Abstract: A light sensor includes a photodetector sensor region formed in a semiconductor substrate. To shape the spectral response of the light sensor, a dielectric optical coating filter covers the photodetector sensor region and a circumferential region of the substrate that surrounds the photodetector sensor region. In accordance with specific embodiments, the dielectric optical coating filter has chamfered corners to improve the thermal reliability of the dielectric optical coating covering the photodetector sensor region. Methods for making such a light sensor are also disclosed.

Abstract: Light sensors including dielectric optical coatings to shape their spectral responses, and methods for fabricating such light sensors in a manner that accelerates lift-off processes and increases process margins, are described herein. In an embodiment, a light sensor includes a photodetector sensor region formed in a semiconductor substrate, a dielectric optical coating filter covering the photodetector sensor region, and dummy dielectric optical coating features beyond the photodetector sensor region, wherein the dummy dielectric optical features include one or more dummy corners, dummy islands and/or dummy rings. Alternatively, or additionally, the dielectric optical coating filter includes chamfered corners, which improves the thermal reliability of the dielectric optical coating.

Abstract: Light sensors including dielectric optical coatings to shape their spectral responses, and methods for fabricating such light sensors in a manner that accelerates lift-off processes and increases process margins, are described herein. In an embodiment, a light sensor includes a photodetector sensor region formed in a semiconductor substrate, a dielectric optical coating filter covering the photodetector sensor region, and dummy dielectric optical coating features beyond the photodetector sensor region, wherein the dummy dielectric optical features include one or more dummy corners, dummy islands and/or dummy rings. Alternatively, or additionally, the dielectric optical coating filter includes chamfered corners, which improves the thermal reliability of the dielectric optical coating.

Abstract: Light sensors including dielectric optical coatings to shape their spectral responses, and methods for fabricating such light sensors in a manner that accelerates lift-off processes and increases process margins, are described herein. In certain embodiments, a short duration soft bake is performed. Alternatively, or additionally, temperature cycling is performed. Alternatively, or additionally, photolithography is performed using a photomask that includes one or more dummy corners, dummy islands and/or dummy rings. Each of the aforementioned embodiments form and/or increase a number of micro-cracks in the dielectric optical coating not covering the photodetector sensor region, thereby enabling an accelerated lift-off process and an increased process margin. Alternatively, or additionally, a portion of the photomask can include chamfered corners so that the dielectric optical coating includes chamfered corners, which improves the thermal reliability of the dielectric optical coating.

Abstract: Monolithic optical sensor devices, and methods for fabricating such devices, are described herein. In an embodiment, a semiconductor wafer substrate includes a plurality of photodetector (PD) regions. A wafer-level inorganic dielectric optical filter is deposited and thereby formed over at least a subset of the plurality of PD regions. One or more wafer-level organic color filter(s) is/are deposited and thereby formed on one or more selected portion(s) of the wafer-level inorganic dielectric optical filter that is/are over selected ones of the PD regions. For example, an organic red filter, an organic green filter and an organic blue filter can be over, respectively, portions of the wafer-level inorganic dielectric optical filter that are over first, second and third PD regions.

Abstract: Light sensors including dielectric optical coatings to shape their spectral responses, and methods for fabricating such light sensors in a manner that accelerates lift-off processes and increases process margins, are described herein. In certain embodiments, a short duration soft bake is performed. Alternatively, or additionally, temperature cycling is performed. Alternatively, or additionally, photolithography is performed using a photomask that includes one or more dummy corners, dummy islands and/or dummy rings. Each of the aforementioned embodiments form and/or increase a number of micro-cracks in the dielectric optical coating not covering the photodetector sensor region, thereby enabling an accelerated lift-off process and an increased process margin. Alternatively, or additionally, a portion of the photomask can include chamfered corners so that the dielectric optical coating includes chamfered corners, which improves the thermal reliability of the dielectric optical coating.

Abstract: Light sensors including dielectric optical coatings to shape their spectral responses, and methods for fabricating such light sensors in a manner that accelerates lift-off processes and increases process margins, are described herein. In certain embodiments, a short duration soft bake is performed. Alternatively, or additionally, temperature cycling is performed. Alternatively, or additionally, photolithography is performed using a photomask that includes one or more dummy corners, dummy islands and/or dummy rings. Each of the aforementioned embodiments form and/or increase a number of micro-cracks in the dielectric optical coating not covering the photodetector sensor region, thereby enabling an accelerated lift-off process and an increased process margin. Alternatively, or additionally, a portion of the photomask can include chamfered corners so that the dielectric optical coating includes chamfered corners, which improves the thermal reliability of the dielectric optical coating.