Patents by Inventor Michael L. Hayden

Michael L. Hayden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7425362
    Abstract: A plastic cushion pad (40) includes at least one plastic spring portion (46) between oppositely facing contact surfaces (42, 44). In one example, the pad (40) is vacuum formed using a film of carbon-impregnated polystyrene material. The plastic spring portion (46) is configured to provide the desired amount of resiliency or cushion provided by the pad responsive to a compressive force. In one example, the plastic spring portion is designed to prevent any lateral deformation of the pad when a compressive force is applied.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: September 16, 2008
    Assignee: e.Pak International, Inc.
    Inventors: James R. Thomas, Clifton C. Haggard, Jason D. Brown, Song Ping Chen, Ru Zheng Liu, Michael L. Hayden
  • Publication number: 20040048028
    Abstract: A plastic cushion pad (40) includes at least one plastic spring portion (46) between oppositely facing contact surfaces (42, 44). In one example, the pad (40) is vacuum formed using a film of carbon-impregnated polystyrene material. The plastic spring portion (46) is configured to provide the desired amount of resiliency or cushion provided by the pad responsive to a compressive force. In one example, the plastic spring portion is designed to prevent any lateral deformation of the pad when a compressive force is applied.
    Type: Application
    Filed: March 11, 2003
    Publication date: March 11, 2004
    Inventors: James R. Thomas, Clifton C. Haggard, Jason D. Brown, Song Ping Chen, Ru Zheng Liu, Michael L. Hayden
  • Patent number: 6469372
    Abstract: A carrier and cover tape assemblage for semiconductor devices which maintains integrity through bake temperature of 125 degrees C is provided by cover and carrier tapes of the same material, such as polycarbonate, and thus having the same thermal properties so that the joining adhesive is placed under minimal stress to cause delamination or distortion.
    Type: Grant
    Filed: May 10, 2001
    Date of Patent: October 22, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Michael L. Hayden, Clessie A. Troxtell, Jr.
  • Publication number: 20010042909
    Abstract: A carrier and cover tape assemblage for semiconductor devices which maintains integrity through bake temperature of 125 degrees C. is provided by cover and carrier tapes of the same material, such as polycarbonate, and thus having the same thermal properties so that the joining adhesive is placed under minimal stress to cause delamination or distortion.
    Type: Application
    Filed: May 10, 2001
    Publication date: November 22, 2001
    Inventors: Michael L. Hayden, Clessie A. Troxtell
  • Patent number: 6116423
    Abstract: A multifunctional shipping container for integrated circuits, and methods of using and reusing the container are described. The compact container coupled with foam inserts is dimensioned to securely ship and store integrated circuits in either tray or reel format. The container with an expandable cavity allows ease of access for loading and unloading the contents at multiple work stations, and may be converted to an in-house "tote". Multifunctionality of the container supports use as a shipping system from the tray or reel supplier, to the IC assembly and test site, to distribution centers, and to the IC customer, thus eliminating multiple costs of disposal, inventory and new shipping materials.
    Type: Grant
    Filed: July 23, 1999
    Date of Patent: September 12, 2000
    Assignee: Texas Instruments Incorporated
    Inventors: Clessie A. Troxtell, Jr., Laura A. Hnilo, Michael L. Hayden, Charles M. Hess, Daniel R. Wikander, Lee A. Lewis