Patents by Inventor Michael Joseph Hundt

Michael Joseph Hundt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mountable integrated circuit package with detachable module and interposer
    Patent number: 5994774
    Abstract: A modular integrated circuit package is mounted on a surface of a printed circuit board. The integrated circuit package includes a rigid interposer releasably coupling a component module to a substrate member designed to be affixed to the printed circuit board. The substrate member has a first side with plural first electrical connectors for connection to the circuit board and a second side with second electrical connectors coupled to the first electrical connectors. The interposer includes a plurality of electrical connectors that couple electrical connectors of the component module to the second electrical connectors of the substrate member. The component module also includes plural clip members that engage a lower surface of the interposer to releasably couple the component module to the interposer.
    Type: Grant
    Filed: October 30, 1997
    Date of Patent: November 30, 1999
    Assignee: STMicroelectronics, Inc.
    Inventors: Harry Michael Siegel, Michael Joseph Hundt, Robert H. Bond