon a building structure. It also may optionally provide some additional sub-components (e.g. at least one bypass diode and/or an indicator means) and may enhance the serviceability of the device.

Abstract: A building structure includes a framework of: (a) metal studs having walls that define an interior channel; (b) a cellular backing material extending lengthwise within the interior channel of at least a portion of the metal studs; (c) a thermally insulating layer extending over multiple metal studs; (d) fasteners extending through the thermally insulating layer, through a wall of a metal stud and into the cellular backing material within the interior channel of the metal stud; and (e) a cladding attached to the framework of metal studs by means of the fasteners.

Abstract: A building structure includes a framework of: (a) metal studs having walls that define an interior channel; (b) a cellular backing material extending lengthwise within the interior channel of at least a portion of the metal studs; (c) a thermally insulating layer extending over multiple metal studs; (d) fasteners extending through the thermally insulating layer, through a wall of a metal stud and into the cellular backing material within the interior channel of the metal stud; and (e) a cladding attached to the framework of metal studs by means of the fasteners.

Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ?-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about ?35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/?-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ?-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about ?35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/?-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

Abstract: Multilayer foam-film composite structures in which the cells of at least one foam layer have an anisotropic orientation exhibit at least one enhanced property of toughness, tear resistance and puncture resistance in comparison with a foam-film composite structure alike in all aspects except for the anisotropic orientation of the cells of at least one foam layer.

Abstract: Multilayer foam-film composite structures in which the cells of at least one foam layer have an anisotropic orientation exhibit at least one enhanced property of toughness, tear resistance and puncture resistance in comparison with a foam-film composite structure alike in all aspects except for the anisotropic orientation of the cells of at least one foam layer.

Abstract: The present invention is premised upon a connector device and method that can more easily electrically connect a plurality of PV devices or photovoltaic system components and/or locate these devices/components upon a building structure. It also may optionally provide some additional sub-components (e.g. at least one bypass diode and/or an indicator means) and may enhance the serviceability of the device.

Abstract: Multilayer foam-film composite structures in which the cells of at least one foam layer have an anisotropic orientation exhibit at least one enhanced property of toughness, tear resistance and puncture resistance in comparison with a foam-film composite structure alike in all aspects except for the anisotropic orientation of the cells of at least one foam layer.

Abstract: Structural insulation sheathing (SIS), preferably in the form of a panel, comprises a structural member and an insulation member. The structural member and insulation members are in intimate, planar contact with one another, and the SIS structure meets both the structural (that is, AC 269) and insulation (R>2) requirements for the North American residential market. The structural 23 member of the SIS structure is multi-layer laminated paperboard. The insulation member of the SIS is a foamed sheet of a thermoplastic material such as polyisocyanurate.

Abstract: Structural insulation sheathing (SIS), preferably in the form of a panel, comprises a structural facer and an insulation member. The structural facer and insulation members are in intimate, planar contact with one another, both are plastic, and the SIS structure meets both the structural (i.e., ASTM E72) and insulation (R>2) requirements for the North American residential market. The structural facer member of the SIS structure is high-density polyolefin foam. The structural facer comprises a skin/core structure with the skins of a higher density than the core, and the structural facer has a flexural modulus typically of at least about 30,000 pounds per square inch (psi). The insulation member of the SIS is a foamed sheet of thermoplastic, e.g., polyisocyanurate.

Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.