Abstract: A method and apparatus for bonding a first substrate to a second substrate can include an intermediate layer disposed between the substrates. In one embodiment, the intermediate layer can be disposed to a bonding area of the first substrate and only one adhesive layer can be disposed between the intermediate layer and the second substrate. In other embodiments, a plurality of intermediate layers can be used.

Abstract: A method for forming a relatively transparent fiber composite is disclosed. In one embodiment, the relatively transparent fiber composite can include glass fibers with a relatively low amount of iron oxide. In another embodiment, the transparent fiber composite can include a selected resin, a sizing and glass fibers where the index of refraction of the glass fibers, the sizing and the resin can be similar, within a tolerance amount. In yet another embodiment, the resin can be relatively clear and free from pigments and tints. In one embodiment, the glass fibers can be formed into a mat. In another embodiment, glass fibers can be chopped or milled and a relatively transparent part can be formed through injection molding.

Abstract: Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

Abstract: A method is provided for fabricating a composite panel with a surface finish. The method includes securing a polymer film within a first portion of a mold and securing a composite panel within a second portion of the mold. The method also includes holding the first portion of the mold against the second portion of the mold to form a mold cavity between composite panel and the polymer film. The method further includes heating the mold to an elevated temperature, injecting a polymer resin into the mold cavity, and curing the polymer resin to form an integrated structure having a polymer resin layer between the composite panel and the polymer film.

Abstract: An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

Abstract: Apparatus, systems and methods for windows integration with cover glass and for processing cover glass to provide windows for electronic devices are disclosed. Transparent windows such as a transparent camera window, a transparent illuminator window and/or a transparent display window can be integrated into the cover glass. The apparatus, systems and methods are especially suitable for cover glasses, or displays (e.g., LCD displays), assembled in small form factor electronic devices such as handheld electronic devices (e.g., mobile phones, media players, personal digital assistants, remote controls, etc.). The apparatus, systems and methods can also be used for cover glasses or displays for other relatively larger form factor electronic devices (e.g., portable computers, tablet computers, displays, monitors, televisions, etc.).

Abstract: Using nano-particles to topographically enhance the reacting surface of an inorganic fiber used as a reinforcement medium in an embedding matrix is described.

Abstract: Materials, apparatus and methods of forming structural components for consumer electronics devices are described. In one embodiment, ceramic fibers, such as alumina, are mixed with a thermoplastic, such as nylon, to form a composite material usable in an injection molding process. The volume percent of ceramic fibers used with the thermoplastic can be selected to improve the strength properties of the composite material. Pigments can be added to the composite material to affect its aesthetic appeal. In one embodiment, the composite material including the ceramic fibers can be used to form frame components usable in a consumer electronic device. The frame components can be load bearing structures that are externally visible or used within the interior of the device.

Abstract: Various embodiments of a process for making hollow thermoplastic articles are provided. In one embodiment, a process for producing hollow thermoplastic article includes placing a sock preform of a first polymer composition about a core pin and injection molding a molten parison of a second polymer composition that is different than the first polymer composition into an injection mold cavity and onto the sock perform. The injection molding process produces an injection preform having two different material compositions. The process further include blow molding the injection preform to produce a hollow thermoplastic article having an interior surface of the first polymer composition and an exterior surface of the second polymer composition.