Patents by Inventor Michael J. Watkins
Michael J. Watkins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240132527Abstract: The present disclosure relates generally to certain compounds, pharmaceutical compositions comprising said compounds, and methods of making and using said compounds and pharmaceutical compositions. The compounds and compositions provided herein may be used for the treatment or prevention of a Retroviridae infection, including an HIV infection.Type: ApplicationFiled: August 22, 2023Publication date: April 25, 2024Inventors: Julie Farand, Michael Graupe, Tezcan Guney, Darryl Kato, Jiayao Li, John O. Link, James B. C. Mack, Dong Min Mun, Roland D. Saito, William J. Watkins, Jennifer R. Zhang
-
Patent number: 8102667Abstract: Method and apparatus for spatially optimizing the arrangement of surface mount pads on a ball grid array package. An array containing T surface mount pads with a diameter less than or equal to 0.4 millimeter is arranged in an array of rows and columns less than or equal to 0.5 millimeters center-to-center. The array of pads is subdivided into N groups of pads respectively numbered Gx (for X from 1 to N), each group containing Px pads (for X from 1 to N). Each pad in each group is located so as to maximize the number of empty spaces Sz that are adjacent to each pad, where Sz=(Gx?1). The number of fanout possibilities for each group (Px*Sz) is calculated, and then the total number of fanout possibilities, FP, is calculated using the function ?1N (Px*Sz). The resulting spatially optimized pattern has a quality score, FP/T, that is equal to or greater than 2.Type: GrantFiled: October 27, 2008Date of Patent: January 24, 2012Assignee: Motorola Solutions, Inc.Inventors: Jeffrey A. Underwood, Thomas J. Swirbel, Michael J. Watkins
-
Publication number: 20100101846Abstract: Method and apparatus for spatially optimizing the arrangement of surface mount pads on a ball grid array package. An array containing T surface mount pads with a diameter less than or equal to 0.4 millimeter is arranged in an array of rows and columns less than or equal to 0.5 millimeters center-to-center. The array of pads is subdivided into N groups of pads respectively numbered Gx (for X from 1 to N), each group containing Px pads (for X from 1 to N). Each pad in each group is located so as to maximize the number of empty spaces Sz that are adjacent to each pad, where Sz=(Gx?1). The number of fanout possibilities for each group (Px*Sz) is calculated, and then the total number of fanout possibilities, FP, is calculated using the function ?1N (Px*Sz). The resulting spatially optimized pattern has a quality score, FP/T, that is equal to or greater than 2.Type: ApplicationFiled: October 27, 2008Publication date: April 29, 2010Applicant: MOTOROLA, INC.Inventors: Jeffrey A. Underwood, Thomas J. Swirbel, Michael J. Watkins
-
Patent number: 7001938Abstract: Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agents which include a primary amino alcohol reacted into a resinous phenolic compound. Resin systems utilizing the curing agents of the invention exhibit enhanced hot wet adhesion to metal substrates and are particularly useful in the manufacture of powder coatings for pipe.Type: GrantFiled: January 27, 2003Date of Patent: February 21, 2006Assignee: Resolution Performance Products LLCInventors: Michael J. Watkins, Robert J. Pawlik
-
Publication number: 20040147690Abstract: Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agents which include a primary amino alcohol reacted into a resinous phenolic compound. Resin systems utilizing the curing agents of the invention exhibit enhanced hot wet adhesion to metal substrates and are particularly useful in the manufacture of powder coatings for pipe.Type: ApplicationFiled: January 27, 2003Publication date: July 29, 2004Applicant: Resolution Performance Products LLCInventors: Michael J. Watkins, Robert J. Pawlik
-
Patent number: 5975872Abstract: A rotary injection molding apparatus includes a stationary frame and a rotatable platform disposed on the frame. The apparatus includes a drive assembly for rotatably driving the platform. The drive assembly includes an indexing motor having a rotating portion that is directly and rigidly operably connected to the platform to define a one-to-one relation between rotation of the motor rotating portion and the platform. The apparatus includes a plurality of mold blocks located on the platform and injection means disposed above the platform for injecting a moldable material into the mold blocks. The apparatus includes a lift portion operably connected to the indexing motor and actuatable to raise and lower the rotatable platform relative to the injection means.Type: GrantFiled: February 23, 1998Date of Patent: November 2, 1999Assignee: Illinois Precision Corp.Inventors: Richard T. Raines, Michael J. Watkins
-
Patent number: 5426263Abstract: An electronic assembly has a double-sided leadless component (10) and one or more printed circuit boards (30, 32). The component has a plurality of electrical terminations or pads (18) on both opposing major surfaces. Each of the printed circuit boards has a printed circuit pattern that has a plurality of pads (34, 36) that correspond to the electrical terminations on both sides of the double-sided leadless component. The electrical terminals on one side of the component are attached to the pads on the first substrate and the electrical terminals on the other side of the leadless component are attached to the pads on the second substrate. The printed circuit boards are joined together to form a multilayered circuit board (44) so that the double-sided leadless component is buried or recessed inside. The component is attached to the pads of the printed circuit board using solder.Type: GrantFiled: December 23, 1993Date of Patent: June 20, 1995Assignee: Motorola, Inc.Inventors: Scott G. Potter, Michael J. Watkins
-
Patent number: 5153007Abstract: A rotary injection molding press having a rotatable platform with a plurality of mold blocks is disclosed, wherein a controller box containing individual temperature control units is mounted on the rotatable platform so as to reliably maintain independent temperature control of each mold block. The controller box includes a rotary coupler for providing a rotating electrical connection from the stationary frame to the controller box, wherein the rotary coupler comprises pairs of wetted electrodes connected through separated pools of mercury. Using this configuration, a highly reliable rotating connection is provided which is substantially frictionless and has a consistently low resistance. Furthermore, by locating the individual temperature control units in a single controller box positioned on the rotatable platform itself, the problem of routing the sensitive control loop signals through a rotating electrical connection is avoided.Type: GrantFiled: May 29, 1991Date of Patent: October 6, 1992Assignee: Illinois Precision CorporationInventor: Michael J. Watkins
-
Patent number: 5115019Abstract: A method for dispersing and stabilizing a carboxy-functionalized butadiene-styrene block copolymer in an epoxy resin is provided comprising the steps of: (a) dispersing from about 5 to about 30 weight percent of a carboxy-functionalized hydrogenated butadiene-styrene block copolymer in a liquid epoxy resin to produce an elastomer-dispersed epoxy resin composition; (b) contacting the elastomer-dispersed epoxy resin composition and from about 15 to about 30 weight percent, based on the weight of the elastomer-modified epoxy resin composition, of a polyhydric phenolic compound in the presence of an advancement catalyst at a temperature within the range of about 40.degree. C. to about 200.degree. C. for time effective for producing a solid elastomer-modified epoxy resin having an epoxy equivalent weight in the range of about 500 to about 1,500; and (c) recovering said solid elastomer-modified epoxy resin.Type: GrantFiled: March 30, 1990Date of Patent: May 19, 1992Assignee: Shell Oil CompanyInventors: Edward J. Marx, Michael J. Watkins
-
Patent number: H1482Abstract: A permanent, flexible coating for protecting and lubricating metal that is formed into articles by single step or multiple step bending or stamping deformation is disclosed. The coating comprises a block copolymer which is formed from selective hydrogenation of an (A-B).sub.n -A or (A-B).sub.n block copolymer. Monomers containing functional groups, preferably monocarboxylic or polycarboxylic acid compounds or their derivatives, are grafted onto the selectively hydrogenated block copolymer in an amount sufficient to improve adhesion of the polymer to the metal. The functionalized block copolymer can be crosslinked to improve resistance of the coating to organic solvents.Type: GrantFiled: September 7, 1993Date of Patent: September 5, 1995Assignee: Shell Oil CompanyInventors: David J. St. Clair, James R. Erickson, Michael J. Watkins