Abstract: A reflective wire grid polarizer (WGP) can include an array of wires 12 on a face of a substrate 11, with channels 15 between adjacent wires 12. The wires 12 can have certain characteristics for WGP performance, such as index of refraction, alternating high/low index continuous thin films, thickness of layer(s), duty cycle, reflective rib shape, a curved side of transparent ribs 21 or 32, aspect ratio, or combinations thereof.

Abstract: A wall structure includes first and second panels joined to form a stud and a first wall layer. A fastener extends through the first wall layer and into the stud. Each panel includes first and a second ends. The first end of one panel and the second end of the other panel form a portion of the stud. The ends of the panels can nest. The wall structure can include multiple wall layers arranged such that the seams formed by components of each wall layer are staggered with respect to the seams in adjacent wall layers. Reinforcing members and fasteners can secure the wall layers to the remainder of the structure. A similarly constructed roof structure can be joined with multiple wall structures to form a building.

Abstract: A wall structure includes a first panel, a second panel joined to the first panel to form a stud and a first wall layer. A fastener extends through the first wall layer and into the stud. Each panel includes a first end and a second end. The first end of one panel and the second end of the other panel can form at least a portion of the stud. The ends of the panels can nest to form a portion of the stud. The wall structure can include multiple wall layers arranged such that the seams formed by individual members of each wall layer are staggered with respect to the seams formed by individual members of the adjacent wall layers. Reinforcing members and fasteners can be used to secure the wall layers to the remainder of the wall structure. A roof structure includes a first panel, a second panel joined to the first panel to form a stud and a first roof layer. A fastener extends through the first roof layer and into the stud. Each panel includes a first end and a second end.

Abstract: A method for determining the thermal characteristics of a semiconductor packaging system is provided which uses a platinum resistor test unit. The platinum resistor is preferably sized to approximate the dimensions of the semiconductor device for which the package was designed, and is installed within the package. The packaged resistor is then thermally calibrated at a plurality of temperature levels to generate a linear temperature versus resistance graph or equation corresponding thereto. Next, voltage is applied to the packaged resistor causing such resistor to "self heat." Its resistance is calculated, and the temperature corresponding thereto is obtained from the graph or equation. Such temperature is the surface temperature of the resistor. This temperature may then be used to calculate the temperature gradient from the inside of the package to any reference point on or near the outside of the package, the temperature of which has been previously determined.