Abstract: A container having a base and a lid is provided. The lid may be rotatable about a hinge from a closed configuration to an open configuration and may be secured, via one or more latching assemblies. The latching assembly may comprise a latch body, a locking member, a biasing member, and an activating member. Additional features of the container may include handles and strength increasing features. The base and lid may also feature attachment points for various accessories. A carry strap may attach to the base of the container to allow a user to lift and carry the container. The container may also have a wheels attached to the bottom portion and/or across the bottom portion to one side of the sidewall structure. In addition, in exemplary containers with wheels, a pull handle may be attached to a side opposite the wheels. The lid may include a lid support member that can act as a molle board to releasably secure items to the lid support member while also providing structural support to the lid.

Abstract: A wafer handling system and a method of retrofitting the system to an existing wafer handling apparatus are provided that make possible a method of handling wafers by contacting only a narrow area of not more than two millimeters wide adjacent the edge of the wafer, which is particularly useful for backside deposition where device side contact defines an area of exclusion that renders the wafer unusable in that area. The system provides a chuck on a wafer transfer arm that holds a wafer by gravity on a segmented, upwardly facing annular surface. A compatible annular surface is provided on an aligning station chuck so that wafers can be transferred by contact only with the exclusion area of the wafer surface. A load arm has two similarly compatible chucks further provided with pneumatically actuated grippers to allow the wafer to be loaded into a vertical processing apparatus.

Abstract: A backplane assembly for a substrate processing system that is selectively configurable to provide an effective thermal contact with substrates of differing sizes. The backplane assembly includes a backplane base installed in a vacuum chamber of the substrate processing system and plural faceplates which are removably mountable to the backplane base. The backplane assembly is operable for regulating the temperature of the substrate and include elements that promote the efficient transfer of heat between the backplane base and the faceplate to perform the temperature regulation during processing. Each of the faceplates has a contact surface dimensioned and configured to engage a correspondingly dimensioned and/or configured type of substrate. The faceplates are readily demountable from the backplane base for exchange to accommodate a change in the dimension and/or configuration of the substrates being processed by the substrate processing system without removing the backplane base from the vacuum chamber.

Abstract: A backplane assembly for a substrate processing system that is selectively configurable to provide an effective thermal contact with substrates of differing sizes. The backplane assembly includes a backplane base installed in a vacuum chamber of the substrate processing system and plural faceplates which are removably mountable to the backplane base. The backplane assembly is operable for regulating the temperature of the substrate and include elements that promote the efficient transfer of heat between the backplane base and the faceplate to perform the temperature regulation during processing. Each of the faceplates has a contact surface dimensioned and configured to engage a correspondingly dimensioned and/or configured type of substrate. The faceplates are readily demountable from the backplane base for exchange to accommodate a change in the dimension and/or configuration of the substrates being processed by the substrate processing system without removing the backplane base from the vacuum chamber.

Abstract: A wafer handling system and a method of retrofitting the system to an existing wafer handling apparatus are provided that make possible a method of handling wafers by contacting only a narrow area of not more than two millimeters wide adjacent the edge of the wafer, which is particularly useful for backside deposition where device side contact defines an area of exclusion that renders the wafer unusable in that area. The system provides a chuck on a wafer transfer arm that holds a wafer by gravity on a segmented, upwardly facing annular surface. A compatible annular surface is provided on an aligning station chuck so that wafers can be transferred by contact only with the exclusion area of the wafer surface. A load arm has two similarly compatible chucks further provided with pneumatically actuated grippers to allow the wafer to be loaded into a vertical processing apparatus.