Patents by Inventor Michael Harmening

Michael Harmening has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5795519
    Abstract: In a process of making a microstructured plastic mold from which structures can be formed galvanically a compound layer including an electrically conductive and an insulating layer portion is provided and is heated, and impressed into the insulating layer portion is a tool which has microstructured bodies disposed thereon of a height corresponding at least to the thickness of the insulating layer portion and with rough front surfaces having points and ridges adapted to penetrate the electrically insulating layer thereby to expose the electrically insulating layer at the bottom of the cavities formed by microstructured bodies.
    Type: Grant
    Filed: December 19, 1994
    Date of Patent: August 18, 1998
    Assignee: Kernforschungszentrum Karlsruhe GmbH
    Inventors: Walter Bacher, Peter Bley, Michael Harmening
  • Patent number: 5759616
    Abstract: In a process for producing microstructure components on a substrate which carries electronic microcircuits cooperating functionally with the microstructure components, a first layer of a plastic material which connects with the substrate is applied to the substrate and a second layer of a plastic material which includes a separating agent but which firmly connects with the first layer is applied to the first layer and a molding tool is then impressed into the second layer to form the desired microstructures or to form cavities into the plastic material, which, upon removal of the molding tool, are filled with a metal to form the desired microstructures on the substrate upon removal of the plastic material.
    Type: Grant
    Filed: March 10, 1995
    Date of Patent: June 2, 1998
    Assignee: Kernforschungszentrum Karlsruhe GmbH
    Inventors: Andreas Michel, Michael Harmening, Walter Bacher, Peter Bley, Robert Ruprecht, Alexander Both
  • Patent number: 5676983
    Abstract: For a process of making a microstructured plastic mold from which structures can be formed galvanically, a compound layer, including an electrically conductive and an insulating layer portion, is provided and is heated and impressed into the insulating layer portion, a tool is provided which has microstructured bodies disposed thereon of a height corresponding at least to the thickness of the insulating layer portion and with rough from surfaces having points and ridges adapted to penetrate the electrically insulating layer thereby to expose the electrically insulating layer at the bottom of the cavities formed by microstructured bodies.
    Type: Grant
    Filed: October 30, 1996
    Date of Patent: October 14, 1997
    Assignee: Kernforschungszentrum Karlsruhe GmbH
    Inventors: Walter Bacher, Peter Bley, Michael Harmening
  • Patent number: 5260175
    Abstract: A method of producing microstructures having regions of different structural height includes providing a layer of positive resist material that is sensitive to X-ray radiation with microstructures on a side facing a source of X-rays. Using a mask, the layer of a positive resist material is partially irradiated with the X-rays. The irradiated regions are removed with the aid of a developer.
    Type: Grant
    Filed: March 31, 1992
    Date of Patent: November 9, 1993
    Assignees: Kernforschungzentrum Karlsruhe GmbH, Burkert GmbH & Co.
    Inventors: Bernd Kowanz, Peter Bley, Walter Bacher, Michael Harmening, Jurgen Mohr
  • Patent number: 5073237
    Abstract: In a method of making molds with microstructured recesses having a continuous base covered by a film of an electrically conductive material for forming in the recesses, by electrodeposition, microstructured plate-like bodies a microstructure master mold is pressed into a layer of thermoplastic material coated with a film of an electrically conductive material at a temperature which is above the softening temperature of the thermoplastic material such that the thermoplastic material with the electrically conductive film thereon first contacts the microstructure face and then enters the recesses in the microstructure. The master mold and thermoplastic material are then cooled and the master mold is removed whereby the thermoplastic material provides a negative mold of the microstructure having a continuous electrically conductive film disposed on the recess bases whereas the remainder of the electrically conductive film is broken apart and disposed in isolated spangles on the rest of the microstructured mold.
    Type: Grant
    Filed: March 20, 1991
    Date of Patent: December 17, 1991
    Assignee: Kernforschungszentrum Karlsruhe GmbH
    Inventors: Walter Bacher, Hans Biedermann, Michael Harmening