Patents by Inventor Michael J. Varnau

Michael J. Varnau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer-applied underfill process
    Patent number: 6916684
    Abstract: A process for underfilling a bumped die surface using a lamination step and compound film such that solder bumps on the die are exposed during lamination. The compound film comprises a first layer containing an underfill material and a second layer on the first layer. The underfill material and the second layer comprise polymer materials that differ from each other. The compound film is laminated to the die, preferably at the wafer level, so that the underfill material is forced between the solder bumps and fills spaces between the bumps but does not cover the bumps. In contrast, the second layer covers the solder bumps, but is then selectively removed to re-expose the solder bumps and the underfill material therebetween.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: July 12, 2005
    Assignee: Delphi Technologies, Inc.
    Inventors: Frank Stepniak, Matthew R. Walsh, Arun K. Chaudhuri, Michael J. Varnau
  • Wafer-applied underfill process
    Publication number: 20040185601
    Abstract: A process for underfilling a bumped die surface using a lamination step and compound film such that solder bumps on the die are exposed during lamination. The compound film comprises a first layer containing an underfill material and a second layer on the first layer. The underfill material and the second layer comprise polymer materials that differ from each other. The compound film is laminated to the die, preferably at the wafer level, so that the underfill material is forced between the solder bumps and fills spaces between the bumps but does not cover the bumps. In contrast, the second layer covers the solder bumps, but is then selectively removed to re-expose the solder bumps and the underfill material therebetween.
    Type: Application
    Filed: March 18, 2003
    Publication date: September 23, 2004
    Inventors: Frank Stepniak, Matthew R. Walsh, Arun K. Chaudhuri, Michael J. Varnau
  • Panel mounting device and assembly
    Patent number: 4309856
    Abstract: To securely mount at least two panels such as printed circuit boards in spaced parallel relation, a molded plastic spacer device is provided for coupling the panels to a mounting bracket and firmly holding the panels without stress.
    Type: Grant
    Filed: May 22, 1980
    Date of Patent: January 12, 1982
    Assignee: General Motors Corporation
    Inventors: Michael J. Varnau, William Gouge