Abstract: A method to vertically bond a chip to a substrate is provided. The method includes forming a metal bar having a linear aspect on the substrate, forming a solder paste layer over the metal bar to form a solder bar, forming a plurality of metal pads on the substrate, and forming a solder paste layer over the plurality of metal pads to form a plurality of solder pads on the substrate. Each of the plurality of solder pads is offset from a long edge the solder bar by an offset-spacing. The chip to be vertically bonded to the substrate has a vertical-chip thickness fractionally less than the offset-spacing. The chip to be vertically bonded fits between the plurality of solder pads and the solder bar. The solder bar enables alignment of the chip to be vertically bonded.

Abstract: A method to vertically bond a chip to a substrate is provided. The method includes forming a metal bar having a linear aspect on the substrate, forming a solder paste layer over the metal bar to form a solder bar, forming a plurality of metal pads on the substrate, and forming a solder paste layer over the plurality of metal pads to form a plurality of solder pads on the substrate. Each of the plurality of solder pads is offset from a long edge the solder bar by an offset-spacing. The chip to be vertically bonded to the substrate has a vertical-chip thickness fractionally less than the offset-spacing. The chip to be vertically bonded fits between the plurality of solder pads and the solder bar. The solder bar enables alignment of the chip to be vertically bonded.

Abstract: A system and method for packaging a magnetic sensor is described. A sensor die is constructed such that connection pads are situated on two opposing sides of the die in two vertical arrays. Bonding wires connect the connection pads on the sensor die to wire bond pads on a substrate. Alternatively, the connection pads are connected to solderable chip pads on the substrate using flip chip bonding. Traces and vias are used to connect the wire bond pads or the solderable chip pads to sensor package pads. The sensor package pads are located on a single side of a sensor package for mounting on a next assembly. The next assembly has a land pattern that includes at least one leveling pad for positioning the sensor die perpendicular to the next assembly while being mounted and a single row of pads for making connections to the sensor package.

Abstract: A 3-axis sensor package with on-board sensor support chip on a single chip. In one aspect of the invention, a sensor package includes an X-axis sensor circuit component, a Y-axis sensor circuit component, or alternatively a combined X/Y-axis sensor circuit component, and a Z-axis sensor circuit component, each mounted to a top surface of a rigid substrate, or alternatively to a printed circuit board (PCB). The pads may be arranged in variety of designs, including a leadless chip carrier (LCC) design and a ball grid array (BGA) design. An application-specific integrated circuit (ASIC), or sensor support chip, is additionally mounted to the top surface of the rigid substrate. The sensor components and ASIC may be ball bonded or wire bonded to the substrate.

Abstract: A sensor package comprising an X-axis sensor circuit component, a Y-axis sensor circuit component, and a Z-axis sensor circuit component, each mounted to a top surface of a rigid substrate. To minimize the height of the package, a channel is cut out of the top surface of the substrate in order to accommodate the Z-axis sensor component. On the Z-axis sensor component, input/output (I/O) pads are all arranged in an array along one edge of the sensor to conductively cooperate with I/O pads, or solder-filled vias, on the substrate located at a top edge of the channel. Once the sensors have all been mounted to the substrate, the package is encapsulated, and the overall height is less than 1.2 mm.

Abstract: Two sensor units are formed from magnetoresistive material. Elements of the first sensor unit have a total anisotropy field in a first direction. Elements of the second sensor unit have a total anisotropy field in a second direction. An integral coil sets a direction of magnetization in the elements of the first and second sensor units. An output of the first sensor unit is representative of magnetic field components perpendicular to the first direction and an output of the second sensor is representative of magnetic field components perpendicular to the second direction.

Abstract: Methods and apparatus for vertical chip-on-board sensor packages can comprise a vertical sensor circuit component comprising a first face, a second face, a bottom edge, a top edge, two side edges, input/output (I/O) pads and at least one sensitive direction wherein the I/O pads are arranged near the bottom edge. Such vertical die chip-on-board sensor packages can also comprise one or more horizontal sensor circuit components comprising a top face, a printed circuit board (PCB) mounting face, a vertical sensor circuit component interface edge, two or more other edges, and one or more sensitive directions wherein the vertical sensor circuit component interface edge supports the vertical sensor circuit component along the Z axis and conductively or non-conductively connects to the vertical sensor circuit component.

Abstract: Two sensor units are formed from magnetoresistive material. Elements of the first sensor unit have a total anisotropy field in a first direction. Elements of the second sensor unit have a total anisotropy field in a second direction. An integral coil sets a direction of magnetization in the elements of the first and second sensor units. An output of the first sensor unit is representative of magnetic field components perpendicular to the first direction and an output of the second sensor is representative of magnetic field components perpendicular to the second direction.

Abstract: Two sensor units are formed from magnetoresistive material. Elements of the first sensor unit have a total anisotropy field in a first direction. Elements of the second sensor unit have a total anisotropy field in a second direction. An integral coil sets a direction of magnetization in the elements of the first and second sensor units. An output of the first sensor unit is representative of magnetic field components perpendicular to the first direction and an output of the second sensor is representative of magnetic field components perpendicular to the second direction.

Abstract: Two sensor units are formed from magnetoresistive material. Elements of the first sensor unit have a total anisotropy field in a first direction. Elements of the second sensor unit have a total anisotropy field in a second direction. An integral coil sets a direction of magnetization in the elements of the first and second sensor units. An output of the first sensor unit is representative of magnetic field components perpendicular to the first direction and an output of the second sensor is representative of magnetic field components perpendicular to the second direction.

Abstract: A magnetometer package with a housing, a plurality of sensing elements, a board, and a sealing element. The housing has a first end, a second end, and a bore. The first end of the housing is adapted to receive the board and the sealing element. The second end of the housing is adapted to receive a plug. The plurality of sensing elements, the board, and the sealing element rest in the bore. The plurality of sensing elements are mounted on the board and are orientated so that their sensing axes sense magnetic fields in different directions.

Abstract: A magnetometer package with a housing, a plurality of sensing elements, a board, and a sealing element. The housing has a first end, a second end, and a bore. The first end of the housing is adapted to receive the board and the sealing element. The second end of the housing is adapted to receive a plug. The plurality of sensing elements, the board, and the sealing element rest in the bore. The plurality of sensing elements are mounted on the board and are orientated so that their sensing axes sense magnetic fields in different directions.

Abstract: A method for manufacturing magnetoresistive sensors whereby a first determination of an anisotropy field of the magnetoresistive material is made and an annealing temperature is selected based on a desired final value of the anisotropy field.