Patents by Inventor Michael James SOLIMANDO

Michael James SOLIMANDO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer
    Patent number: 10002857
    Abstract: A package on package (PoP) device includes a first package, a thermal interface material, and a second package coupled to the first package. The first package includes a first integrated device and a first encapsulation layer that at least partially encapsulates the first integrated device, where the first encapsulation layer includes a first cavity located laterally with respect to the first integrated device. The thermal interface material (TIM) is coupled to the first integrated device such that the thermal interface material (TIM) is formed between the first integrated device and the second package. The thermal interface material (TIM) is formed in the first cavity of the first encapsulation layer.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: June 19, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Michael James Solimando, William Stone, John Holmes, Christopher Healy, Rajendra Pendse, Sun Yun
  • PACKAGE ON PACKAGE (PoP) DEVICE COMPRISING THERMAL INTERFACE MATERIAL (TIM) IN CAVITY OF AN ENCAPSULATION LAYER
    Publication number: 20170294422
    Abstract: A package on package (PoP) device includes a first package, a thermal interface material, and a second package coupled to the first package. The first package includes a first integrated device and a first encapsulation layer that at least partially encapsulates the first integrated device, where the first encapsulation layer includes a first cavity located laterally with respect to the first integrated device. The thermal interface material (TIM) is coupled to the first integrated device such that the thermal interface material (TIM) is formed between the first integrated device and the second package. The thermal interface material (TIM) is formed in the first cavity of the first encapsulation layer.
    Type: Application
    Filed: August 2, 2016
    Publication date: October 12, 2017
    Inventors: Michael James Solimando, William Stone, John Holmes, Christopher Healy, Rajendra Pendse, Sun Yun
  • EXPOSED DIE MOLD UNDERFILL (MUF) WITH FINE PITCH COPPER (CU) PILLAR ASSEMBLY AND BUMP DENSITY
    Publication number: 20170271175
    Abstract: Disclosed is a die packaging structure comprising a semiconductor die, an encapsulant layer disposed around the semiconductor die, wherein a backside surface of the semiconductor die is exposed, and a conductive layer coupled to the semiconductor die, the conductive layer comprising a plurality of conductive pillar bumps, wherein a bump density of the plurality of conductive pillar bumps is greater than 5%, wherein the encapsulant layer is further disposed between the plurality of conductive bumps, and wherein the encapsulant layer is disposed between the plurality of conductive bumps using a mold underfill (MUF) process. A method of forming the same is also disclosed.
    Type: Application
    Filed: March 15, 2017
    Publication date: September 21, 2017
    Inventors: Christopher James HEALY, John Patrick HOLMES, Michael James SOLIMANDO, Sun YUN, William Michael STONE, Rajendra PENDSE