Abstract: A high-speed optical data link includes a system circuit board, a first ASIC coupled to convey electrical information to and from up level data management circuits, and a second ASIC electrically coupled to the first ASIC. A fiber optic module mounted on the system circuit board including a receiver, a transmitter and the second ASIC. The receiver includes a photo-diode positioned to receive optical signals, a trans-impedance amplifier electrically coupled to the photo diode, and a post-amplifier electrically coupled to the trans-impedance amplifier and to the second ASIC. The transmitter includes a laser positioned to convey optical signals to a remote optical receiver and a laser driver electrically coupled to the laser and to the second ASIC.

Abstract: A high-speed optical data link includes a system circuit board, a first ASIC coupled to convey electrical information to and from up level data management circuits, and a second ASIC electrically coupled to the first ASIC. A fiber optic module mounted on the system circuit board including a receiver, a transmitter and the second ASIC. The receiver includes a photo-diode positioned to receive optical signals, a trans-impedance amplifier electrically coupled to the photo diode, and a post-amplifier electrically coupled to the trans-impedance amplifier and to the second ASIC. The transmitter includes a laser positioned to convey optical signals to a remote optical receiver and a laser driver electrically coupled to the laser and to the second ASIC.

Abstract: A high-speed optical data link includes a system circuit board, a first ASIC coupled to convey electrical information to and from up level data management circuits, and a second ASIC electrically coupled to the first ASIC. A fiber optic module mounted on the system circuit board including a receiver, a transmitter and the second ASIC. The receiver includes a photo-diode positioned to receive optical signals, a trans-impedance amplifier electrically coupled to the photo diode, and a post-amplifier electrically coupled to the trans-impedance amplifier and to the second ASIC. The transmitter includes a laser positioned to convey optical signals to a remote optical receiver and a laser driver electrically coupled to the laser and to the second ASIC.

Abstract: A system and method (100,200) which uses a spreadsheet computer program having linked files in which the network architecture and the network element properties are entered and stored by the user. The overall network configuration information is input into a first, (INPUT) file type (102), which includes general parameters such as the battery terminal voltage, cable temperatures, bus (or node) names and bus interconnection information such as cable sizes and number of conductors per node. Cable impedance tables are available in a second, auxiliary (RESIST) file (112). Detailed loading information is entered in a third, (PANEL) file (128), which includes load description, load type (constant power or constant impedance), and load rating data and load status (on or off), which can be sequenced over time. These spreadsheets, or files, cooperate to automatically set up the appropriate YBUS admittance matrix file (120,124) and interactively compute voltages and currents using fourth type (CALC) files (122,126).

Abstract: There is disclosed a composite body that is electrically insulating, and that is composed of metal particles dispersed in a continuous glassy matrix as a second phase. The metal particles are directionally anisotropic generally paralleling a predetermined plane through the body. This permits good thermal conductivity, while retaining the electrical insulating character of the glass, thus providing improved packaging for electronic components. A method of forming the composite body is also disclosed, as are methods of creating improved electronic packaging utilizing the composite material body.