Abstract: A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divider having K input ports and M output ports, where K is a factor of M. Each input port may be coupled to a corresponding receiving element, and each output port may be coupled to an input of a corresponding circuit device. Each submodule may include a heat spreader for removing heat from the circuit devices. The power source module may include a combination RF feed network and heat sink. The combination RF feed network and heat sink may include a wavefront expander to expand the RF input wavefront along at least one axis, and to direct the expanded wavefront to the receiving elements of the N submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of the N submodules.

Abstract: There is disclosed reflect array including a dielectric substrate having a first surface and a second surface. The first surface may support a first array of phasing elements and a second array of phasing element, where the elements of the first array have a first shape and the elements of the second array may have a second shape different from the first shape. The second surface may support a conductive layer.

Abstract: A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divider having K input ports and M output ports, where K is a factor of M. Each input port may be coupled to a corresponding receiving element, and each output port may be coupled to an input of a corresponding circuit device. Each submodule may include a heat spreader for removing heat from the circuit devices. The power source module may include a combination RF feed network and heat sink. The combination RF feed network and heat sink may include a wavefront expander to expand the RF input wavefront along at least one axis, and to direct the expanded wavefront to the receiving elements of the N submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of the N submodules.

Abstract: A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divider having K input ports and M output ports, where K is a factor of M. Each input port may be coupled to a corresponding receiving element, and each output port may be coupled to an input of a corresponding circuit device. Each submodule may include a heat spreader for removing heat from the circuit devices. The power source module may include a combination RF feed network and heat sink. The combination RF feed network and heat sink may include a wavefront expander to expand the RF input wavefront along at least one axis, and to direct the expanded wavefront to the receiving elements of the N submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of the N submodules.

Abstract: There is disclosed a millimeter wave power source module which may include a plurality of submodules. Each submodule may include a further plurality of circuit devices. Each circuit device may have an input coupled to a corresponding receiving element and an output coupled to a corresponding radiating element. Each submodule may also include a heat spreader for removing heat from the plurality of circuit devices. A combination RF feed network and heat sink may include a waveguide horn to couple an RF input wave to the receiving elements on each of the plurality of submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of each of the plurality of submodules.

Abstract: There is disclosed reflect array including a dielectric substrate having a first surface and a second surface. The first surface may support a first array of phasing elements and a second array of phasing element, where the elements of the first array have a first shape and the elements of the second array may have a second shape different from the first shape. The second surface may support a conductive layer.