Patents by Inventor Michael Kenneth CONTI

Michael Kenneth CONTI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM IN A PACKAGE MODIFICATIONS
    Publication number: 20240087975
    Abstract: Methods and structures for manufacturing one or more System in a Package (SiP) devices, where the functionality of a packaged SiP device may be modified by additional components.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Applicant: Octavo Systems LLC
    Inventors: Michael Kenneth CONTI, Christopher Lloyd REINERT, Masood MURTUZA
  • System in a package modifications
    Patent number: 11869823
    Abstract: Methods and structures for manufacturing one or more System in a Package (SiP) devices, where the functionality of a packaged SiP device may be modified by additional components.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: January 9, 2024
    Assignee: OCTAVO SYSTEMS LLC
    Inventors: Michael Kenneth Conti, Christopher Lloyd Reinert, Masood Murtuza
  • SYSTEM IN A PACKAGE MODIFICATIONS
    Publication number: 20210143075
    Abstract: Methods and structures for manufacturing one or more System in a Package (SiP) devices, where the functionality of a packaged SiP device may be modified by additional components.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 13, 2021
    Applicant: Octavo Systems LLC
    Inventors: Michael Kenneth CONTI, Christopher Lloyd REINERT, Masood MURTUZA