Abstract: A method for machining a holding device for a light module of a lighting device of a motor vehicle. An SMD semiconductor light source component arranged on the holding device is operated for light generation. An emission characteristic of a light-emitting surface of the SMD semiconductor light source component is determined. A mechanical feature with regard to the holding device is specified depending upon the emission characteristic. An optical element which co-operates optically with the SMD semiconductor light source component is specified depending upon the mechanical feature with regard to the SMD semiconductor light source component.

Abstract: A method for placing an SMD semiconductor light source component and a component of an illumination device for a motor vehicle. The SMD semiconductor light source component is operated so as to generate light, and the emission characteristics of the SMD semiconductor light source component are determined. In a subsequent step, the SMD semiconductor light source component and the component are positioned relative to one another in accordance with the emission characteristics.

Abstract: A method for machining a holding device for a light module of a lighting device of a motor vehicle. An SMD semiconductor light source component arranged on the holding device is operated for light generation. An emission characteristic of a light-emitting surface of the SMD semiconductor light source component is determined. A mechanical feature with regard to the holding device is specified depending upon the emission characteristic. An optical element which co-operates optically with the SMD semiconductor light source component is specified depending upon the mechanical feature with regard to the SMD semiconductor light source component.

Abstract: The invention relates to a method for operating a first and a second light-emitting unit of a motor vehicle. A first voltage converter is provided for operating the first light-emitting unit. A second voltage converter is provided for operating the second light-emitting unit. A switching unit is arranged between the two light-emitting units and the voltage converters, such that the second voltage converter is connected to the first light-emitting unit.

Abstract: The invention relates to a method for operating a first and a second light-emitting unit of a motor vehicle. A first voltage converter is provided for operating the first light-emitting unit. A second voltage converter is provided for operating the second light-emitting unit. A switching unit is arranged between the two light-emitting units and the voltage converters, such that the second voltage converter is connected to the first light-emitting unit.

Abstract: A method for placing an SMD semiconductor light source component and a component of an illumination device for a motor vehicle. The SMD semiconductor light source component is operated so as to generate light, and the emission characteristics of the SMD semiconductor light source component are determined. In a subsequent step, the SMD semiconductor light source component and the component are positioned relative to one another in accordance with the emission characteristics.

Abstract: A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.

Abstract: A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type.

Abstract: A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 ?m, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5.

Abstract: A leadframe, a housing, a radiation-emitting component formed therefrom, and a method for producing the component includes the leadframe having a mount part with at least one bonding wire connecting area and at least one electrical solder connecting strip into which a separately manufactured thermal connecting part, which has a chip mounting area, is linked. To form a housing, the leadframe is sheathed, preferably, with a molding compound, with the thermal connecting part being embedded such that it can be thermally connected from the outside.

Abstract: An apparatus having a least one fixing element is specified, the fixing element being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element.

Abstract: A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.

Abstract: An apparatus having at least one fixing element is specified, the fixing dement being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element.

Abstract: A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (2), which is connected in parallel with an electronic component (1), and provides ESD protection for the component (1).

Abstract: A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type.

Abstract: A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (2), which is connected in parallel with an electronic component (1), and provides ESD protection for the component (1).

Abstract: A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 ?m, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5.

Abstract: A leadframe, a housing, a radiation-emitting component formed therefrom, and a method for producing the component includes the leadframe having a mount part with at least one bonding wire connecting area and at least one electrical solder connecting strip into which a separately manufactured thermal connecting part, which has a chip mounting area, is linked. To form a housing, the leadframe is sheathed, preferably, with a molding compound, with the thermal connecting part being embedded such that it can be thermally connected from the outside.