Patents by Inventor Michael Kutney
Michael Kutney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128100Abstract: Spectral data associated with one or more regions of a surface of a substrate is identified. The substrate has been processed according to one or more first operations of a process recipe that is unknown to a system controller for the manufacturing system. The spectral data is provided as input to a machine learning model that is trained to predict, based on given spectral data, a respective process recipe associated with the substrate and one or more operations of the respective process recipe that have already been performed. A determination is made, based on one or more outputs of the machine learning model, that the substrate is associated with the process recipe and that one or more second operations are yet to be performed. The substrate is caused to be processed according to the one or more second operations of the process recipe.Type: ApplicationFiled: October 11, 2023Publication date: April 18, 2024Inventors: Hsinyi Tsai, Thomas Li, Zhaozhao Zhu, Michael Kutney, Upendra V. Ummethala
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Patent number: 11927543Abstract: A system includes a memory, and at least one processing device, operatively coupled to the memory, to facilitate an etch recipe development process by performing operations including obtaining, from an optical detector, first material thickness data for a first material and second material thickness data for a second material resulting from an iteration of an etch process using an etch recipe. The first material is located at a first reflectometry measurement point and the second material is located at a second reflectometry measurement point different from the first reflectometry measurement point. The operations further include determining one or more etch parameters based on at least the first material thickness data and the second material thickness data.Type: GrantFiled: January 26, 2023Date of Patent: March 12, 2024Assignee: Applied Materials, Inc.Inventors: Blake Erickson, Keith Berding, Michael Kutney, Soumendra Barman, Zhaozhao Zhu, Michelle SanPedro, Suresh Polali Narayana Rao
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Publication number: 20230341699Abstract: Implementations disclosed describe a collimator assembly having a collimator housing that includes an interface configured to optically couple to a process chamber that has a target surface, and a port to receive an optical fiber to deliver, to an enclosure formed by the collimator housing, a first (second) plurality of spectral components of light belonging to a first (second) range of wavelengths, and an achromatic lens located, at least partially, within the enclosure formed by the collimator housing, the achromatic lens to direct the first (second) plurality of spectral components of light onto the target surface to illuminate a first (second) region on the target surface, wherein the second region is substantially the same as the first region.Type: ApplicationFiled: June 27, 2023Publication date: October 26, 2023Inventors: Pengyu Han, John John O’Malley, Michael N. Grimbergen, Lei Lian, Upendra Ummethala, Michael Kutney
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Publication number: 20230326773Abstract: A process recipe associated with a substrate at a manufacturing system is identified. A first set of measurements for the substrate is obtained from a substrate measurement subsystem. A second set of measurements for the substrate is obtained from one or more sensors of a chamber of the manufacturing system. A determination is made based on the obtained first set of measurements and the obtained second set of measurements of whether to modify the process recipe by at least one of modifying an operation of the process recipe or generating an instruction to prevent completion of execution of one or more operations of the process recipe.Type: ApplicationFiled: June 15, 2023Publication date: October 12, 2023Inventors: Upendra V. Ummethala, Blake Erickson, Prashanth Kumar, Michael Kutney, Steven Trey Tindel, Zhaozhao Zhu
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Publication number: 20230258500Abstract: An apparatus includes a base component and a plurality of collimators housed within the base component. Each collimator of the plurality of collimators corresponds to a respective location of a plurality of locations of a wafer in an etch chamber. The plurality of locations includes a center location of the wafer, a plurality of inner ring locations along an inner ring of the wafer associated with a first set of radially symmetric optical emission spectroscopy (OES) signal sampling paths, and a plurality of outer ring locations along an outer ring of the wafer associated with a second set of radially symmetric OES signal sampling paths.Type: ApplicationFiled: April 25, 2023Publication date: August 17, 2023Inventors: Blake Erickson, Keith Berding, Michael Kutney, Zhaozhao Zhu, Tsung Feng Wu, Michael D. Willwerth, Jeffrey Ludwig
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Patent number: 11719952Abstract: Implementations disclosed describe a collimator assembly having a collimator housing that includes an interface configured to optically couple to a process chamber that has a target surface, and a port to receive an optical fiber to deliver, to an enclosure formed by the collimator housing, a first (second) plurality of spectral components of light belonging to a first (second) range of wavelengths, and an achromatic lens located, at least partially, within the enclosure formed by the collimator housing, the achromatic lens to direct the first (second) plurality of spectral components of light onto the target surface to illuminate a first (second) region on the target surface, wherein the second region is substantially the same as the first region.Type: GrantFiled: August 11, 2020Date of Patent: August 8, 2023Assignee: Applied Materials, Inc.Inventors: Pengyu Han, John Anthony O'Malley, Michael N. Grimbergen, Lei Lian, Upendra Ummethala, Michael Kutney
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Publication number: 20230238266Abstract: An apparatus includes a substrate holder, a first actuator to rotate the substrate holder, a second actuator to move the substrate holder linearly, a first sensor to generate one or more first measurements or images of the substrate, a second sensor to generate one or more second measurements of target positions on the substrate, and a processing device. The processing device estimates a position of the substrate on the substrate holder and causes the first actuator to rotate the substrate holder about a first axis. The rotation causes an offset between a field of view of the second sensor and a target position on the substrate due to the substrate not being centered on the substrate holder. The processing device causes the second actuator to move the substrate holder linearly along a second axis to correct the offset. The processing device determines a profile across a surface of the substrate based on the one or more second measurements of the target positions.Type: ApplicationFiled: January 25, 2022Publication date: July 27, 2023Inventors: Patricia Schulze, Gregory John Freeman, Michael Kutney, Arunkumar Ramachandraiah, Chih Chung Chou, Zhaozhao Zhu, Ozkan Celik
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Publication number: 20230236583Abstract: A substrate processing system includes a process chamber, one or more robot, a substrate measurement system, and a computing device. The process chamber may process a substrate that will comprise a film and/or feature after the processing. The one or more robot, to move the substrate from the process chamber to a substrate measurement system. The substrate measurement system may measure the film and/or feature on the substrate and generate a profile map of the film and/or feature. The computing device may process data from the profile map using a first trained machine learning model, wherein the first trained machine learning model outputs a first chamber component condition estimation for a first chamber component of the process chamber. The computing device may then determine whether to perform maintenance on the first chamber component of the process chamber based at least in part on the first chamber component condition estimation.Type: ApplicationFiled: January 25, 2022Publication date: July 27, 2023Inventors: Chunlei Zhang, Zhaozhao Zhu, Michael Kutney
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Publication number: 20230236569Abstract: A method includes processing a substrate in a process chamber according to a recipe, wherein the substrate comprises at least one of a film or a feature after the processing. The method further includes generating a profile map of the first substrate. The method further includes processing data from the profile map using a first model, wherein the first model outputs at least one of an estimated mesa condition of a substrate support for the process chamber, an estimated lift pin location condition of the substrate support an estimated seal band condition of the substrate support, or an estimated process kit ring condition for a process kit ring for the process chamber. The method further includes outputting a notice as a result of the processing.Type: ApplicationFiled: August 5, 2022Publication date: July 27, 2023Inventors: Chunlei Zhang, Zhaozhao Zhu, Michael Kutney
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Patent number: 11688616Abstract: A method for determining whether to modify a manufacturing process recipe is provided. A substrate to be processed at a manufacturing system according to the first process recipe is identified. An instruction to transfer the substrate to a substrate measurement subsystem to obtain a first set of measurements for the substrate is generated. The first set of measurements for the substrate is received from the substrate measurement subsystem. An instruction to transfer the substrate from the substrate measurement subsystem to a processing chamber is generated. A second set of measurements for the substrate is received from one or more sensors of the processing chamber. A first mapping between the first set of measurements and the second set of measurements for the substrate is generated. The first set of measurements mapped to the second set of measurements for the substrate is stored.Type: GrantFiled: July 19, 2021Date of Patent: June 27, 2023Assignee: Applied Materials, Inc.Inventors: Upendra V. Ummethala, Blake Erickson, Prashanth Kumar, Michael Kutney, Steven Trey Tindel, Zhaozhao Zhu
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Patent number: 11668602Abstract: An apparatus includes a base component and collimators housed within the base component. The collimators correspond to collection cylinders for sampling optical emission spectroscopy (OES) signals with respect to locations of a wafer in an etch chamber. The apparatus further includes a guide, operatively coupled to the plurality of collimators, to guide the sampling of the OES signals along paths for sampling the OES signals.Type: GrantFiled: April 20, 2021Date of Patent: June 6, 2023Assignee: Applied Materials, Inc.Inventors: Blake Erickson, Keith Berding, Michael Kutney, Zhaozhao Zhu, Tsung Feng Wu, Michael D. Willwerth, Jeffrey Ludwig
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Publication number: 20230168210Abstract: A system includes a memory, and at least one processing device, operatively coupled to the memory, to facilitate an etch recipe development process by performing operations including obtaining, from an optical detector, first material thickness data for a first material and second material thickness data for a second material resulting from an iteration of an etch process using an etch recipe. The first material is located at a first reflectometry measurement point and the second material is located at a second reflectometry measurement point different from the first reflectometry measurement point. The operations further include determining one or more etch parameters based on at least the first material thickness data and the second material thickness data.Type: ApplicationFiled: January 26, 2023Publication date: June 1, 2023Inventors: Blake Erickson, Keith Berding, Michael Kutney, Soumendra Barman, Zhaozhao Zhu, Michelle SanPedro, Suresh Polali Narayana Rao
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Patent number: 11619594Abstract: A system includes a memory and at least one processing device operatively coupled to the memory to facilitate an etch recipe development process by performing a number of operations. The operations include receiving a request to initiate an iteration of an etch process using an etch recipe to etch a plurality of materials each located at a respective one of a plurality of reflectometry measurement points, obtaining material thickness data for each of the plurality of materials resulting from the iteration of the etch process, and determining one or more etch parameters based on the material thickness data.Type: GrantFiled: April 28, 2021Date of Patent: April 4, 2023Assignee: Applied Materials, Inc.Inventors: Blake Erickson, Keith Berding, Michael Kutney, Soumendra Barman, Zhaozhao Zhu, Michelle SanPedro, Suresh Polali Narayana Rao
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Publication number: 20230062206Abstract: Spectral data associated with a first prior substrate and/or a second prior substrate is obtained. A metrology measurement value associated with the first portion of the first prior substrate is determined based on one or more metrology measurement values measured for at least one of a second portion of the first prior substrate or a third portion of a second prior substrate. Training data for training a machine learning model to predict metrology measurement values of a current substrate is generated. Generating the training data includes generating a first training input including the spectral data associated with the first prior substrate and generating a first target output for the first training input, the first target output including the determined metrology measurement value associated with the first portion of the first prior substrate. The training data is provided to train the machine learning model.Type: ApplicationFiled: October 14, 2022Publication date: March 2, 2023Inventors: Thomas Li, Upendra V. Ummethala, Blake Erickson, Prashanth Kumar, Michael Kutney, Steven Trey Tindel, Zhaozhao Zhu
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Publication number: 20220349833Abstract: A system includes a memory and at least one processing device operatively coupled to the memory to facilitate an etch recipe development process by performing a number of operations. The operations include receiving a request to initiate an iteration of an etch process using an etch recipe to etch a plurality of materials each located at a respective one of a plurality of reflectometry measurement points, obtaining material thickness data for each of the plurality of materials resulting from the iteration of the etch process, and determining one or more etch parameters based on the material thickness data.Type: ApplicationFiled: April 28, 2021Publication date: November 3, 2022Inventors: Blake Erickson, Keith Berding, Michael Kutney, Soumendra Barman, Zhaozhao Zhu, Michelle SanPedro, Suresh Polali Narayana Rao
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Publication number: 20220333989Abstract: An apparatus includes a base component and collimators housed within the base component. The collimators correspond to collection cylinders for sampling optical emission spectroscopy (OES) signals with respect to locations of a wafer in an etch chamber. The apparatus further includes a guide, operatively coupled to the plurality of collimators, to guide the sampling of the OES signals along paths for sampling the OES signals.Type: ApplicationFiled: April 20, 2021Publication date: October 20, 2022Inventors: Blake Erickson, Keith Berding, Michael Kutney, Zhaozhao Zhu, Tsung Feng Wu, Michael D. Willwerth, Jeffrey Ludwig
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Publication number: 20220066411Abstract: Methods and systems for detecting and correcting substrate process drift using machine learning are provided. Data associated with processing each of a first set of substrates at a manufacturing system according to a process recipe is provided as input to a trained machine learning model. One or more outputs are obtained from the trained machine learning model. An amount of drift of a first set of metrology measurement values for the first set of substrates from a target metrology measurement value is determined from the one or more outputs. Process recipe modification identifying one or more modifications to the process recipe is also determined. For each modification, an indication of a level of confidence that a respective modification to the process recipe satisfies a drift criterion for a second set of substrates is determined.Type: ApplicationFiled: July 19, 2021Publication date: March 3, 2022Inventors: Upendra V. Ummethala, Blake Erickson, Prashanth Kumar, Michael Kutney, Steven Trey Tindel, Zhaozhao Zhu
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Publication number: 20220050303Abstract: Implementations disclosed describe a collimator assembly having a collimator housing that includes an interface configured to optically couple to a process chamber that has a target surface, and a port to receive an optical fiber to deliver, to an enclosure formed by the collimator housing, a first (second) plurality of spectral components of light belonging to a first (second) range of wavelengths, and an achromatic lens located, at least partially, within the enclosure formed by the collimator housing, the achromatic lens to direct the first (second) plurality of spectral components of light onto the target surface to illuminate a first (second) region on the target surface, wherein the second region is substantially the same as the first region.Type: ApplicationFiled: August 11, 2020Publication date: February 17, 2022Inventors: Pengyu Han, John Anthony O'Malley, Michael N. Grimbergen, Lei Lian, Upendra Ummethala, Michael Kutney
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Publication number: 20220028713Abstract: A method for determining whether to modify a manufacturing process recipe is provided. A substrate to be processed at a manufacturing system according to the first process recipe is identified. An instruction to transfer the substrate to a substrate measurement subsystem to obtain a first set of measurements for the substrate is generated. The first set of measurements for the substrate is received from the substrate measurement subsystem. An instruction to transfer the substrate from the substrate measurement subsystem to a processing chamber is generated. A second set of measurements for the substrate is received from one or more sensors of the processing chamber. A first mapping between the first set of measurements and the second set of measurements for the substrate is generated. The first set of measurements mapped to the second set of measurements for the substrate is stored.Type: ApplicationFiled: July 19, 2021Publication date: January 27, 2022Inventors: Upendra V. Ummethala, Blake Erickson, Prashanth Kumar, Michael Kutney, Steven Trey Tindel, Zhaozhao Zhu
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Patent number: D977504Type: GrantFiled: July 22, 2020Date of Patent: February 7, 2023Assignee: Applied Materials, Inc.Inventors: Upendra V. Ummethala, Blake Erickson, Prashanth Kumar, Michael Kutney, Steven Trey Tindel, Zhaozhao Zhu