Abstract: A method of producing a printed electronic device on a thin PDMS film which includes coupling a first layer of a water-soluble polymer to a substrate and drying the first layer of the water-soluble polymer. The method further includes coupling a second layer of a crosslinkable PDMS polymer to the first layer of the water-soluble polymer and curing the second layer of the crosslinkable PDMS polymer to form the thin PDMS film. The method also includes printing one or more functional layers on the thin PDMS film and drying the one or more functional layers on the thin PDMS film to form the printed electronic device coupled to the substrate.

Abstract: A method of producing and repulping paper having a silicone release liner includes producing paper having a silicone release liner that is initially secured to the paper by a dissolvable material. During production of the paper, a water-soluble coating may be applied to a paper surface, and a silicone release coating is then applied to the water-soluble coating. Upon rewetting of the paper during repulping, the water-soluble coating dissolves, thereby enabling separation of the silicone release coating from the paper. The repulpable silicone release liner permits recovery of paper fibers using conventional repulping and recycling processes.

Abstract: A method of producing a printed electronic device on a thin PDMS film which includes coupling a first layer of a water-soluble polymer to a substrate and drying the first layer of the water-soluble polymer. The method further includes coupling a second layer of a crosslinkable PDMS polymer to the first layer of the water-soluble polymer and curing the second layer of the crosslinkable PDMS polymer to form the thin PDMS film. The method also includes printing one or more functional layers on the thin PDMS film and drying the one or more functional layers on the thin PDMS film to form the printed electronic device coupled to the substrate.

Abstract: Methods for applying a polyhydroxyalkaonate (PHA) film to a substrate. The substrate is coated with an aqueous PHA emulsion or dispersion to form a PHA coating. Photonic energy is then applied to the PHA coating on the substrate to remove solvent and melt the PHA to form a continuous film.

Abstract: A method of forming a self-supported electronic device, including depositing a sacrificial layer on a first surface substrate, wherein the sacrificial layer is substantially soluble in a first solvent. At least one device layer is deposited in a desired pattern on top of the sacrificial layer. The at least one device layer is substantially insoluble in the at least one device layer. The sacrificial layer is at least partially dissolved in the first solvent to release at least a portion of the first device layer from the substrate. The at least one device layer removed from the substrate forms a self-supported electronic device, which is a thin film electronic device having at least a portion thereof that is not supported by a material carrier.

Abstract: A total joint instrument set according to an exemplary aspect of the present disclosure includes, among other things, a guide assembly that orients a cut in a first bone and a linkage guide that orients a cut in a second bone. A positioning of the linkage guide is mechanically linked to at least a portion of the guide assembly.