Patents by Inventor Michael J. Dufresne

Michael J. Dufresne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040026359
    Abstract: A process is described for the manufacture of flexible tubular elements, particularly stents for the medical field, the process comprising the steps of:
    Type: Application
    Filed: March 3, 2003
    Publication date: February 12, 2004
    Inventors: Michael J. Dufresne, LeRoy J. Lundblad
  • Patent number: 6537459
    Abstract: A process is described for the manufacture of flexible tubular elements, particularly stents for the medical field, the process comprising the steps of: a) providing a hollow metal tube (or metal coated tube) with an open pattern of a chemical-etch-resistant coating layer; b) supporting the hollow metal tube with a coating thereon onto a chemical etch resistant support element; c) contacting the open pattern with a solution capable of etching the metal of the hollow metal tube so that said metal is etched away from physically exposed surfaces of the metal tube and openings in the metal tube corresponding to the open pattern of the coating layer are created in the metal tube element without etching the chemical etch resistant support element; and d) removing the metal tube from the chemical etch resistant support element.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: March 25, 2003
    Assignee: BMC Industries, Inc.
    Inventors: Michael J. Dufresne, LeRoy J. Lundblad
  • Patent number: 6468439
    Abstract: A process for the etching of multiple layers of at least two different metals comprisies: forming a resist pattern over a first layer of metal, said resist pattern having a pattern of openings therein, applying a first etch solution onto said resist pattern so that at least some etch solution contacts exposed areas of the first layer of metal, etching away the majority of the depth of the first metal in exposed areas of metal in the first layer of metal, applying a second etch solution onto the resist pattern the second etch solution having a rate of etch towards the first metal as compared to the first etch solution that is at least 20% less than the millimeter/minute rate of etch of the first etch solution at the same etch solution temperature, removing the second etch solution from said resist pattern after at least the first metal layer has been etched sufficiently to expose areas of a second metal layer underlying the first metal layer by forming an etched first metal layer, and applying a third etch so
    Type: Grant
    Filed: November 1, 1999
    Date of Patent: October 22, 2002
    Assignee: BMC Industries, Inc.
    Inventors: Donald A. Whitehurst, Paul D. Wyatt, Charles Ring, Michael J. Dufresne, Jose F. Brenes, Bruce A. Finger, Dave R. Zeipelt
  • Patent number: 6365057
    Abstract: A process for the formation of an article having multiple electrical circuits comprises: providing a first sub-element comprising in sequence a first metal layer of copper in electrical contact with a second metal layer of aluminum in electrical contact with a third metal layer of copper; etching an electrical circuit design in the first metal layer and in a separate etch step, etching away at least 10%, but less than 100% of the second metal layer to provide electrical connections between the first metal layer and the third metal layer; etching an electrical circuit design into the third metal layer; adhering an etched surface comprising the circuit design of the first or third metal layer to a first surface of a support layer to form a circuit board. The process may etch the first and third metal layers simultaneously or sequentially.
    Type: Grant
    Filed: November 1, 1999
    Date of Patent: April 2, 2002
    Assignee: BMC Industries, Inc.
    Inventors: Donald A. Whitehurst, Dennis D. Mattson, Paul D. Wyatt, Charles Ring, Michael J. Dufresne, Jose F. Brenes, Bruce A. Finger, David R. Zeipelt
  • Patent number: 6086773
    Abstract: A process is described for the manufacture of flexible tubular elements, particularly stents for the medical field, the process comprising the steps of:a) providing a hollow metal tube (or metal coated tube) with an open pattern of a chemical-etch-resistant coating layer;b) supporting the hollow metal tube with a coating thereon onto a chemical etch resistant support element;c) contacting the open pattern with a solution capable of etching the metal of the hollow metal tube so that said metal is etched away from physically exposed surfaces of the metal tube and openings in the metal tube corresponding to the open pattern of the coating layer are created in the metal tube element without etching the chemical etch resistant support element; andd) removing the metal tube from the chemical etch resistant support element.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: July 11, 2000
    Assignee: BMC Industries, Inc.
    Inventors: Michael J. Dufresne, LeRoy J. Lundblad