Patents by Inventor Michael H. Yang

Michael H. Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996190
    Abstract: The present disclosure relates to aggregating and sharing wellness data. The wellness data can be received by a user device from any number of sensors external or internal to the user device, from a user manually entering the wellness data, or from other users or entities. The user device can securely store the wellness data on the user device and transmit the wellness data to be stored on a remote database. A user of the device can share some or all of the wellness data with friends, relatives, caregivers, healthcare providers, or the like. The user device can further display a user's wellness data in an aggregated view of different types of wellness data. Wellness data of other users can also be viewed if authorizations from those users have been received.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: May 28, 2024
    Assignee: Apple Inc.
    Inventors: Aroon Pahwa, Rebecca L. Weber, Divya Nag, Christopher D. Soli, Lawrence Y. Yang, Stephen O. Lemay, Kevin M. Lynch, Stacey F. Lysik, Dylan R. Edwards, Zachury B. Minjack, Zachery W. Kennedy, Adam L. Beberg, Dennis S. Park, Afshad M. Mistri, Anton M. Davydov, Jay K. Blahnik, Christine M. Eun, James H. Foster, Stephanie M. Greer, Daniel S. Keen, Natalia C. Maric, Gregory B. Novick, Michael O'Reilly, Donald W. Pitschel
  • Publication number: 20240109888
    Abstract: Compounds having formula (I), and enantiomers, and diastereomers, stereoisomers, pharmaceutically-acceptable salts thereof, are useful as kinase modulators, including RIPK1 modulation. All the variables are as defined herein.
    Type: Application
    Filed: July 6, 2023
    Publication date: April 4, 2024
    Inventors: Guanglin Luo, Jie Chen, Carolyn Diane Dzierba, David B. Frennesson, Junqing Guo, Amy C. Hart, Xirui Hu, Michael E. Mertzman, Matthew Reiser Patton, Jianliang Shi, Steven H. Spergel, Brian Lee Venables, Yong-Jin Wu, Zili Xiao, Michael G. Yang
  • Patent number: 6005225
    Abstract: A vertical rapid heating furnace for treating semiconductor wafers comprising a hot wall reaction tube positioned within a cylindrical array of circular parallel heating elements substantially concentric therewith, each heating element being spaced from the hot wall reaction tube, each heating element comprising a coil of resistance heating conductor. The coiled resistance heating conductor can be a coil of resistance heating wire, the coil having an outer diameter of from 1 to 7 mm and supported in an annular heating element support. Each heating element support is dimensioned to support and accommodate the thermally expanded heating element supported therein at both the minimum and maximum furnace temperatures. Preferably, each annular heating element support is provided by an annular recess in the insulation surrounding the array of heating elements.
    Type: Grant
    Filed: March 28, 1997
    Date of Patent: December 21, 1999
    Assignee: Silicon Valley Group, Inc.
    Inventors: Jeffrey M. Kowalski, Christopher T. Ratliff, Terry A. Koble, Jr., Jon H. Pack, Michael H. Yang