Abstract: An integral connectorless hermetically sealed high-temperature piezoelectric sensor housing and cable assembly includes signal conditioning/processing circuitry having a charge amplifier-differential amplifier combination with integral trim capacitor and/or a voltage divider network in at least one signal processing path to provide the ability to custom adjust input impedances and balance common-mode signals to compensate for inequalities caused by inherent parasitic capacitances and specific structural constraints of the sensor assembly.

Abstract: A sensor connector assembly having a lower housing having a base operatively arranged to hold the sensor, and an integral male upper threaded section having a terminal block fixedly secured therein, an upper housing having a female lower threaded section operatively arranged to threadably engage the integral male upper threaded section of the lower housing, the upper housing also having an integral male upper threaded section having an aperture therein to pass a cable for the sensor, and, a sealing nut having a female threaded section operatively arranged to threadably engage the integral male upper threaded section of the upper housing and also having an aperture therein to pass the cable for the sensor.