Abstract: An approach for protecting the circuit trade of a printed circuit board from oxidation that may occur due the permeability of the underlying substrate. A layer of silver is positioned between the circuit trace and the substrate, such as by immersion plating, during manufacturing of the printed circuit board. The layer of silver is preferably applied over the seed-conductor after a negative photo resist layer has been applied to the substrate and before the copper is plated to form the circuit trace. The resist and seed-conductor outside of the circuit trace may then be removed to leave the protected circuit trace. An additional layer of silver may be plated over the copper trace to protect the exterior and side surface of the trace.

Abstract: The present invention is directed to an RF device that includes a laminate structure having a ceramic layer having a predetermined thermal conductivity that is a function of a predetermined RF device operating temperature. The ceramic layer forms a first major surface of the laminate structure and a second major ceramic surface is bonded to a layer of thermoplastic material that is, in turn, bonded to a conductive layer. The thermoplastic material has a coefficient of thermal expansion that substantially matches the conductive layer. A first circuit arrangement is disposed on the first major surface of the laminate structure and it includes a first RF circuit structure having a predetermined geometry and predetermined electrical characteristics. The laminate structure is configured to dissipate thermal energy generated by the at least one first RF circuit structure via substantially the entire second major surface of the laminate structure.

Abstract: The present invention is directed to an RF device that includes a laminate structure having a ceramic layer having a predetermined thermal conductivity that is a function of a predetermined RF device operating temperature. The ceramic layer forms a first major surface of the laminate structure and a second major ceramic surface is bonded to a layer of thermoplastic material that is, in turn, bonded to a conductive layer. The thermoplastic material has a coefficient of thermal expansion that substantially matches the conductive layer. A first circuit arrangement is disposed on the first major surface of the laminate structure and it includes a first RF circuit structure having a predetermined geometry and predetermined electrical characteristics. The laminate structure is configured to dissipate thermal energy generated by the at least one first RF circuit structure via substantially the entire second major surface of the laminate structure.

Abstract: An RF power resistor includes: a lossy layer; and a dielectric layer. The lossy layer is shaped and/or sized as a transmission line. The lossy layer is made of a lossy material. The dielectric layer is made of a dielectric material. The lossy layer and the dielectric material are located to be adjacent to each other and in contact with each other.

Abstract: The present invention is directed to an RF device that includes a ceramic layer characterized by a ceramic layer dielectric constant and includes an RF circuit arrangement having a predetermined geometry and predetermined electrical characteristics. The ceramic layer dissipates thermal energy generated by the RF circuit via substantially the entire ceramic surface area. A first dielectric layer comprises a thermoplastic material and has a predetermined first thickness and a first dielectric constant. The predetermined electrical characteristics of the RF circuit arrangement are a function of the ceramic layer dielectric constant. A relative softness of the thermoplastic material is a function of the RF device operating temperature.

Abstract: An RF power resistor includes: a lossy layer; and a dielectric layer. The lossy layer is shaped and/or sized as a transmission line. The lossy layer is made of a lossy material. The dielectric layer is made of a dielectric material. The lossy layer and the dielectric material are located to be adjacent to each other and in contact with each other.

Abstract: A method and apparatus for making a connection to or between one or more modules in a microwave communication system includes a first module having a plurality of contact pads mounted on a surface adjacent one edge of the module; optionally a second module having a plurality of contact pads mounted on a surface adjacent a confronting edge of the second module; a contact assembly including a housing and a plurality of resilient contacts disposed within the housing, each contact having at least a first and optionally a second contact surface aligned with and connected to the contact pads on the first and second modules respectively; and a plurality of screws or the like for anchoring the housing to the first and optionally the second module and bridging the gap between them, the housing arranged to deform the plurality of contacts to urge them into resilient engagement with the contact pads on the modules.