Patents by Inventor Michael Ko Kwangwoo

Michael Ko Kwangwoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090283198
    Abstract: Mechanism for controlling pressure during the adhesive thermal compression bonding provides benefits of higher production yield, improved adhesive bonding performance and quality. Springs and pneumatic pistons are utilized to provide improved pressure control during the adhesive thermal compression bonding process. All production parts have certain geometric tolerances and automatically accommodating these tolerances increases production yield by reducing waste of incompletely adhesive bonded parts. The gaps caused by the parts tolerance are closed in a controlled manner using the mechanism and the pressure is controlled for effective adhesive bonding.
    Type: Application
    Filed: May 19, 2009
    Publication date: November 19, 2009
    Inventor: Michael Ko Kwangwoo