Patents by Inventor Michael Kuntzman
Michael Kuntzman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210176570Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.Type: ApplicationFiled: January 27, 2021Publication date: June 10, 2021Applicant: KNOWLES ELECTRONICS, LLCInventors: Michael KUNTZMAN, Michael PEDERSEN, Sung Bok LEE, Bing YU, Vahid NADERYAN, Peter LOEPPERT
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Publication number: 20210136475Abstract: An acoustic transducer comprises a transducer substrate having an aperture defined therethrough. At least one diaphragm is disposed on the transducer substrate over the aperture. A back plate is disposed on the transducer substrate and axially spaced apart from the at least one diaphragm. A perimetral support structure is disposed circumferentially between the at least one diaphragm and the back plate at a radially outer perimeter of the back plate. A plurality of perimetral release holes are defined circumferentially through at least one of the at least one diaphragm or the back plate proximate to and radially inwards of the perimetral support structure, at least a portion of the plurality of perimetral release holes defining a non-circular shape.Type: ApplicationFiled: October 27, 2020Publication date: May 6, 2021Inventors: Michael Kuntzman, Sung B. Lee, Vahid Naderyan, Yunfei Ma, Bing Yu
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Publication number: 20210070610Abstract: A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.Type: ApplicationFiled: November 16, 2020Publication date: March 11, 2021Applicant: KNOWLES ELECTRONICS, LLCInventors: Sung Bok LEE, Vahid NADERYAN, Bing YU, Michael KUNTZMAN, Yunfei MA, Michael PEDERSEN
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Patent number: 10939214Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.Type: GrantFiled: October 4, 2019Date of Patent: March 2, 2021Assignee: Knowles Electronics, LLCInventors: Michael Kuntzman, Michael Pedersen, Sung Bok Lee, Bing Yu, Vahid Naderyan, Peter Loeppert
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Publication number: 20210006883Abstract: A microphone assembly comprises a substrate and an enclosure disposed on the substrate. A port is defined in one of the substrate or the enclosure. An acoustic transducer is configured to generate an electrical signal in response to acoustic activity. The acoustic transducer comprises a membrane separating a front volume from a back volume of the microphone assembly. The front volume is in fluidic communication with the port, and the back volume is filled with a first gas having a thermal conductivity lower than a thermal conductivity of air. An integrated circuit is electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer. At least a portion of a boundary defining at least one of the front volume or the back volume is configured to have compliance so as to allow pressure equalization. The first gas is different from the second gas.Type: ApplicationFiled: September 17, 2020Publication date: January 7, 2021Applicant: Knowles Electronics, LLCInventors: Peter Loeppert, Michael Pedersen, Michael Kuntzman
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Patent number: 10887712Abstract: A microphone assembly includes an acoustic transducer and an audio signal electrical circuit configured to receive an output signal from the acoustic transducer. The output signal includes an audio signal component and a tracking signal component. The audio signal component is representative of an acoustic signal detected by the acoustic transducer and the tracking signal component is based on an input tracking signal applied to the acoustic transducer. The audio signal electrical circuit includes an analog to digital converter configured to convert the output signal into a digital signal, an extraction circuit configured to separate the tracking signal component and the audio signal component from the digital signal, an envelope estimation circuit configured to estimate a tracking signal envelope from the tracking signal component, and a signal correction circuit configured to reduce distortion in the audio signal component using the tracking signal envelope.Type: GrantFiled: June 26, 2018Date of Patent: January 5, 2021Assignee: Knowles Electronics, LLCInventors: Kim Spetzler Berthelsen, Michael Kuntzman, Claus Furst, Sung Bok Lee, Mohammad Shajaan, Venkataraman Chandrasekaran
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Patent number: 10870577Abstract: A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.Type: GrantFiled: October 4, 2019Date of Patent: December 22, 2020Assignee: Knowles Electronics, LLCInventors: Sung Bok Lee, Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Michael Pedersen
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Patent number: 10805702Abstract: A microphone assembly comprises a substrate and an enclosure disposed on the substrate. A port is defined in one of the substrate or the enclosure. An acoustic transducer is configured to generate an electrical signal in response to acoustic activity. The acoustic transducer comprises a membrane separating a front volume from a back volume of the microphone assembly. The front volume is in fluidic communication with the port, and the back volume is filled with a first gas having a thermal conductivity lower than a thermal conductivity of air. An integrated circuit is electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer. At least a portion of a boundary defining at least one of the front volume or the back volume is configured to have compliance so as to allow pressure equalization. The first gas is different from the second gas.Type: GrantFiled: May 13, 2019Date of Patent: October 13, 2020Assignee: KNOWLES ELECTRONICS, LLCInventors: Peter Loeppert, Michael Pedersen, Michael Kuntzman
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Publication number: 20200213773Abstract: A microphone assembly includes an acoustic transducer having a back plate and a diaphragm, such that a surface of the back plate includes a plurality of holes. At least a portion of the plurality of holes are arranged in a non-uniform pattern. The non-uniform pattern includes holes of varying sizes spaced apart from neighboring holes by varying distances. The microphone assembly further includes an audio signal electrical circuit configured to receive an acoustic signal from the acoustic transducer.Type: ApplicationFiled: September 14, 2018Publication date: July 2, 2020Applicant: Knowles Electronics, LLCInventors: Vahid Naderyan, Michael Kuntzman, Sung Bok Lee, Wade Conklin
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Publication number: 20200162830Abstract: A microphone assembly includes an acoustic transducer and an audio signal electrical circuit configured to receive an output signal from the acoustic transducer. The output signal includes an audio signal component and a tracking signal component. The audio signal component is representative of an acoustic signal detected by the acoustic transducer and the tracking signal component is based on an input tracking signal applied to the acoustic transducer. The audio signal electrical circuit includes an analog to digital converter configured to convert the output signal into a digital signal, an extraction circuit configured to separate the tracking signal component and the audio signal component from the digital signal, an envelope estimation circuit configured to estimate a tracking signal envelope from the tracking signal component, and a signal correction circuit configured to reduce distortion in the audio signal component using the tracking signal envelope.Type: ApplicationFiled: June 26, 2018Publication date: May 21, 2020Applicant: KNOWLES ELECTRONICS, LLCInventors: Kim Spetzler BERTHELSEN, Michael KUNTZMAN, Claus FURST, Sung Bok LEE, Mohammad SHAJAAN, Venkataraman CHANDRASEKARAN
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Publication number: 20200112799Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.Type: ApplicationFiled: October 4, 2019Publication date: April 9, 2020Applicant: KNOWLES ELECTRONICS, LLCInventors: Michael Kuntzman, Michael Pedersen, Sung Bok Lee, Bing Yu, Vahid Naderyan, Peter Loeppert
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Publication number: 20200112800Abstract: A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.Type: ApplicationFiled: October 4, 2019Publication date: April 9, 2020Applicant: KNOWLES ELECTRONICS, LLCInventors: Sung Bok Lee, Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Wade Conklin, Peter Loeppert
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Publication number: 20200109048Abstract: A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.Type: ApplicationFiled: October 4, 2019Publication date: April 9, 2020Applicant: KNOWLES ELECTRONICS, LLCInventors: Sung Bok Lee, Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Michael Pedersen
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Publication number: 20190356974Abstract: A microphone assembly comprises a substrate and an enclosure disposed on the substrate. A port is defined in one of the substrate or the enclosure. An acoustic transducer is configured to generate an electrical signal in response to acoustic activity. The acoustic transducer comprises a membrane separating a front volume from a back volume of the microphone assembly. The front volume is in fluidic communication with the port, and the back volume is filled with a first gas having a thermal conductivity lower than a thermal conductivity of air. An integrated circuit is electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer. At least a portion of a boundary defining at least one of the front volume or the back volume is configured to have compliance so as to allow pressure equalization. The first gas is different from the second gas.Type: ApplicationFiled: May 13, 2019Publication date: November 21, 2019Applicant: KNOWLES ELECTRONICS, LLCInventors: Peter Loeppert, Michael Pedersen, Michael Kuntzman
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Patent number: 10362408Abstract: The present disclosure relates generally to microphones and related components. One example micro electro mechanical system (MEMS) motor includes a first diaphragm; a second diaphragm that is disposed in generally parallel relation to the first diaphragm, the first diaphragm and second diaphragm forming an air gap there between; and a back plate disposed in the air gap between and disposed in generally parallel relation to the first diaphragm and the second diaphragm.Type: GrantFiled: February 3, 2017Date of Patent: July 23, 2019Assignee: Knowles Electronics, LLCInventors: Michael Kuntzman, Wade Conklin, Sung Bok Lee
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Patent number: 10349184Abstract: The present disclosure generally relates to acoustic assemblies. One acoustic assembly includes a base and a first die disposed on the base. The first die comprises a microelectromechanical system (MEMS) microphone that includes a first diaphragm and a first back plate. The MEMS microphone has a barometric release. The acoustic assembly also includes a second die disposed on the base. The second die comprises a pressure sensor. The acoustic assembly further includes a cover coupled to the base and enclosing the first dies and the second die. A back volume is formed between the base, the first die, the second die, and the cover. The pressure sensor is configured to sense a pressure of the back volume.Type: GrantFiled: February 3, 2017Date of Patent: July 9, 2019Assignee: Knowles Electronics, LLCInventors: Michael Kuntzman, Wade Conklin, Sung Bok Lee
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Publication number: 20190191245Abstract: A microphone includes a micro electro mechanical system (MEMS) motor. The MEMS motor includes a diaphragm and at least one back plate. The diaphragm is formed with a tension caused by a film stress of the diaphragm. The diaphragm is electrically biased according to a voltage to adjust or compensate for the film stress.Type: ApplicationFiled: March 11, 2019Publication date: June 20, 2019Applicant: Knowles Electronics, LLCInventors: Wade Conklin, Michael Kuntzman, Sung Bok Lee
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Patent number: 10315912Abstract: A microelectromechanical system (MEMS) includes a diaphragm with a first surface and a second surface. The first surface is exposed to an environmental pressure. The second surface comprises a plurality of fingers extending from the second surface. The MEMS also includes a backplate comprising a plurality of voids. Each of the plurality of fingers extends into a respective one of the plurality of voids. The MEMS further includes an insulator between a portion of the diaphragm and a portion of the backplate. The diaphragm is configured to move with respect to the backplate in response to changes in the environmental pressure.Type: GrantFiled: December 22, 2017Date of Patent: June 11, 2019Assignee: Knowles Electronics, LLCInventors: Mohsin Nawaz, Michael Kuntzman, Michael Pedersen
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Patent number: 10277979Abstract: Systems and apparatuses for a MEMS device. The MEMS device includes a diaphragm and a backplate spaced a distance from the diaphragm forming an air gap therebetween. The backplate includes a first surface facing toward the diaphragm and an opposing second surface facing away from the diaphragm. The first surface and the opposing second surface of the backplate cooperatively define a plurality of through-holes that extend through the backplate allowing air from the air gap to flow therethrough. Each of the plurality of through-holes include a first aperture disposed along the first surface, a second aperture disposed along the opposing second surface, and a sidewall extending between the first surface and the opposing second surface. The first aperture and the second aperture have different dimensions.Type: GrantFiled: May 19, 2016Date of Patent: April 30, 2019Assignee: Knowles Electronics, LLCInventors: Vahid Naderyan, Wade Conklin, Michael Kuntzman, Sung Lee
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Patent number: 10158943Abstract: A microphone includes a first micro electro mechanical system (MEMS) motor, the first MEMS motor including a first diaphragm and a first back plate; and a second MEMS motor including a second diaphragm and a second back plate. The first diaphragm is electrically biased relative to the first back plate according to a first voltage, the second diaphragm is biased relative to the second back plate according to a second voltage, and a magnitude of the first voltage is different from a magnitude of the second voltage.Type: GrantFiled: January 31, 2017Date of Patent: December 18, 2018Assignee: Knowles Electronics, LLCInventors: Wade Conklin, Michael Kuntzman, Sung Bok Lee