Abstract: An electrode assembly for use in electrophoretically depositing an electrodepositable coating composition onto a conductive substrate having a hollowed interior region therewithin includes a first counter electrode and an electrode assembly comprising a second counter electrode and a deployable primary electrode which are introduced within the hollowed out interior region during the electrodeposition process to provide a deposited electrodeposition coating on inner and outer surfaces.

Abstract: An electrode assembly for use in electrophoretically depositing an electrodepositable coating composition onto a conductive substrate having a hollowed interior region therewithin includes a first counter electrode and an electrode assembly comprising a second counter electrode and a deployable primary electrode which are introduced within the hollowed out interior region during the electrodeposition process to provide a deposited electrodeposition coating on inner and outer surfaces.

Abstract: In a method of forming a micron-size field emitter, an array of conductive tips is formed on a substrate. A layer of dielectric material is formed on the substrate to a thickness substantially equal to the height of the tips, but forming a protuberance over each tip. A conductive grid layer is deposited over the dielectric layer, forming corresponding protuberances, followed by a layer of resist material which is of sufficiently low viscosity so that it flows off the grid layer at the protuberances leaving the protuberances substantially unprotected. The grid and dielectric layers in the protuberances are then etched away to reveal the tips through the resulting apertures in the grid and dielectric layers. The apertures are thereby automatically aligned with the tips without the need for lithographic processes.