Patents by Inventor Michael L. Leggett

Michael L. Leggett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automated placement of vibration damping materials
    Patent number: 9199442
    Abstract: Damping material is installed on a structure by moving a material placement head over the structure, and using the head to place the material on the structure.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: December 1, 2015
    Assignee: THE BOEING COMPANY
    Inventors: Donald A. Anderson, Tuan Quang Cao, Michael L. Leggett, Anne E. Kyriakides
  • Automated Placement of Vibration Damping Materials
    Publication number: 20140311678
    Abstract: Damping material is installed on a structure by moving a material placement head over the structure, and using the head to place the material on the structure.
    Type: Application
    Filed: July 3, 2014
    Publication date: October 23, 2014
    Inventors: Donald A. Anderson, Tuan Quang Cao, Michael L. Leggett, Anne E. Kyriakides
  • Automated placement of vibration damping materials
    Patent number: 8425710
    Abstract: Damping material is installed on a structure by moving a material placement head over the structure, and using the head to place the material on the structure.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: April 23, 2013
    Assignee: The Boeing Company
    Inventors: Donald A. Anderson, Anne E. Parsons, Tuan Q. Cao, Michael L. Leggett
  • FILM ADHESIVE BONDING APPARATUS AND PROCESS
    Publication number: 20120276351
    Abstract: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.
    Type: Application
    Filed: July 6, 2012
    Publication date: November 1, 2012
    Applicant: THE BOEING COMPANY
    Inventors: Avrid J. Berg, Donald A. Anderson, Paul S. Gregg, Michael L. Leggett
  • Film adhesive bonding apparatus and process
    Patent number: 8241448
    Abstract: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: August 14, 2012
    Assignee: The Boeing Company
    Inventors: Avrid J. Berg, Donald A. Anderson, Paul S. Gregg, Michael L. Leggett
  • Automated Placement of Vibration Damping Materials
    Publication number: 20100230202
    Abstract: Damping material is installed on a structure by moving a material placement head over the structure, and using the head to place the material on the structure.
    Type: Application
    Filed: March 13, 2009
    Publication date: September 16, 2010
    Inventors: Donald A. Anderson, Anne E. Parsons, Tuan Q. Cao, Michael L. Leggett
  • FILM ADHESIVE BONDING APPARATUS AND PROCESS
    Publication number: 20080113191
    Abstract: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.
    Type: Application
    Filed: November 9, 2006
    Publication date: May 15, 2008
    Applicant: THE BOEING COMPANY
    Inventors: ARVID J. BERG, DONALD A. ANDERSON, PAUL S. GREGG, MICHAEL L. LEGGETT